Abstract: A damage evaluation device for a press-forming die includes: evaluation dies installed in a pressing device configured to press-form a metal material; and an observation device configured to observe damage behavior of a die steel material and surface coating constituting the evaluation dies. The evaluation dies include: a perforating unit configured to form a hole in the metal material; a first shearing unit configured to shear the metal material in which the hole is formed into a predetermined metal component shape; and a second shearing unit configured to separate a metal component from the metal material, and dies of the perforating unit, the first shearing unit and the second shearing unit are formed of the die steel material and have a structure that enables replacement with another die made of predetermined material and applied with predetermined surface coating treatment.

Abstract: Provided is a particle-immobilized substrate that can be easily produced and has inorganic nanoparticles present in a nanometer-scale region. Also provided is a method for easily producing a substrate in which nanoparticles are arranged in a nanometer-scale region on a solid surface. A particle-immobilized substrate 1 includes a substrate 2 and a plurality of inorganic nanoparticles 3 disposed on the substrate 2, in which the plurality of inorganic nanoparticles 3 is disposed in contact with each other in a region having a width (D1) of 1 ?m or less on the substrate 2.

Abstract: According to one embodiment, a semiconductor device includes an insulating substrate, a first metal layer on the insulating substrate, a first insulating layer on the insulating substrate and the first metal layer, a semiconductor layer on the first insulating layer, a second insulating layer on the semiconductor layer and the first insulating layer, a second metal layer on the second insulating layer, and a first electrode and a second electrode which are electrically connected to the semiconductor layer. The first metal layer overlaps the second metal layer. A third metal layer contacts a top surface of the second metal layer and a top surface of the first metal layer.

Abstract: There are provided a mounted structure from which such a mounted structure can be obtained that is excellent in precision with little joining deviation and can be efficiently produced, an LED display, and a mounting method. A mounted structure is provided in which a semiconductor element including a terminal is mounted on a substrate including an electrode. The mounted structure includes a joining portion in which the terminal and the electrode are joined opposing each other. The electrode is a bump of a bulk metal material disposed on the substrate. The joining portion is produced by thermally fusing metal nanoparticles, the metal nanoparticles being deposited from a metal complex by laser irradiation, the metal complex having been transferred onto at least one of the electrode or the terminal by using a microcontact printing method.

Abstract: A punch and a pad sandwiching a top sheet portion, bending blades for bend-forming the vertical wall portions, and stoppers facing the bending blades are provided. The punch is supported by a first cushion component. The bending blades each have an upper die component and a lower die component disposed facing each other in the press direction with an interval equal to a set compression amount in the range of 2% or more and 6% or less of the heights of the vertical wall portions and a second cushion component interposed between the upper die component and the lower die component, maintaining the interval, and contractible in the press direction. The cushion pressure of the second cushion component is lower than the cushion pressure of the first cushion component and has such cushion pressure that the second cushion component does not contract during the bend-forming of the vertical wall portions.

Abstract: There are provided a mounted structure that is excellent in precision with little joining deviation and can be efficiently produced, an LED display, and a mounting method. There are provided a mounted structure, an LED display including the mounted structure, and a manufacturing method for mounting a semiconductor element on a substrate. The mounted structure is a structure in which the semiconductor element including a terminal is mounted on the substrate including an electrode. The mounted structure includes a joining portion that joins the terminal and the electrode to make the terminal and the electrode oppose each other, the electrode is a bump of a bulk metal material disposed on the substrate, and the joining portion is obtained by thermally fusing metal nanoparticles in ink containing the metal nanoparticles transferred onto at least one of the electrode or the terminal by using a microcontact printing method.

Abstract: A press forming technology capable of reducing forming defects in a formed component having a hat-shaped cross-sectional shape and including a shape curved to protrude toward a flange portion in a side view. The technology includes a first forming step of press forming a metal sheet into an intermediate formed product that includes a wavy shape including uneven shapes continuous along a longitudinal direction in vertical wall portion and flange portion forming positions, an amplitude of the uneven shapes in a sheet thickness direction increasing toward a position corresponding to a boundary between the portions, and a second forming step of performing bending on the intermediate formed product. A longitudinal line length at the position corresponding to the boundary between the portions in the intermediate formed product is set to coincide with or approach a longitudinal line length at the boundary between the portions in the press-formed component shape.

Abstract: To reduce warping of vertical wall portions without causing buckling during pressing. Press-forming into a hat cross-sectional shape having one linear vertical wall portion and the other curved vertical wall portion and not having a flange portion is performed. A punch and a pad sandwiching a top sheet portion therebetween, bending blades for bend-forming the vertical wall portions, and stoppers facing the bending blades are provided. The punch is supported by a first cushion component. The bending blades each have an upper die component and a lower die component disposed facing each other in the press direction with an interval (D) equal to a set compression amount in the range of 2% or more and 6% or less of the heights of the vertical wall portions and a second cushion component interposed between the upper die component and the lower die component, maintaining the interval (D), and contractible in the press direction.

Abstract: A method includes press forming a metal sheet into an intermediate formed product bent out of a plane and forming into a desired press-formed component shape. In a region to be a flange portion, an angle to be bent out of the plane is equal to or less than an angle formed by the flange portion at the curved portion in the press-formed component shape. The projection portion has a largest projection height at the center portion in the longitudinal direction of the region to be the curved portion as seen in the side view, and a longitudinal length of a region to be the top sheet portion is set to coincide with or approach a longitudinal length of the top sheet portion in the press-formed component shape.

Abstract: A shearing die for preventing damage of a die tool in shearing of a super-high-tension steel sheet and a press-forming method using the same. The shearing die for shearing a metal sheet in a direction intersecting a first-sheared edge of the metal sheet in press-working including a plurality of shearing processes to produce a formed article from the metal sheet by press-forming, in which the shearing die comprises a fitting part that can detach a shearing blade in the vicinity of a region coming in contact with an end of the first-sheared edge.

Abstract: According to one embodiment, a semiconductor device includes an insulating substrate, a first metal layer on the insulating substrate, a first insulating layer on the insulating substrate and the first metal layer, a semiconductor layer on the first insulating layer, a second insulating layer on the semiconductor layer and the first insulating layer, a second metal layer on the second insulating layer, and a first electrode and a second electrode which are electrically connected to the semiconductor layer. The first metal layer overlaps the second metal layer. A third metal layer contacts a top surface of the second metal layer and a top surface of the first metal layer.

Abstract: Provided is a sheet-like prepreg that has both a low coefficient of linear thermal expansion and high flexibility and offers excellent anti-warpage performance and cracking resistance. The sheet-like prepreg according to the present invention includes a curable composition and a sheet-like porous support impregnated with the curable composition. The sheet-like porous support is made from a material having a coefficient of linear thermal expansion of 10 ppm/K or less. The sheet-like prepreg gives a cured product having a glass transition temperature of ?60° C. to 100° C. The curable composition includes one or more curable compounds (A) and at least one of a curing agent (B) and a curing catalyst (C). The curable compounds (A) include an epoxide having a weight per epoxy equivalent of 140 to 3000 g/eq in an amount of 50 weight percent or more of the totality of the curable compounds (A).

Abstract: According to one embodiment, a semiconductor device includes an insulating substrate, a first metal layer on the insulating substrate, a first insulating layer on the insulating substrate and the first metal layer, a semiconductor layer on the first insulating layer, a second insulating layer on the semiconductor layer and the first insulating layer, a second metal layer on the second insulating layer, and a first electrode and a second electrode which are electrically connected to the semiconductor layer. The first metal layer overlaps the second metal layer. A third metal layer contacts a top surface of the second metal layer and a top surface of the first metal layer.

Abstract: A metal sheet for press forming has a shape such that a boundary position between the region corresponding to the curved portion and an other region in the region corresponding to a curved portion is rotationally displaced in-plane around a rotational center set at a position on a curved recessed side rather than a position corresponding to a ridge line between a top sheet portion and a vertical wall portion on the curved recessed side, in a direction in which a line length of an outer edge of a position to be formed into the flange portion on a curved protruding side in the region corresponding to a curved portion approaches a line length of an outer edge of the flange portion on the curved protruding side in the press-formed component shape.

Abstract: Warpage or torsion in a longitudinal direction is suppressed when an elongated curved component is manufactured by press forming. A method for manufacturing a pressed component includes a first step of press forming a metal sheet in a desired component shape using a first die, and a second step of press forming a formed product using a second die after the first step. In the second step, a cross section of a bent part and a vertical wall part are controlled to be opened depending on warpage at longitudinal end portions of the component by elastic recovery due to release from the first die, thereby suppressing the warpage.

Abstract: Provided are a press formed component that does not easily cause wrinkling on a vertical wall portion of a curved portion in a component shape having an L-shape, a T-shape, or the like when viewed in a plan view and a method for manufacturing the same. A press formed component includes a top sheet portion, a vertical wall portion continuous to the top sheet portion, and a flange portion and also includes a curved portion in which when viewed in a plan view, at least a part of a boundary portion between the top sheet portion and the vertical wall portion is displaced to the vertical wall portion side and curved concavely toward a longitudinal direction. In a cross-sectional shape of the curved portion, an inclination angle ? [deg] of the vertical wall portion with respect to the top sheet portion satisfies the following expression: (1?sin ?)/cos ?>0.95.

Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

Abstract: To reduce warping of vertical wall portions without causing buckling occurring in a component shape not having a flange portion. A punch and a pad sandwiching a top sheet portion therebetween in the sheet thickness direction, bending blades for bend-forming the vertical wall portions, and stoppers facing the bending blades in the press direction and constraining end portions of a material to be machined are provided. The punch is supported by a first cushion component elastically expandable and contractible in the press direction. The bending blades each have an upper die component and a lower die component disposed facing each other in the press direction with an interval (D) equal to or larger than a set compression amount and a second cushion component interposed between the upper die component and the lower die component, maintaining the interval (D), and contractible in the press direction at a predetermined pressure or more.

Abstract: To reduce warping of vertical wall portions without causing buckling during pressing. Press-forming into a hat cross-sectional shape having one linear vertical wall portion and the other curved vertical wall portion and not having a flange portion is performed. A punch and a pad sandwiching a top sheet portion therebetween, bending blades, and stoppers are provided. The punch is supported by a first cushion component. The bending blades each have an upper die component and a lower die component disposed facing each other in the press direction with an interval (D) equal to a set compression amount in the range of 2% or more and 6% or less of the heights of the vertical wall portions and a second cushion component interposed between the upper die component and the lower die component, maintaining the interval (D), and contractible in the press direction.

Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.