Patents by Inventor Hiroshi Wada

Hiroshi Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020185927
    Abstract: Cup ring 8 and holding-plate 11, disposed at each side of front bracket 7, sandwich tightly an outer ring of front ball-bearing 10 in order to prevent creep between a bearing housing and the outer ring. A thickness of bearing shim 12 is adjusted such that an axial clearance between the front ball-bearing and a rear ball-bearing falls within a range from 0.02 to 0.1 mm. Holding plate 11 is temporarily fixed to a given place of motor shaft 1, then screwed down thereto with screw 14, so that plate 11 moves and solidly contacts with the outer ring of front ball bearing 10. An outer diameter of shaft 1 extending between the given place and bearing 10 is smaller than a center hole of holding plate 11, thus plate 11 does not touch shaft 1.
    Type: Application
    Filed: March 7, 2002
    Publication date: December 12, 2002
    Inventors: Yukio Chihara, Mizuo Komine, Hiroshi Kitamura, Takeshi Hashimoto, Hiroshi Wada
  • Publication number: 20020178407
    Abstract: To generate a command for dealing with error message from accumulated information and transmit the command to information processing as transmission place, a process analyzes error message received by a communication process, searches file based on analysis of the error message, and searches file based on search, to acquire related message. A process analyzes the error message and the related message, and searches file in which contents of recovery operation generated in process have been accumulated, for information whose recover operation condition is in agreement with the analyzed information. A process displays the contents of searched information on display. A process generates command based on recovery operation corresponding to recovery operation method selected by a keyboard or a mouse, and on the error message and the related message by process. The communication process transmits the generated command to information processor unit.
    Type: Application
    Filed: January 25, 2002
    Publication date: November 28, 2002
    Inventors: Atsushi Ueoka, Tsutomu Ito, Tadashi Yamagishi, Hiroshi Wada, Keiichi Shiobara, Takashi Matsumoto, Yoji Kawashima
  • Patent number: 6474824
    Abstract: There is provided a surface-emitting device, such as a front light, in which visibility is not deteriorated even when a point light source, such as a light-emitting diode, is used. A surface-emitting device 20 forming a front light includes point light sources 21, such as light-emitting diodes, a transmissive light guide plate 22 made of acrylic resin, polycarbonate resin, or the like by injection molding or by other methods, a transmissive light-scattering plate 23 bonded onto an end face 22d of the light guide plate 22 opposite from the side of an end face 22c where the point light sources 21 are placed, and a reflection plate 24 bonded onto the surface of the light-scattering plate 23.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: November 5, 2002
    Assignee: Seiko Epson Corporation
    Inventor: Hiroshi Wada
  • Patent number: 6440553
    Abstract: A pressure-sensitive adhesive composition, wherein the storage elastic modulus [G′] at room temperature is at least 2×106 dyne/cm2 and the adhesive strength at room temperature is 1 kg/20 mm width or higher. Preferably, a pressure-sensitive adhesive composition comprising a polymer having a polycarbonate structure having a repeating unit represented by the following formula wherein R represents a straight chain or branched hydrocarbon group having from 2 to 20 carbon atoms, a pressure-sensitive adhesive sheet, a sealing material, a reinforcing sheet, and a pressure-sensitive sheet for printing, each having the pressure-sensitive adhesive composition.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: August 27, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka, Makoto Kojima, Shin-ichi Kouno, Hiroaki Mashiko, Hiroshi Wada, Hiroshi Yamamoto, Yoshikazu Soeda, Naoki Matsuoka, Katsuya Kume, Mitsuo Kuramoto
  • Patent number: 6439447
    Abstract: When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: August 27, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa, Makoto Akita, Kenji Okamoto, Shinzo Eguchi, Yasuhiro Kametani
  • Patent number: 6429852
    Abstract: The device comfortably supports the hand of the user while the thumb and fingers are associated with keys, a trackball, and a scrolling wheel carried on the device. The overall configuration of the device and the arrangement of these actuators permits the user to operate all of the functions provided by the actuators while the forearm is in a neutral posture zone between pronation and supination of the forearm, and the wrist and fingers are minimally extended and comfortably flexed, respectively.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: August 6, 2002
    Assignee: Microsoft Corporation
    Inventors: Aditha M. Adams, Steven T. Kaneko, Carl J. Ledbetter, Hugh Edward McLoone, Jr., Stanley Hiroshi Wada, John Richard Arbak, Edward V. Cruz
  • Patent number: 6387746
    Abstract: A mask layer is formed on a semiconductor substrate such that an elongate opening of the mask layer extends lengthwise at an angle relative to a [011] direction of the semiconductor substrate. A ridge waveguide structure including an active layer is formed within the elongate opening on the semiconductor substrate by a selective growth method using the mask layer as a mask. The mask layer is then removed, and a clad layer is formed over the ridge waveguide structure.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: May 14, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Yukio Katoh, Hiroshi Wada, Keizo Takemasa
  • Publication number: 20020008132
    Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.
    Type: Application
    Filed: September 28, 2001
    Publication date: January 24, 2002
    Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa
  • Publication number: 20020002634
    Abstract: A controller connected to computers analyzes messages from the computers and converts the analyzed messages into a different format. The controller also generates correspondence information for the message.
    Type: Application
    Filed: June 20, 2001
    Publication date: January 3, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Atsushi Ueoka, Tsutomu Ito, Manabu Demoto, Tadashi Yamagishi, Hiroshi Wada, Takashi Matsumoto, Takashi Nomura
  • Patent number: 6321973
    Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined, with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: November 27, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa
  • Patent number: 6313060
    Abstract: A resilient polyurethane foam produced by using a polyether polyol produced by reacting alkylene oxides with a polyhydroxy compound having at least 2 hydroxyl groups as an initiator in the presence of the catalyst for alkylene oxide ring-opening polymerization of the present invention, which is excellent in foam physical properties, vibration characteristics and molding properties.
    Type: Grant
    Filed: March 8, 2000
    Date of Patent: November 6, 2001
    Assignee: Asahi Glass Company, Limited
    Inventors: Kayoko Sugiyama, Hiroki Fukuda, Akio Horie, Hiroshi Wada
  • Publication number: 20010036697
    Abstract: A method of fabricating a semiconductor laser diode includes forming a mask layer on a semiconductor substrate and forming a ridge waveguide structure including an active layer on the semiconductor substrate by selective growth method using the mask layer. The mask layer is formed to be along a direction with an angle to [011] direction of the semiconductor substrate.
    Type: Application
    Filed: March 5, 2001
    Publication date: November 1, 2001
    Inventors: Yukio Katoh, Hiroshi Wada, Keizo Takemasa
  • Publication number: 20010021451
    Abstract: A pressure-sensitive adhesive composition, wherein the storage elastic modulus [G′] at room temperature is at least 2×106 dyne/cm2 and the adhesive strength at room temperature is 1 kg/20 mm width or higher.
    Type: Application
    Filed: January 31, 2001
    Publication date: September 13, 2001
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka, Makoto Kojima, Shin-Ichi Kouno, Hiroaki Mashiko, Hiroshi Wada, Hiroshi Yamamoto, Yoshikazu Soeda, Naoki Matsuoka, Katsuya Kume, Mitsuo Kuramoto
  • Patent number: 6218006
    Abstract: A pressure-sensitive adhesive composition, wherein the storage elastic modulus [G′] at room temperature is at least 2×106 dyne/cm2 and the adhesive strength at room temperature is 1 kg/20 mm width or higher. Preferably, a pressure-sensitive adhesive composition comprising a polymer having a polycarbonate structure having a repeating unit represented by the following formula wherein R represents a straight chain or branched hydrocarbon group having from 2 to 20 carbon atoms, a pressure-sensitive adhesive sheet, a sealing material, a reinforcing sheet, and a pressure-sensitive sheet for printing, each having the pressure-sensitive adhesive composition.
    Type: Grant
    Filed: September 15, 1997
    Date of Patent: April 17, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka, Makoto Kojima, Shin-ichi Kouno, Hiroaki Mashiko, Hiroshi Wada, Hiroshi Yamamoto, Yoshikazu Soeda, Naoki Matsuoka, Katsuya Kume, Mitsuo Kuramoto
  • Patent number: 6122479
    Abstract: In a fixing device for an image forming apparatus, a heat roller includes a hollow cylindrical base, a heating layer formed of strip-like fibers implementing desired power consumption, and a parting layer provided on the outer periphery of the heating layer with the intermediary of an electrical insulating layer. The strip-like fibers of the heating layer are wound on the base and provided with a preselected resistance.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: September 19, 2000
    Assignee: Ricoh Company
    Inventors: Takashi Fujita, Hiroshi Wada, Shigeharu Nakamura
  • Patent number: 6108906
    Abstract: In a fixing device for an image forming apparatus, a heat roller includes a hollow cylindrical base, a heating layer formed of strip-like fibers implementing desired power consumption, and a parting layer provided on the outer periphery of the heating layer with the intermediary of an electrical insulating layer. The strip-like fibers of the heating layer are wound on the base and provided with a preselected resistance.
    Type: Grant
    Filed: August 26, 1999
    Date of Patent: August 29, 2000
    Assignee: Ricoh Company, Ltd.
    Inventors: Takashi Fujita, Hiroshi Wada, Shigeharu Nakamura
  • Patent number: 6072394
    Abstract: The present invention provides a resonance circuit tag that comprises an insulating substrate and a resonance circuit formed on the substrate. Additionally, the resonance circuit contains at least a capacitor and an inductor. Further, a dielectric of the capacitor satisfies at least either being foamable by heating or being capable of changing its thickness by not less than 10% by heating. The resonance circuit of the present invention also provides various advantages in that it can easily cease functioning, it does not inhibit labor-saving and speedy operation at the cash register, it facilitates large-scale production, and it eliminates degradation of the function of the article to which the tag has been attached.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: June 6, 2000
    Assignee: Nitto Denko Corporation
    Inventors: Yoshitsugu Hasegawa, Hiroshi Yamamoto, Hiroshi Wada, Toshiharu Konishi, Naoki Matsuoka
  • Patent number: 6042933
    Abstract: Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.
    Type: Grant
    Filed: August 13, 1998
    Date of Patent: March 28, 2000
    Assignees: Hitachi Chemical Company, Ltd., Technopolis Hakodata Industrial Technology Promotion Organization
    Inventors: Keizo Hirai, Hiroshi Wada, Akihiro Sasaki, Hisashi Kaga, Junichi Kikuchi, Shozo Yamana, Hideji Kuwajima
  • Patent number: 6031518
    Abstract: The device comfortably supports the hand of the user while the thumb and fingers are associated with keys, a trackball, and a scrolling wheel carried on the device. The overall configuration of the device and the arrangement of these actuators permits the user to operate all of the functions provided by the actuators while the forearm is in a neutral posture zone between pronation and supination of the forearm, and the wrist and fingers are minimally extended and comfortably flexed, respectively.
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: February 29, 2000
    Assignee: Microsoft Corporation
    Inventors: Aditha M. Adams, Steven T. Kaneko, Carl J. Ledbetter, Hugh Edward McLoone, Jr., Stanley Hiroshi Wada, John Richard Arbak, Edward V. Cruz
  • Patent number: 6027109
    Abstract: A document feeder to be mounted atop an image reading device having a stationary optical system disposed under a contact glass. The document feeder includes a document original plate for holding thereon document originals, a document original feeding mechanism for feeding a document original from the document original plate onto a contact glass, a document original transporting mechanism for transporting the document original fed by the document original feeding mechanism along the upper surface of the contact glass, a document original discharging mechanism for discharging the document original transported by the document original transporting mechanism, and a document original discharge plate for receiving the document original discharged by the document original discharging mechanism. The document original feeding mechanism, the document original transporting mechanism and the document original discharging mechanism are integrally supported in a unit body to constitute a single unit.
    Type: Grant
    Filed: November 12, 1997
    Date of Patent: February 22, 2000
    Assignee: Mita Industrial Co., Ltd.
    Inventors: Hiroshi Wada, Mitsuharu Yoshimoto, Sinji Yamamoto, Tadahiro Kiyosumi, Junichi Inada, Susumu Hanano, Takeshi Sakaguchi, Susumu Takehara