Patents by Inventor Hirotaka Okamoto

Hirotaka Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060217476
    Abstract: A polylactic acid composition containing polylactic acid and ester-based plasticizer, wherein a content of the ester-based plasticizer is 16 to 33 wt %, and when the composition is highly deformed by stress loading as the relation between the stress and the deformation deviates from linear viscoelastic behavior and thereafter the stress is released, residual deformation measured after the stress is released is not less than 66.0% after 0.2 minute of the stress release, and is not more than 34.0% after 240 hours of the stress release.
    Type: Application
    Filed: March 24, 2006
    Publication date: September 28, 2006
    Applicant: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Hirotaka Okamoto, Yoshihide Katagiri, Mitsuru Nakano, Arimitsu Usuki
  • Patent number: 7084192
    Abstract: The polylactic acid composite material of the present invention comprises a polylactic acid, a low molecular weight compound which has an amide group, and a layered clay mineral that is organically modified by means of an organic onium salt. As a result, a polylactic acid composite material that has a sufficiently rapid crystallization rate, and that is superior in terms of heat resistance, moldability and mold release characteristics can be obtained.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: August 1, 2006
    Assignees: Kabushiki Kaisha Toyota Chuo Kankyusho, Toyota Jidosha Kabushiki Kaisha
    Inventors: Makoto Ouchi, Hirotaka Okamoto, Mitsuru Nakano, Hisato Takeuchi, Arimitsu Usuki, Takeshi Kanamori, Hiroshi Urayama, Hisashi Okuyama, Takashi Inou, Yasumitsu Isobe
  • Publication number: 20060142505
    Abstract: An aliphatic polyester composition contains a low-molecular-weight aliphatic polyester having weight-average molecular weight of 5000 to 35000 and a high-molecular-weight aliphatic polyester having weight-average molecular weight of 120000 to 1000000.
    Type: Application
    Filed: December 27, 2005
    Publication date: June 29, 2006
    Applicants: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kazuhiko Umemoto, Hirotaka Okamoto, Mitsuru Nakano, Arimitsu Usuki, Yuichi Miyake, Masatoshi Matsuda
  • Patent number: 6821464
    Abstract: A process for producing a polymer/filler composite material includes a mixture forming step in which there is obtained a mixture of a flake-like filler and a polymer material, and the mean area (L2), mean thickness (d) and volume fraction (c) of the flake-like filler in the mixture satisfy the following equations (1), (2) and (3): 500 nm2≦L2≦100 &mgr;m2  (1) d≦L/20  (2) 0.2d/L≦c≦4d/L  (3), and a deforming step of applying deformation to the mixture at a strain rate of no greater than 10 s−1.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: November 23, 2004
    Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho
    Inventors: Hirotaka Okamoto, Naoki Hasegawa, Arimitsu Usuki, Makoto Kato, Masami Okamoto
  • Patent number: 6777453
    Abstract: The object of the present invention is to provide a method of reclaiming crosslinked rubber wherein a reduction of qualities due to generation of decomposed products hardly occurs, and a molding of reclaimed rubber. In a reclamation step of reclaiming crosslinked rubber 10 by applying shear stress thereto and/or in a subsequent step in the present invention, a degasification carrier is introduced and decomposed products in the crosslinked rubber 10 are removed together with the degasification carrier. Also the disclosed is a molding of reclaimed rubber prepared by re-crosslinking reclaimed rubber obtained by this method.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: August 17, 2004
    Assignees: Kabushiki Kaisha Toyota Chuo Kenyusho, Toyoda Gosei Co., Ltd., Toyota Jidosha Kabushiki Kaisha
    Inventors: Mitsumasa Matsushita, Makoto Mouri, Hirotaka Okamoto, Kenzo Fukumori, Norio Sato, Toru Yoshida, Masahito Fukuta, Hidenobu Honda, Katsumi Nakashima, Tamotsu Watanabe, Yasuyuki Suzuki, Masao Owaki
  • Publication number: 20040054051
    Abstract: The polylactic acid composite material of the present invention comprises a polylactic acid, a low molecular weight compound which has an amide group, and a layered clay mineral that is organically modified by means of an organic onium salt. As a result, a polylactic acid composite material that has a sufficiently rapid crystallization rate, and that is superior in terms of heat resistance, moldability and mold release characteristics can be obtained.
    Type: Application
    Filed: July 15, 2003
    Publication date: March 18, 2004
    Applicants: Kabushiki Kaisha Toyota Chuo Kenkyusho, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Makoto Ouchi, Hirotaka Okamoto, Mitsuru Nakano, Hisato Takeuchi, Arimitsu Usuki, Takeshi Kanamori, Hiroshi Urayama, Hisashi Okuyama, Takashi Inou, Yasumitsu Isobe
  • Patent number: 6632918
    Abstract: The object of the present invention is to provide a method of reclaiming crosslinked rubber, which can reclaim various kinds of crosslinked rubbers whose reclamation is difficult. The method of reclaiming crosslinked rubber 10 of the present invention includes a step of reclaiming crosslinked rubber by applying shear stress to the crosslinked rubber 10, wherein the maximum pressure in the reclaiming step is 1.5 MPa or more.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: October 14, 2003
    Assignees: Kabushiki Kaisha Toyota Chuo Kenkyusho, Toyoda Gosei Co., Ltd., Toyota Jidosha Kabushiki Kaisha
    Inventors: Mitsumasa Matsushita, Makoto Mouri, Hirotaka Okamoto, Kenzo Fukumori, Norio Sato, Masahito Fukuta, Hidenobu Honda, Katsumi Nakashima, Tamotsu Watanabe, Shigeki Otsuka, Masao Owaki
  • Publication number: 20030149156
    Abstract: A process for producing a polymer/filler composite material includes a mixture forming step in which there is obtained a mixture of a flake-like filler and a polymer material, and the mean area (L2), mean thickness (d) and volume fraction (c) of the flake-like filler in the mixture satisfy the following equations (1), (2) and (3):
    Type: Application
    Filed: May 29, 2002
    Publication date: August 7, 2003
    Applicant: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Hirotaka Okamoto, Naoki Hasegawa, Arimitsu Usuki, Makoto Kato, Masami Okamoto
  • Patent number: 6472460
    Abstract: Polymeric composites may be produced by a process comprising melt-kneading an organophilic clay and a polymer at an average reduced pressure of at 5×104 Pa, a maximum reduced pressure of at least 1×105 Pa, and a total shear strain between 105 and 107, and/or a total shear energy per unit volume falling between 1010 and 1014 Pa. Polymeric composites produced under these conditions may have 50% or more of the entire layers of the layered organophilic clay dispersed as monolayers.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: October 29, 2002
    Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho
    Inventors: Hirotaka Okamoto, Makoto Kato, Naoki Hasegawa, Arimitsu Usuki, Norio Sato
  • Patent number: 6438826
    Abstract: A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: August 27, 2002
    Assignee: Towa Corporation
    Inventors: Shinji Takase, Hirotaka Okamoto, Michio Osada, Kouichi Araki
  • Patent number: 6436331
    Abstract: A resin sealing method for sealing a gap between a substrate and a semiconductor chip mounted thereon includes the following steps: applying a predetermined amount of resin at and along the circumference of the semiconductor chip in such a manner so as to maintain a space between the resin and a side face of the semiconductor chip; reducing the pressure of the atmosphere around the substrate to exhaust air from the gap; reducing the viscosity of the applied resin to partially fill the gap with resin, thereby leaving a closed cavity reduced in pressure; pressurizing the atmosphere around the substrate to compress the closed cavity due to the pressure difference from the surrounding atmosphere to entirely fill the gap with resin. The exhausting of the air is very stable, and a concentration of resin at the corner of the semiconductor chip can be suppressed, thereby avoiding the spattering of resin onto the top of the chip.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: August 20, 2002
    Assignees: Towa Corporation, Kabushiki Kaisha Toshiba
    Inventors: Takaki Kuno, Hirotaka Okamoto, Shoji Yamamoto, Teikou Odashima
  • Patent number: 6316508
    Abstract: The present invention provides a rubber composition containing a reclaimed rubber and a method for producing the same. A rubber molded article having excellent rubber properties can be obtaining and the recycling of a used rubber product can be promoted by the present invention. A rubber composition of the present invention is a blend comprising a reclaimed rubber obtained by applying a heat and a shear stress to a vulcanized rubber, a non-vulcanized virgin rubber or/and a thermoplastic resin, wherein the reclaimed rubber contains 40% by weight or more of a residual toluene-insoluble gel component and the network chain density of the rubber in the component is 1/20 to 1/4 based on the network chain density of the rubber of the vulcanized rubber.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: November 13, 2001
    Assignees: Kabushiki Kaisha Toyota Chuo Kenkyusho, Toyota Jidosha Kabushiki Kaisha, Toyoda Gosei Co., Ltd.
    Inventors: Mitsumasa Matsushita, Makoto Mouri, Hirotaka Okamoto, Norio Sato, Yasuyuki Suzuki, Masao Owaki, Noriyuki Suzuki, Katsumi Nakashima, Hidenobu Honda, Toru Yoshida, Katsumasa Takeuchi
  • Publication number: 20010013424
    Abstract: A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.
    Type: Application
    Filed: February 5, 2001
    Publication date: August 16, 2001
    Inventors: Shinji Takase, Hirotaka Okamoto, Michio Osada, Kouichi Araki
  • Patent number: 6207723
    Abstract: The present invention provides a rubber composition containing a reclaimed rubber and a method for producing the same. A rubber molded article having excellent rubber properties can be obtained and the recycling of a used rubber product can be promoted by the present invention. A rubber composition of the present invention is a blend comprising a claimed rubber obtained by applying a heat and a shear stress to a vulcanized rubber, a non-vulcanized virgin rubber or/and a thermoplastic resin, wherein the reclaimed rubber contains 40% by weight or more of a residual toluene-insoluble gel component and the network chain density of the rubber in the gel component is 1/20 to 1/4 based on the network chain density of the rubber of the vulcanized rubber.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: March 27, 2001
    Assignees: Kabushiki Kaisha Toyota Chuo Kenkyusho, Toyota Jidosha Kabushiki Kaisha, Toyoda Gosei Co., Ltd.
    Inventors: Mitsumasa Matsushita, Makoto Mouri, Hirotaka Okamoto, Norio Sato, Yasuyuki Suzuki, Masao Owaki, Noriyuki Suzuki, Katsumi Nakashima, Hidenobu Honda, Toru Yoshida, Katsumasa Takeuchi
  • Patent number: 6178156
    Abstract: The dynamic damper for use in the disk recording and reproduction apparatus of the present invention is provided with a cylindrical weight sandwiched between a pair of gel members, a rod secured to the weight is inserted into through holes formed in the gel members disposed on both sides of the weight, and the weight is supported by a holder via the gel members. Since the holder is installed on the substrate of the disk recording and reproduction apparatus so that the center axis of the weight is orthogonal to the movement direction of the optical pickup thereof, the head positioning accuracy in the disk recording and reproduction apparatus can be improved, whereby the disk recording and reproduction apparatus can have an excellent vibration damping effect during disturbance vibration.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: January 23, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Kuwajima, Hirotaka Okamoto
  • Patent number: 6117932
    Abstract: The resin composite of this invention comprises an organophilic clay and a polymer. The polymer is formed of two or more polymers at least one of which has a functional group, or the polymer is formed of a copolymer having a functional group. This structure provides the resin composite which can be easily made composite with a wide range of applications, and imparts the optimum physical properties to the composite.
    Type: Grant
    Filed: September 17, 1998
    Date of Patent: September 12, 2000
    Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho
    Inventors: Naoki Hasegawa, Hirotaka Okamoto, Masaya Kawasumi, Arimitsu Usuki, Akane Okada