Patents by Inventor Hiroshi Toyama
Hiroshi Toyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11844208Abstract: An apparatus includes a base structure having a first portion including a plurality of transistors and a second portion surrounding the first portion; a storage structure on the first portion of the base structure, the storage structure including a plurality of storage capacitors each coupled to a corresponding one of the plurality of transistors; an interface structure on the second portion of the base structure; and a peripheral structure on the interface structure; wherein the interface structure is divided into a plurality of insulating films and the plurality of insulating films are arranged away from each other to have a plurality of voids between the second portion of the base structure and the peripheral structure.Type: GrantFiled: February 23, 2022Date of Patent: December 12, 2023Assignee: Micron Technology, Inc.Inventors: Mitsunari Sukekawa, Hiroshi Toyama, Hiroyuki Uno, Yasutaka Okada
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Publication number: 20230294421Abstract: A drying unit includes a first contact heating unit provided inside a housing, and a second contact heating unit provided downstream in a transport direction from the first contact heating unit inside the housing. The first contact heating unit includes a first contact heating surface configured to come into contact with a back surface of a medium after printing. The second contact heating unit includes a second contact heating surface configured to come into contact with the back surface of the medium after printing. The first contact heating surface is curved to have a shape protruding in a direction opposite to the second contact heating surface, and the second contact heating surface is curved to have a shape protruding in a direction opposite to the first contact heating surface. The first contact heating surface has a radius of curvature larger than that of the second contact heating surface.Type: ApplicationFiled: March 17, 2023Publication date: September 21, 2023Inventors: Satoru KATAGAMI, Hiroshi TOYAMA, Yuichi WASHIO
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Publication number: 20230269932Abstract: An apparatus includes a base structure having a first portion including a plurality of transistors and a second portion surrounding the first portion; a storage structure on the first portion of the base structure, the storage structure including a plurality of storage capacitors each coupled to a corresponding one of the plurality of transistors; an interface structure on the second portion of the base structure; and a peripheral structure on the interface structure; wherein the interface structure is divided into a plurality of insulating films and the plurality of insulating films are arranged away from each other to have a plurality of voids between the second portion of the base structure and the peripheral structure.Type: ApplicationFiled: February 23, 2022Publication date: August 24, 2023Applicant: MICRON TECHNOLOGY, INC.Inventors: Mitsunari Sukekawa, Hiroshi Toyama, Hiroyuki Uno, Yasutaka Okada
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Patent number: 11267272Abstract: A printing apparatus includes a support portion configured to support a part of a printing medium to be transported, a heating portion configured to heat the part of the printing medium supported by the support portion, and a curved portion disposed upstream of the support portion in a transport path of the printing medium and including a curved surface that curves the transport path. The curved portion is formed of a member having a lower thermal conductivity than the support portion. In addition, the temperature of the curved portion is lower than the temperature of the support portion.Type: GrantFiled: June 4, 2020Date of Patent: March 8, 2022Assignee: Seiko Epson CorporationInventors: Hiroshi Toyama, Satoru Katagami
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Patent number: 11253954Abstract: The purpose of the present invention is to provide a method for measuring the inclination of a waterjet relative to a machine coordinate system of a laser machining device. The present invention provides a method for measuring the inclination of a waterjet of a laser machining device in which a laser beam that has been introduced and guided into a waterjet jetted from an optical head is moved relative to a workpiece fixed to a table so as to machine the workpiece, wherein measured is the inclination of the waterjet relative to the table which is within a stable-length range in which the laser beam passing through the inside of the waterjet can be reflected so as to advance in the axial direction.Type: GrantFiled: September 30, 2015Date of Patent: February 22, 2022Assignee: MAKINO MILLING MACHINE CO., LTD.Inventors: Hisashi Onodera, Nobuaki Igi, Hiroshi Toyama
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Patent number: 11211347Abstract: In some embodiments, a method of forming an opening in a material comprises forming RIM over target material. Radiation is impinged onto the RIM through a masking tool over a continuous area of the RIM under which a target-material opening will be formed. The masking tool during the impinging allows more radiation there-through onto a mid-portion of the continuous area of the RIM in a vertical cross-section than onto laterally-opposing portions of the continuous area of the RIM that are laterally-outward of the mid-portion of the RIM in the vertical cross-section. After the impinging, the RIM is developed to form a RIM opening that has at least one pair of laterally-opposing ledges laterally-outward of the mid-portion of the RIM in the vertical cross-section elevationally between a top and a bottom of the RIM opening.Type: GrantFiled: October 1, 2020Date of Patent: December 28, 2021Assignee: Micron Technology, Inc.Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
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Patent number: 11173727Abstract: A printing apparatus includes a printing portion that performs printing on a printing medium, a heating portion that heats the printing medium, which is performed downstream of the printing portion in transport of the printing medium, and a controller. The heating portion is disposed in a position facing a back surface, on which the printing is performed. The controller executes first control for putting the heating portion in a first state in which the heating portion is in contact with the back surface during a transport stop period, in which transport of the printing medium is stopped, and executes second control for putting the heating portion in a second state in which the heating portion contacts the back surface at a lower degree than in the first state during a transport period, in which the transport of the printing medium is performed.Type: GrantFiled: June 4, 2020Date of Patent: November 16, 2021Assignee: Seiko Epson CorporationInventors: Hiroshi Toyama, Satoru Katagami
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Patent number: 11148223Abstract: This laser processing machine, which moves a work piece, which is mounted on a table, and an optical head, which shines a laser light, relative to each other, and processes the work piece by irradiating the work piece with the laser light, is provided with: a calibration camera that is fixed to the optical head; a probe that is fixed to the optical head; and a calibration unit that has measurement reference points (Pc1, Pc2, Pc3, Pp1, Pp2, Pp3) for measuring the position of the calibration camera and the probe, and a processing portion that forms a processing mark (L1, L2) due to the laser light.Type: GrantFiled: January 30, 2015Date of Patent: October 19, 2021Assignee: MAKINO MILLING MACHINE CO., LTD.Inventors: Hiroshi Toyama, Muneaki Beppu
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Patent number: 11007603Abstract: This laser processing machine, which processes a work piece mounted on a table by irradiating the work piece with a laser light, is provided with: an optical head having a nozzle that sprays a liquid to form a columnar liquid flow and introducing a laser light into the nozzle and shining said light; and an alignment adjustment device having a reflector that is disposed so as to face the optical head and reflects the laser light, and a light-shielding portion around the portion of the reflector that reflects the laser light, and adjusting the position or orientation of introduction of the laser light into the columnar liquid flow.Type: GrantFiled: January 30, 2015Date of Patent: May 18, 2021Assignee: MAKINO MILLING MACHINE CO., LTD.Inventors: Hiroshi Toyama, Muneaki Beppu
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Patent number: 10943841Abstract: A substrate comprises a pair of immediately-adjacent integrated-circuit dies having scribe-line area there-between. At least one of the dies comprises insulting material above integrated circuitry. The insulating material has an opening therein that extends elevationally inward to an upper conductive node of integrated circuitry within the one die. The one die comprises a conductive line of an RDL above the insulating material. The RDL-conductive line extends elevationally inward into the opening and is directly electrically coupled to the upper conductive node. The insulating material has a minimum elevational thickness from an uppermost surface of the upper conductive node to an uppermost surface of the insulating material that is immediately-adjacent the insulating-material opening. Insulator material is above a conductive test pad in the scribe-line area. The insulator material has an opening therein that extends elevationally inward to an uppermost surface of the conductive test pad.Type: GrantFiled: March 26, 2020Date of Patent: March 9, 2021Assignee: Micron Technology, Inc.Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
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Publication number: 20210020592Abstract: In some embodiments, a method of forming an opening in a material comprises forming RIM over target material. Radiation is impinged onto the RIM through a masking tool over a continuous area of the RIM under which a target-material opening will be formed. The masking tool during the impinging allows more radiation there-through onto a mid-portion of the continuous area of the RIM in a vertical cross-section than onto laterally-opposing portions of the continuous area of the RIM that are laterally-outward of the mid-portion of the RIM in the vertical cross-section. After the impinging, the RIM is developed to form a RIM opening that has at least one pair of laterally-opposing ledges laterally-outward of the mid-portion of the RIM in the vertical cross-section elevationally between a top and a bottom of the RIM opening.Type: ApplicationFiled: October 1, 2020Publication date: January 21, 2021Applicant: Micron Technology, Inc.Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
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Publication number: 20200384781Abstract: A printing apparatus includes a support portion configured to support a part of a printing medium to be transported, a heating portion configured to heat the part of the printing medium supported by the support portion, and a curved portion disposed upstream of the support portion in a transport path of the printing medium and including a curved surface that curves the transport path. The curved portion is formed of a member having a lower thermal conductivity than the support portion. In addition, the temperature of the curved portion is lower than the temperature of the support portion.Type: ApplicationFiled: June 4, 2020Publication date: December 10, 2020Inventors: Hiroshi TOYAMA, Satoru KATAGAMI
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Publication number: 20200384780Abstract: A printing apparatus includes a printing portion that performs printing on a printing medium, a heating portion that heats the printing medium, which is performed downstream of the printing portion in transport of the printing medium, and a controller. The heating portion is disposed in a position facing a back surface, on which the printing is performed. The controller executes first control for putting the heating portion in a first state in which the heating portion is in contact with the back surface during a transport stop period, in which transport of the printing medium is stopped, and executes second control for putting the heating portion in a second state in which the heating portion contacts the back surface at a lower degree than in the first state during a transport period, in which the transport of the printing medium is performed.Type: ApplicationFiled: June 4, 2020Publication date: December 10, 2020Inventors: Hiroshi TOYAMA, Satoru KATAGAMI
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Patent number: 10847482Abstract: In some embodiments, a method of forming an opening in a material comprises forming RIM over target material. Radiation is impinged onto the RIM through a masking tool over a continuous area of the RIM under which a target-material opening will be formed. The masking tool during the impinging allows more radiation there-through onto a mid-portion of the continuous area of the RIM in a vertical cross-section than onto laterally-opposing portions of the continuous area of the RIM that are laterally-outward of the mid-portion of the RIM in the vertical cross-section. After the impinging, the RIM is developed to form a RIM opening that has at least one pair of laterally-opposing ledges laterally-outward of the mid-portion of the RIM in the vertical cross-section elevationally between a top and a bottom of the RIM opening.Type: GrantFiled: May 16, 2018Date of Patent: November 24, 2020Assignee: Micron Technology, Inc.Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
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Publication number: 20200227327Abstract: A substrate comprises a pair of immediately-adjacent integrated-circuit dies having scribe-line area there-between. At least one of the dies comprises insulting material above integrated circuitry. The insulating material has an opening therein that extends elevationally inward to an upper conductive node of integrated circuitry within the one die. The one die comprises a conductive line of an RDL above the insulating material. The RDL-conductive line extends elevationally inward into the opening and is directly electrically coupled to the upper conductive node. The insulating material has a minimum elevational thickness from an uppermost surface of the upper conductive node to an uppermost surface of the insulating material that is immediately-adjacent the insulating-material opening. Insulator material is above a conductive test pad in the scribe-line area. The insulator material has an opening therein that extends elevationally inward to an uppermost surface of the conductive test pad.Type: ApplicationFiled: March 26, 2020Publication date: July 16, 2020Applicant: Micron Technology, Inc.Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
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Patent number: 10651100Abstract: A substrate comprises a pair of immediately-adjacent integrated-circuit dies having scribe-line area there-between. At least one of the dies comprises insulting material above integrated circuitry. The insulating material has an opening therein that extends elevationally inward to an upper conductive node of integrated circuitry within the one die. The one die comprises a conductive line of an RDL above the insulating material. The RDL-conductive line extends elevationally inward into the opening and is directly electrically coupled to the upper conductive node. The insulating material has a minimum elevational thickness from an uppermost surface of the upper conductive node to an uppermost surface of the insulating material that is immediately-adjacent the insulating-material opening. Insulator material is above a conductive test pad in the scribe-line area. The insulator material has an opening therein that extends elevationally inward to an uppermost surface of the conductive test pad.Type: GrantFiled: May 16, 2018Date of Patent: May 12, 2020Assignee: Micron Technology, Inc.Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
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Patent number: 10525738Abstract: A printing apparatus includes a drying unit that includes a bring-in port where a medium is brought in and a bring-out port where the medium is brought out, and dries ink applied onto the medium, and in a case in which printing is temporarily stopped and a predetermined maintenance work is performed, the medium is transported in a transporting direction which is a direction toward the bring-out port from the bring-in port in a maintenance work period from starting of the maintenance work to finishing of the maintenance work or in a partial period of the maintenance work period.Type: GrantFiled: February 14, 2018Date of Patent: January 7, 2020Assignee: Seiko Epson CorporationInventors: Satoru Katagami, Yuichi Washio, Hiroshi Toyama
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Publication number: 20190355631Abstract: A substrate comprises a pair of immediately-adjacent integrated-circuit dies having scribe-line area there-between. At least one of the dies comprises insulting material above integrated circuitry. The insulating material has an opening therein that extends elevationally inward to an upper conductive node of integrated circuitry within the one die. The one die comprises a conductive line of an RDL above the insulating material. The RDL-conductive line extends elevationally inward into the opening and is directly electrically coupled to the upper conductive node. The insulating material has a minimum elevational thickness from an uppermost surface of the upper conductive node to an uppermost surface of the insulating material that is immediately-adjacent the insulating-material opening. Insulator material is above a conductive test pad in the scribe-line area. The insulator material has an opening therein that extends elevationally inward to an uppermost surface of the conductive test pad.Type: ApplicationFiled: May 16, 2018Publication date: November 21, 2019Applicant: Micron Technology, Inc.Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
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Publication number: 20190355682Abstract: In some embodiments, a method of forming an opening in a material comprises forming RIM over target material. Radiation is impinged onto the RIM through a masking tool over a continuous area of the RIM under which a target-material opening will be formed. The masking tool during the impinging allows more radiation there-through onto a mid-portion of the continuous area of the RIM in a vertical cross-section than onto laterally-opposing portions of the continuous area of the RIM that are laterally-outward of the mid-portion of the RIM in the vertical cross-section. After the impinging, the RIM is developed to form a RIM opening that has at least one pair of laterally-opposing ledges laterally-outward of the mid-portion of the RIM in the vertical cross-section elevationally between a top and a bottom of the RIM opening.Type: ApplicationFiled: May 16, 2018Publication date: November 21, 2019Applicant: Micron Technology, Inc.Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
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Patent number: 10271782Abstract: A suction drain device of a disclosed liquid collecting apparatus actively pushes and pulls blood. This achieves liquid collection at high speed even under decreased pressure depending on a physiological state of an animal. Moreover, the liquid collecting apparatus includes a first flow path and a second flow path having a given length. Accordingly, the flow path with a given length set in advance and thus a known volume allows collection of a given amount volume of blood without measuring a length and an amount of blood using a volume measuring device. Accordingly, no need of the measuring device allows reduction in size of the liquid collecting apparatus. Consequently, the liquid collecting apparatus can be installed adjacent to the animal to achieve reduction in dead volume. Moreover, blood is flown to a fourth flow path branched with a connecting terminal, and is also flown to the second flow path branched with a connecting terminal.Type: GrantFiled: September 3, 2012Date of Patent: April 30, 2019Assignees: SHIMADZU CORPORATION, NATIONAL INSTITUTES FOR QUANTUM AND RADIOLOGICAL SCIENCE AND TECHNOLOGY, NATIONAL CENTER FOR GERIATRICS AND GERONTOLOGYInventors: Nobuya Hashizume, Keishi Kitamura, Takahiro Nishimoto, Yuichi Kimura, Hiroshi Toyama, Takashi Yamada