Abstract: A composition for substrate materials according to the present invention includes 70-95 wt. % of inorganic powder and 5-30 wt. % of thermosetting resin composition and is in a finely crushed condition. The composition for substrate materials is prepared, for example, by crushing into fine pieces and mixing the inorganic powder and the thermosetting resin composition. A heat conductive substrate is provided with an insulator body formed by heating and pressurizing said composition for substrate materials and a wiring pattern is provided in such a condition that it is exposed on the surface of the insulator body. A process for manufacturing the heat conductive substrate comprises forming said composition for substrate materials into the insulator body by casting the above mentioned composition for substrate materials into a metal mold to be heated and pressurized so that said thermosetting resin is cured.

Abstract: A thermal conductive substrate includes a first electrical insulator layer, a second electrical insulator layer and a lead frame serving as a circuit pattern. The first electrical insulator layer is formed of a thermal conductive resin composition containing a thermosetting resin and an inorganic filler, and is joined to the lead frame. The second electrical insulator layer is provided on the side of the first electrical insulator layer not in contact with the lead frame, and is formed of a thermal conductive resin composition containing the inorganic filler and a resin composition containing the thermosetting resin. The second electrical insulator layer has a higher thermal conductivity than the first electrical insulator layer. Thus, it is possible to achieve higher heat-radiating characteristics and component packaging reliability without deteriorating formability and adhesive characteristics of the electrical insulator layers.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: A thermal conductive substrate includes a first electrical insulator layer, a second electrical insulator layer and a lead frame serving as a circuit pattern. The first electrical insulator layer is formed of a thermal conductive resin composition containing a thermosetting resin and an inorganic filler, and is joined to the lead frame. The second electrical insulator layer is provided on the side of the first electrical insulator layer not in contact with the lead frame, and is formed of a thermal conductive resin composition containing the inorganic filler and a resin composition containing the thermosetting resin. The second electrical insulator layer has a higher thermal conductivity than the first electrical insulator layer. Thus, it is possible to achieve higher heat-radiating characteristics and component packaging reliability without deteriorating formability and adhesive characteristics of the electrical insulator layers.

Abstract: A technique for judging a welding quality for acceptance or rejection and displaying the result in diagrams, and an automatic welding device incorporating the technique therein. When an operation result record status judging means judges that past operation records are available, temperature distribution operation result records at joints of works to be welded are displayed by a weld penetration display means (23) and bead surface shape operation result records are displayed by a bead surface shape display means (25), whereby time required for operation by a temperature distribution operation means and time required for operation by a bead surface shape operation means (24) are omitted by an operation time omitting means incorporated in the automatic welding device.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: A magnetic device includes a sheet-type coil including a planar conductive coil and an insulating substance; and a sheet-type first magnetic member disposed on at least one of upper and lower surfaces of the sheet-type coil, where a magnetic permeability of the insulating substance is smaller than a magnetic permeability of the first magnetic member. The magnetic device preferably includes a second magnetic member provided at a predetermined area of the sheet-type coil, the second magnetic member being made of a resin containing a magnetic powder and having a permeability larger than the insulating substance and smaller than the first magnetic member. The predetermined area is at least one position selected from a center portion and a peripheral portion of the sheet-type coil where a conductor constituting the planar conductive coil is not present. Further, a power supply module of the present invention includes this magnetic device according to the present invention.

Abstract: A liquid crystal display device includes a liquid crystal display panel having a first substrate, a second substrate, a liquid crystal disposed between the first substrate and the second substrate, plural pixel electrodes arranged in a matrix on a second substrate, a counter electrode provided on one of first substrate and the second substrate and plural switching elements connected to the respective plural pixel electrodes, a display drive control unit for driving the liquid crystal disposed between each of the pixel electrodes and the counter electrode, a lighting unit having LEDs emitting light of respective red, green and blue colors, and a lighting device control unit for making each LED of color perform time-division light emission in synchronization with the switching of each of the switching elements.

Abstract: A method for calculating the shape of a bead of a welded part determining an appropriate welding condition by solving the problem of multiple solution of when the shape causing a recess or undercut in the flange is determined by calculation. The geometry data on the object to be welded, the characteristic parameters of the object and welding environment, and the welding conditions are set. Under the welding conditions, the melting part of the object is inferred by heat conduction calculation. The coordinates are rotated about an axis parallel to the direction of the welding and/or about an axis perpendicular to the welding direction for the inferred melting part. A difference lattice is set for the coordinate-rotated melting part. The displacement of the melting part for which the difference lattice is set is calculated by a curved surface equation.

Abstract: In an electrolytic capacitor of the present invention, a dielectric layer is provided on a surface of a valve metal element for an anode having a capacitor forming part and an electrode lead part, and further, a solid electrolyte layer and a charge collecting layer for a cathode are provided in this order thereon. The capacitor forming part and the electrode lead part of the valve metal element for an anode have rough surface layers on their surfaces, and are compressed in the thickness direction of the rough surface layers. Further, a region other than the electrode lead part and the charge collecting element for cathode is molded with a molding material. Exposed portions of the electrode lead part and the charge collecting element for cathode function as electrode terminals, respectively.

Abstract: To provide a power amplifier circuit with a smaller circuit scale and with good characteristics over a wide range of load impedance. A configuration includes: a DC/DC converter 2108 which delivers a supply voltage from a battery 2111 to a power amplifier 1302 according to control commands from a control circuit 2109; a directional coupler 2101 which outputs a signal from one terminal 2101a according to signal waves received by an antenna 1306 from a second matching circuit 105 and outputs a signal from another terminal 2101b according to reflected waves received from the antenna 1306; and detectors 2102 and 2103 or the like.

Abstract: A capacitor unit of the present invention is configured so that a dielectric layer is provided on a roughened surface of a valve metal foil for an anode, and further, a conductive layer for a cathode, and a charge collecting metal element for a cathode are provided thereon in the stated order. The conductive layer for a cathode has a three-layer structure including a first conductive polymer layer, a conductive adhesive layer, and a second conductive polymer layer that are laminated in the stated order from the dielectric layer side. The capacitor unit of the present invention is produced by laminating the first conductive polymer layer formed on a side of the valve metal foil for an anode, and the second conductive polymer layer formed on a side of the charge collecting metal element for a cathode, with a conductive adhesive layer being interposed therebetween, and compressing the same in a lamination direction.

Abstract: A capacitor unit of the present invention is configured so that a dielectric layer is provided on a roughened surface of a valve metal foil for an anode, and further, a conductive layer for a cathode, and a charge collecting metal element for a cathode are provided thereon in the stated order. The conductive layer for a cathode has a three-layer structure including a first conductive polymer layer, a conductive adhesive layer, and a second conductive polymer layer that are laminated in the stated order from the dielectric layer side. The capacitor unit of the present invention is produced by laminating the first conductive polymer layer formed on a side of the valve metal foil for an anode, and the second conductive polymer layer formed on a side of the charge collecting metal element for a cathode, with a conductive adhesive layer being interposed therebetween, and compressing the same in a lamination direction.

Abstract: In an electrolytic capacitor of the present invention, a dielectric layer is provided on a surface of a valve metal element for an anode having a capacitor forming part and an electrode lead part, and further, a solid electrolyte layer and a charge collecting layer for a cathode are provided in this order thereon. The capacitor forming part and the electrode lead part of the valve metal element for an anode have rough surface layers on their surfaces, and are compressed in the thickness direction of the rough surface layers. Further, a region other than the electrode lead part and the charge collecting element for cathode is molded with a molding material. Exposed portions of the electrode lead part and the charge collecting element for cathode function as electrode terminals, respectively.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: A composition for substrate materials according to the present invention includes 70-95 wt. % of inorganic powder and 5-30 wt. % of thermosetting resin composition and is in a finely crushed condition. The composition for substrate materials is prepared, for example, by crushing into fine pieces and mixing the inorganic powder and the thermosetting resin composition. A heat conductive substrate is provided with an insulator body formed by heating and pressurizing said composition for substrate materials and a wiring pattern is provided in such a condition that it is exposed on the surface of the insulator body. A process for manufacturing the heat conductive substrate comprises forming said composition for substrate materials into the insulator body by casting the above mentioned composition for substrate materials into a metal mold to be heated and pressurized so that said thermosetting resin is cured.

Abstract: A composition for substrate materials according to the present invention includes 70 - 95 wt. % of inorganic powder and 5 - 30 wt. % of thermosetting resin composition and is in a finely crushed condition. The composition for substrate materials is prepared, for example, by crushing into fine pieces and mixing the inorganic powder and the thermosetting resin composition. A heat conductive substrate is provided with an insulator body formed by heating and pressurizing said composition for substrate materials and a wiring pattern is provided in such a condition that it is exposed on the surface of the insulator body. A process for manufacturing the heat conductive substrate comprises forming said composition for substrate materials into the insulator body by casting the above mentioned composition for substrate materials into a metal mold to be heated and pressurized so that said thermosetting resin is cured.