Patents by Inventor Hiroto Tamaki

Hiroto Tamaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220241901
    Abstract: A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.
    Type: Application
    Filed: April 18, 2022
    Publication date: August 4, 2022
    Inventors: Kock Khuen SEET, Masayuki HAYASHIDA, Masakazu SAKAMOTO, Hiroto TAMAKI
  • Patent number: 11338393
    Abstract: A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: May 24, 2022
    Assignees: LASER SYSTEMS INC., NICHIA CORPORATION
    Inventors: Kock Khuen Seet, Masayuki Hayashida, Masakazu Sakamoto, Hiroto Tamaki
  • Publication number: 20220158061
    Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
    Type: Application
    Filed: January 31, 2022
    Publication date: May 19, 2022
    Applicant: NICHIA CORPORATION
    Inventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
  • Patent number: 11330703
    Abstract: A wireless communication system includes a first differential signal line, a differential coupler, and an electronic circuit. The differential coupler has a second differential signal line to perform wireless communication of a differential signal with the first differential signal line via electromagnetic field coupling. The electronic circuit is connected to the differential coupler via a wired transmission path to process the differential signal. A surface of a board or a ground pattern of the electronic circuit is inclined or upright with respect to the second differential signal line so as to separate away from a direction in which the first differential signal line extends.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: May 10, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hiroto Tamaki
  • Publication number: 20220109470
    Abstract: A wireless communication system operable to transmit a signal using an electric field coupling that is caused by a transmission coupler provided in a first apparatus being arranged close to a reception coupler provided in a second apparatus, wherein the second apparatus has a reception circuit that is connected to the reception coupler, and the reception circuit, in a case where a coupling capacitance between the transmission coupler and the reception coupler is C and a basic angular frequency of the signal is ?, has a termination resistor that is larger than 10/?C.
    Type: Application
    Filed: September 29, 2021
    Publication date: April 7, 2022
    Inventor: Hiroto Tamaki
  • Patent number: 11271144
    Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: March 8, 2022
    Assignee: Nichia Corporation
    Inventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
  • Patent number: 11239700
    Abstract: A wireless power transfer system includes: (a) an annular first substrate, a first coil, a second coil, and an annular second substrate that are stacked such that central axes of those substantially coincide with each other; (b) a power transmission circuit, implemented on the first substrate, for applying a voltage to the first coil; and (c) a power reception circuit, implemented on the second substrate, for rectifying an electric current that is generated at the second coil through electromagnetic induction and/or magnetic resonance. The second substrate is a multilayer substrate that includes a first layer provided with a ground pattern and a second layer provided with a power supply pattern, and includes slit portions where the patterns are not present as viewed from a direction of the central axes.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: February 1, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hiroto Tamaki
  • Publication number: 20210297112
    Abstract: A wireless communication system includes a first coupler having a first pair of electrodes and second coupler having a second pair of electrodes that at least partially oppose the first pair of electrodes. A transmission circuit applies a differential signal to the first coupler. A reception circuit receives a differential signal output from the second coupler based on electromagnetic coupling between the first coupler and the second coupler. A distance between centroids of the first pair of electrodes differs from a distance between centroids of the second pair of electrodes.
    Type: Application
    Filed: June 1, 2021
    Publication date: September 23, 2021
    Inventor: Hiroto Tamaki
  • Patent number: 11063192
    Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: July 13, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Hiroto Tamaki, Yoshiki Sato, Yoichi Bando
  • Patent number: 11056627
    Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: July 6, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Suguru Beppu, Yoichi Bando, Hiroto Tamaki, Takuya Nakabayashi
  • Patent number: 11057078
    Abstract: A wireless communication system includes a first coupler having a first pair of electrodes and second coupler having a second pair of electrodes that at least partially oppose the first pair of electrodes. A transmission circuit applies a differential signal to the first coupler. A reception circuit receives a differential signal output from the second coupler based on electromagnetic coupling between the first coupler and the second coupler. A distance between centroids of the first pair of electrodes differs from a distance between centroids of the second pair of electrodes.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: July 6, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hiroto Tamaki
  • Publication number: 20210127480
    Abstract: A wireless communication system includes a first differential signal line, a differential coupler, and an electronic circuit. The differential coupler has a second differential signal line to perform wireless communication of a differential signal with the first differential signal line via electromagnetic field coupling. The electronic circuit is connected to the differential coupler via a wired transmission path to process the differential signal. A surface of a board or a ground pattern of the electronic circuit is inclined or upright with respect to the second differential signal line so as to separate away from a direction in which the first differential signal line extends.
    Type: Application
    Filed: October 16, 2020
    Publication date: April 29, 2021
    Inventor: Hiroto Tamaki
  • Publication number: 20200373968
    Abstract: A wireless communication system includes a first coupler having a first pair of electrodes and second coupler having a second pair of electrodes that at least partially oppose the first pair of electrodes. A transmission circuit applies a differential signal to the first coupler. A reception circuit receives a differential signal output from the second coupler based on electromagnetic coupling between the first coupler and the second coupler. A distance between centroids of the first pair of electrodes differs from a distance between centroids of the second pair of electrodes.
    Type: Application
    Filed: May 20, 2020
    Publication date: November 26, 2020
    Inventor: Hiroto Tamaki
  • Publication number: 20200336012
    Abstract: A wireless power transfer system includes: (a) an annular first substrate, a first coil, a second coil, and an annular second substrate that are stacked such that central axes of those substantially coincide with each other; (b) a power transmission circuit, implemented on the first substrate, for applying a voltage to the first coil; and (c) a power reception circuit, implemented on the second substrate, for rectifying an electric current that is generated at the second coil through electromagnetic induction and/or magnetic resonance. The second substrate is a multilayer substrate that includes a first layer provided with a ground pattern and a second layer provided with a power supply pattern, and includes slit portions where the patterns are not present as viewed from a direction of the central axes.
    Type: Application
    Filed: April 10, 2020
    Publication date: October 22, 2020
    Inventor: Hiroto Tamaki
  • Patent number: 10784926
    Abstract: There is provided a configuration that can prevent malfunction in bus communication even when a radio signal transmitted from a transmitter of an apparatus is received with a receiver of the same apparatus. A logic circuit outputs logic 1 to a transmitter in a case where logic 0 is input from a receiver to the logic circuit and a low-level logic signal is input from a processor to the logic circuit. The logic circuit outputs the low-level logic signal to the processor in a case where the logic 1 is input from the receiver and a radio signal received with the receiver is a radio signal transmitted from a communication counterpart. The logic circuit outputs a high-level logic signal to the processor in a case where the logic 1 is input from the receiver and a radio signal received with the receiver is a radio signal transmitted from the transmitter.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: September 22, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hiroto Tamaki
  • Patent number: 10763405
    Abstract: A light emitting device including a light emitting element including an element substrate and semiconductor layers formed thereon, an encapsulating member that covers the sides of the light emitting element and forms a cavity at the upper surface of the light emitting element, and a wavelength-conversion layer in the cavity. The wavelength-conversion layer being capable of converting that converts the wavelength of light emitted by the light emitting element. The wavelength-conversion layer includes a first wavelength-conversion sub layer which is disposed at the upper surface of the light emitting element, and a second wavelength-conversion sub layer which is disposed on the first wavelength-conversion sub layer. The first wavelength-conversion sub layer includes first phosphors having a first resistance to environmental exposure, and the second wavelength-conversion sub layer includes second phosphors having a second resistance which is higher than that of the first wavelength-conversion sub layer.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: September 1, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Hiroto Tamaki
  • Publication number: 20200176652
    Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.
    Type: Application
    Filed: February 7, 2020
    Publication date: June 4, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Suguru BEPPU, Yoichi BANDO, Hiroto TAMAKI, Takuya NAKABAYASHI
  • Patent number: 10636764
    Abstract: A light emitting device includes first and second light emitting elements, first and second color conversion material layers, a support member and a light reflective member. The first color conversion material layer has a first color conversion surface facing a first light extraction surface of the first light emitting element. The second color conversion material layer has a second color conversion surface facing a second light extraction surface of the second light emitting element. The support member supports the first and second color conversion material layers. The light reflective member covers a first side surface of the first light emitting element and a second side surface of the second light emitting element. At least a part of an upper surface of the light reflective member is positioned closer to the support member than the first color conversion material layer and the second color conversion material layer.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: April 28, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Hiroto Tamaki, Takuya Nakabayashi
  • Patent number: 10615315
    Abstract: A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member, and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface is exposed. The second light reflecting member surrounds an outer periphery of the light emitting element, and is in contact with the first light reflecting member with at least a part of the second light reflecting member being positioned higher than the first light reflecting member. The light transmissive member includes a wavelength conversion substance, and is disposed inside the second light reflecting member and positioned higher than a lower surface of the light emitting element. The sealing member covers the second light reflecting member and the light transmissive member. An outer edge of the sealing member coincides with an outer edge of the mounting board.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: April 7, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Yuta Oka, Hiroto Tamaki
  • Patent number: RE49047
    Abstract: A light emitting device includes a light emitting element, a terminal substrate and a fixing member. The light emitting element is a semiconductor laminate having a first semiconductor layer, a light emitting layer, and a second semiconductor layer that are laminated in that order, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The terminal substrate includes a pair of terminals connected to the first electrode and the second electrode, and an insulator layer that fixes the terminals. At least a part of the outer edges of the terminal substrate is disposed more to a center of the light emitting device than the outer edges of the semiconductor laminate. The fixing member fixes the light emitting element and the terminal substrate.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: April 19, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Ryoma Suenaga, Hiroto Tamaki