Abstract: An imaging device of the present disclosure includes an event detection sensor that detects an event, and a control unit that controls the event detection sensor. Then, the control unit switches a resolution of the event detection sensor depending on a traveling state of a mobile body. Furthermore, the imaging system of the present disclosure includes an event detection sensor that detects an event; a control unit that switches a resolution of the event detection sensor depending on a traveling state of a mobile body; and an object recognition unit that performs event recognition on the basis of an event signal output from the event detection sensor.

Abstract: To prevent a deterioration of symptoms of a patient, a server device (4) is connected to a patient terminal (2) used by a patient for training for treatment and a supporter terminal (3-n) of a supporter of the patient via a network (N), the server device (4) comprising: a message DB which registers messages effective for the treatment of the patient; and a control unit wherein when a predetermined condition is satisfied, the control unit causes the messages registered in the message DB to be displayed on the supporter terminal (3-n) via the network (N) in a selectable manner, and wherein the control unit causes a message selected by the supporter with the supporter terminal (3-n) to be displayed on the patient terminal (2) via the network (N) as a message from the supporter.

Abstract: To provide an imaging circuit and an imaging device capable of achieving switching of output types while a circuit scale is reduced. An imaging circuit according to the present disclosure includes: a photoelectric conversion element that converts incident light into a photocurrent; a first transistor that converts the photocurrent into a voltage signal; a second transistor that amplifies the voltage signal; a third transistor that controls a current to be supplied to the first transistor; and a fourth transistor that is connected to the second transistor.

Abstract: The present technology relates to a sensor and a control method that achieve flexible acquisition of event data. A pixel block of the sensor includes one or more pixels each configured to receive light and perform photoelectric conversion to generate an electrical signal and an event detecting section configured to detect an event that is a change in electrical signal of each of the pixels. The sensor switches connections between a plurality of the pixel blocks. The present technology is applicable to a sensor configured to detect events that are changes in electrical signal of pixels, for example.

Abstract: Imaging devices and electronic apparatuses incorporating imaging devices or image pick-up elements are provided. An imaging device as disclosed can include a substrate, a first opto-electronic converter having a first area formed in the substrate, and a second opto-electronic converter having a second area formed in the substrate. The first area is larger than the second area. In addition, a light blocking wall can extend from a first surface of the substrate such that at least a portion of the light blocking wall is between the first opto-electronic converter and the second opto-electronic converter.

Abstract: An imaging device of the present disclosure includes an event detection sensor that detects an event, and a control unit that controls the event detection sensor. Then, the control unit switches a resolution of the event detection sensor depending on a traveling state of a mobile body. Furthermore, the imaging system of the present disclosure includes an event detection sensor that detects an event; a control unit that switches a resolution of the event detection sensor depending on a traveling state of a mobile body; and an object recognition unit that performs event recognition on the basis of an event signal output from the event detection sensor.

Abstract: Deterioration of symptoms of a patient is prevented. A supporter terminal (3-n) contains a display unit (32) for selectably displaying pre-prepared messages effective for treatment of the patient when an event that the patient uses a patient terminal to start training for the treatment is notified through a network, and a terminal control unit (34) for displaying a message selected by a supporter for the patient from among the messages displayed on the display unit (32) on the patient terminal through the network as a message from the supporter.

Abstract: Imaging devices and electronic apparatuses incorporating imaging devices or image pick-up elements are provided. An imaging device as disclosed can include a substrate, a first opto-electronic converter having a first area formed in the substrate, and a second opto-electronic converter having a second area formed in the substrate. The first area is larger than the second area. In addition, a light blocking wall can extend from a first surface of the substrate such that at least a portion of the light blocking wall is between the first opto-electronic converter and the second opto-electronic converter.

Abstract: The present technology relates to a sensor and a control method that achieve flexible acquisition of event data. A pixel block of the sensor includes one or more pixels each configured to receive light and perform photoelectric conversion to generate an electrical signal and an event detecting section configured to detect an event that is a change in electrical signal of each of the pixels. The sensor switches connections between a plurality of the pixel blocks. The present technology is applicable to a sensor configured to detect events that are changes in electrical signal of pixels, for example.

Abstract: Imaging devices and electronic apparatuses incorporating imaging devices or image pick-up elements are provided. An imaging device as disclosed can include a substrate, a first opto-electronic converter having a first area formed in the substrate, and a second opto-electronic converter having a second area formed in the substrate. The first area is larger than the second area. In addition, a light blocking wall can extend from a first surface of the substrate such that at least a portion of the light blocking wall is between the first opto-electronic converter and the second opto-electronic converter.

Abstract: Imaging devices and electronic apparatuses incorporating imaging devices or image pick-up elements are provided. An imaging device as disclosed can include a substrate, a first opto-electronic converter having a first area formed in the substrate, and a second opto-electronic converter having a second area formed in the substrate. The first area is larger than the second area. In addition, a light blocking wall can extend from a first surface of the substrate such that at least a portion of the light blocking wall is between the first opto-electronic converter and the second opto-electronic converter.

Abstract: To provide a technique for measuring a state of stress by objective symptoms having a correlation with stress in a mobile terminal device. In order to the above object, a program is provided, and a mobile terminal device reads and executes the program to perform: a video-on step for enabling a moving image capturing function of the mobile terminal; a light-on step for enabling a light disposed at an image capturing side of the mobile terminal; a pupil recognition step for recognizing pupils of animal eyes from an image that is being captured, wherein the animal eyes include human eyes; and a pupil change calculation step for calculating a pupil change, wherein the pupil change is a change in a dilation level of the recognized pupil over time.

Abstract: This technology relates to an imaging element and an electronic device for reducing any increase in pixel size while lessening any drop in image quality, and to a manufacturing apparatus and a manufacturing method for manufacturing the imaging element and the electronic device. For example, an imaging element includes an element isolation region with an insulator to penetrate a semiconductor layer having transistors formed in a pixel including a photoelectric conversion section. In another example, an electronic device includes an imaging section having an element isolation region with an insulator to penetrate a semiconductor layer having transistors formed in a pixel including a photoelectric conversion section. This technology is applicable not only to the imaging element and the electronic device but also to the manufacturing apparatus and the manufacturing method for manufacturing the imaging element and the electronic device to which the present technology is applied, for example.

Abstract: The present disclosure relates to a solid-state image capturing element, a manufacturing method therefor, and an electronic device, which are capable of controlling a thickness of a depletion layer. The solid-state image capturing element includes pixels each in which a photoelectric conversion film configured to perform photoelectric conversion on incident light and a fixed charge film configured to have a predetermined fixed charge are stacked on a semiconductor substrate. The technology of the present disclosure can be applied to, for example, back surface irradiation type solid-state image capturing elements, image capturing devices such as digital still cameras or video cameras, mobile terminal devices having an image capturing function, and electronic devices using a solid-state image capturing element as an image capturing unit.

Abstract: Imaging devices and electronic apparatuses incorporating imaging devices or image pick-up elements are provided. An imaging device as disclosed can include a substrate, a first opto-electronic converter having a first area formed in the substrate, and a second opto-electronic converter having a second area formed in the substrate. The first area is larger than the second area. In addition, a light blocking wall can extend from a first surface of the substrate such that at least a portion of the light blocking wall is between the first opto-electronic converter and the second opto-electronic converter.

Abstract: The present disclosure relates to a solid-state image capturing element, a manufacturing method therefor, and an electronic device, which are capable of controlling a thickness of a depletion layer. The solid-state image capturing element includes pixels each in which a photoelectric conversion film configured to perform photoelectric conversion on incident light and a fixed charge film configured to have a predetermined fixed charge are stacked on a semiconductor substrate. The technology of the present disclosure can be applied to, for example, back surface irradiation type solid-state image capturing elements, image capturing devices such as digital still cameras or video cameras, mobile terminal devices having an image capturing function, and electronic devices using a solid-state image capturing element as an image capturing unit.

Abstract: To provide a technique for measuring a state of stress by objective symptoms having a correlation with stress in a mobile terminal device. In order to the above object, a program is provided, and a mobile terminal device reads and executes the program to perform: a video-on step for enabling a moving image capturing function of the mobile terminal; a light-on step for enabling a light disposed at an image capturing side of the mobile terminal; a pupil recognition step for recognizing pupils of animal eyes from an image that is being captured, wherein the animal eyes include human eyes; and a pupil change calculation step for calculating a pupil change, wherein the pupil change is a change in a dilation level of the recognized pupil over time.

Abstract: The present disclosure relates to a solid-state image capturing element, a manufacturing method therefor, and an electronic device, which are capable of controlling a thickness of a depletion layer. The solid-state image capturing element includes pixels each in which a photoelectric conversion film configured to perform photoelectric conversion on incident light and a fixed charge film configured to have a predetermined fixed charge are stacked on a semiconductor substrate. The technology of the present disclosure can be applied to, for example, back surface irradiation type solid-state image capturing elements, image capturing devices such as digital still cameras or video cameras, mobile terminal devices having an image capturing function, and electronic devices using a solid-state image capturing element as an image capturing unit.

Abstract: This technology relates to an imaging element and an electronic device for reducing any increase in pixel size while lessening any drop in image quality, and to a manufacturing apparatus and a manufacturing method for manufacturing the imaging element and the electronic device. For example, an imaging element includes an element isolation region with an insulator to penetrate a semiconductor layer having transistors formed in a pixel including a photoelectric conversion section. In another example, an electronic device includes an imaging section having an element isolation region with an insulator to penetrate a semiconductor layer having transistors formed in a pixel including a photoelectric conversion section. This technology is applicable not only to the imaging element and the electronic device but also to the manufacturing apparatus and the manufacturing method for manufacturing the imaging element and the electronic device to which the present technology is applied, for example.

Abstract: A solid-state image pickup unit includes: a p-type compound semiconductor layer of a chalcopyrite structure; an electrode formed on the p-type compound semiconductor layer; and an n-type layer formed separately for each pixel, on a surface opposite to a light incident side of the p-type compound semiconductor layer.