Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: A resin composition having superior molding character, bonding character, moisture resistance, and heat resistance, for encapsulating of a semiconductor which contains:(a) An ether imide group compound represented by the general formula (I) ##STR1## wherein, each of R.sup.1 -R.sup.4, R.sup.8 and R.sup.8 is hydrogen, lower alkyl group, lower alkoxy group, lower fluoroalkyl group, chlorine or bromine, and R.sup.1 -R.sup.4, R.sup.7 and R.sup.8 may be same or different each other, and each of R.sup.5 and R.sup.6 is hydrogen, methyl group, ethyl group, trifluoromethyl group or trichloromethyl group, and R.sup.5 and R.sup.6 may be same or different each other, and D is a hydrocarbon group of a dicarboxylic acid having an ethylene type unsaturated double bond of an extract of the compound obtained by extraction with water in an amount 10 times by weight of the compound at 120.degree. C. for more than 100 hours has electric conductivity of at most 300 s/cm ph of 1.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: Disclosed is an electrophotographic photoreceptor in which an organic lubricant is provided on the surface of an organic photoconductive layer or on a protective layer formed on the organic photoconductive layer. Elements of the organic lubricant are partly exposed from the surface of the organic photoconductive layer or the protective layer while the remainder portions of the elements are embedded or fixed by chemical reaction in the surface region of the photoconductive layer or the protective layer so that the exposed portions of the elements of the organic lubricant provides a lubricating surface layer. The lubricating surface layer supresses wear of the photoreceptor thereby enabling the photosensitive layer to withstand a long repeated use without impairing electrophotographic characteristics.

Abstract: The present invention provides polypropylene resin compositions of excellent gloss, impact resistance and rigidity comprising (A) 100 parts by weight of propylene homopolymer having an intrinsic viscosity in tetraline at 135.degree. C. of no less than 1.9, (B) 40-150 parts by weight of ethylene/propylene copolymer having an intrinsic viscosity in tetralin at 135.degree. C. of 1.4-1.7 and an ethylene content of 2-15 molar % and (C) 40-150 parts by weight of ethylene/propylene copolymer having an intrinsic viscosity in tetralin at 135.degree. C. of no less than 1.9 and an ethylene content of 2-20 molar % or comprising above components (A) through (C) and (D) 5-120 parts by weight of a powdery inorganic filler of an average particle diameter of no more than 0.8 .mu.m, and moldings, i.e. molded articles, prepared from these compositions.

Abstract: A process for producing a high impact thermoplastic resin by graft polymerization of an acrylic rubber and a polymerizable vinyl monomer which comprises agglomerating acrylic rubber particles by stirring a mixture of the acrylic rubber latex and the polymerizable vinyl monomer in the presence of a coagulating agent, the particle size of the acrylic rubber particle agglomerate being adjusted to a range of 0.2 to 10 .mu., initiating graft polymerization in the presence of a free radical initiator, adding a surface active agent during the polymerization, continuing the polymerization until demulsification occurs while the particle size of the agglomerate of the acrylic rubber particles and grafted acrylic rubber particles is adjusted to a range of 0.2 to 10 .mu., and then completing the graft polymerization by suspension polymerization method. The process can give a vinyl graft copolymer resin having high gloss and excellent weather resistance without impairing its impact resistance.