Patents by Inventor Hiroyuki Hashimoto
Hiroyuki Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210041026Abstract: Low-torque sliding components have sliding surfaces rotated relative to each other with an annular mating ring and an annular seal ring facing each other. The sliding surface of at least one of the mating ring and the seal ring has therein a plurality of multi-stepped recess portions formed in a circumferential direction. Relative rotation and sliding of the mating ring and the seal ring causes the multi-stepped recess portions to generate a dynamic pressure, and the multi-stepped recess portion is formed in a stepwise shape in a cross-sectional view by a dynamic pressure recess portion and a static pressure recess portion with the dynamic pressure recess portion surrounding the static pressure recess portion deeper than the dynamic pressure recess portion.Type: ApplicationFiled: January 31, 2019Publication date: February 11, 2021Inventors: Tadatsugu IMURA, Hiroyuki HASHIMOTO, Yuichiro TOKUNAGA, Hideyuki INOUE
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Publication number: 20200398396Abstract: A processing apparatus includes a processing unit, a control unit, and a temperature detecting unit. The processing unit includes a cutting blade and a spindle assembly, the spindle assembly including a spindle having the cutting blade mounted on a distal end of the spindle and a spindle housing through which the spindle is inserted. A cooling fluid passage is formed in the spindle housing, the cooling fluid passage cooling the spindle assembly, and having one end connected to a cooling fluid supply source and having another end communicating with a cooling fluid outlet of the spindle housing. The temperature detecting unit detects the temperature of the spindle housing. The control unit determines whether a state of cooling of the spindle assembly is normal or abnormal on the basis of the temperature detected by the temperature detecting unit.Type: ApplicationFiled: June 11, 2020Publication date: December 24, 2020Inventors: Hiroyuki HASHIMOTO, Shinya YASUDA, Satoshi TAKAHASHI
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Publication number: 20200365853Abstract: A power supply device includes: a battery stack formed by stacking a plurality of battery cells; a separator disposed between the battery cells; and a fixing member for fastening the battery stack in a stacking direction. The separator includes an outer peripheral frame and a heat insulating base material member provided in an opening of the outer peripheral frame. The outer peripheral frame is disposed on an outer periphery of a stacking surface of the battery cell and has an opening inside, and the heat insulating base material member has flexibility of being deformed by being pressed by expanding of the stacking surface of the battery cell. The outer peripheral frame has higher rigidity than the heat insulating base material member, and specifies an interval between the adjacently stacked battery cells. The flexible heat insulating base material member absorbs expansion of the stacking surface of the battery cell.Type: ApplicationFiled: November 16, 2018Publication date: November 19, 2020Applicant: SANYO Electric Co., Ltd.Inventors: Hiroyuki Hashimoto, Tomokazu Takashina, Eri Kohira
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Patent number: 10831680Abstract: A communication system includes a first communication device and a second communication device communicating with the first communication device. The first communication device includes: a first communication unit receiving, from a first input device, first input information and first information about an attribute of the first input device; and a second communication unit which does not transmit the first information received by the first communication unit to the second communication device but transmits the first input information received by the first communication unit to the second communication device.Type: GrantFiled: March 12, 2019Date of Patent: November 10, 2020Assignee: SEIKO EPSON CORPORATIONInventor: Hiroyuki Hashimoto
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Publication number: 20200310369Abstract: A power generation planning system for controlling on/off sequence of generators according to operational parameters includes an interface to receive the operational parameters including a power demand, state-data of the generators and operational histories of the generators from a power control system, a memory to store an objective function, a mixed-integer programming solver, generator parameters of each the generators and planning modules including a state-space representation module, a variable assignment module, a network flow module and a tight constraint module, a processor to perform the planning modules based on the operational parameters received by the interface.Type: ApplicationFiled: March 26, 2019Publication date: October 1, 2020Applicant: Mitsubishi Electric Research Laboratories, Inc.Inventors: Arvind Raghunathan, David Bergman, Hiroyuki Hashimoto
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Patent number: 10755971Abstract: A method of manufacturing a semiconductor device by performing a process on a substrate includes: forming a protective layer made of a polymer having a urea bond by supplying a raw material for polymerization to a surface of a substrate on which a protected film to be protected is formed; forming a sealing film at a first temperature lower than a second temperature at which the polymer is depolymerized so cover a portion where the protective layer is exposed; subsequently, subjecting the substrate to a treatment at a third temperature equal to or higher than the second temperature at which the polymer as the protective layer is depolymerized; subsequently, performing a treatment which causes damage to the protected film when the protective layer is not present; and after the performing a treatment which causes damage to the protected film, depolymerizing the polymer by heating the substrate.Type: GrantFiled: September 6, 2019Date of Patent: August 25, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Tatsuya Yamaguchi, Reiji Niino, Hiroyuki Hashimoto, Syuji Nozawa, Makoto Fujikawa
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Patent number: 10701568Abstract: A data supply device includes a transmission section adapted to transmit data via an electrical wave, and a control section adapted to switch an operation mode of the transmission section to either one of a first mode of searching for an optimum transmission direction of the electrical wave while transmitting the data, and a second mode in which the transmission direction is fixed.Type: GrantFiled: November 9, 2016Date of Patent: June 30, 2020Assignee: SEIKO EPSON CORPORATIONInventor: Hiroyuki Hashimoto
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Patent number: 10690897Abstract: A laser scanning microscope apparatus includes an irradiation unit including an objective lens, a photodetector unit, an XY-scanning unit, and a Z-scanning unit. The irradiation unit focuses a laser beam with the objective lens to a specimen. The photodetector unit detects light generated from a position irradiated with the laser beam focused. The XY-scanning unit scans the laser beam in an X-direction perpendicular to an optical axis of the objective lens and in a Y-direction perpendicular to the optical axis and the X-direction. The Z-scanning unit scans the laser beam in a Z-direction parallel to the optical axis. When acquiring XY-two-dimensional image data by detecting the light while scanning the irradiated position in the X-direction and the Y-direction, the apparatus detects the light while scanning the irradiated position also in the Z-direction.Type: GrantFiled: April 18, 2016Date of Patent: June 23, 2020Assignee: Canon Kabushiki KaishaInventors: Koji Makara, Yoichi Otsuka, Masafumi Kyogaku, Hiroyuki Hashimoto
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Publication number: 20200152475Abstract: There is provided a method of fabricating a semiconductor device by performing a process on a substrate, which includes: forming a masking film made of a polymer having a urea bond by supplying polymerizing raw materials to a surface of the substrate on which an etching target film formed; forming an etching pattern on the masking film; subsequently, etching the etching target film with a processing gas using the etching pattern; and subsequently, removing the masking film by heating the substrate to depolymerize the polymer.Type: ApplicationFiled: January 17, 2020Publication date: May 14, 2020Inventors: Koichi YATSUDA, Takashi HAYAKAWA, Hiroshi OKUNO, Reiji NIINO, Hiroyuki HASHIMOTO, Tatsuya YAMAGUCHI
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Patent number: 10629448Abstract: A method for manufacturing a semiconductor device by processing a substrate, the method includes forming a first film of a polymer having urea bonds by supplying a polymerization raw material to a surface of the substrate, subsequently, forming a pattern by etching the first film, and subsequently, forming a second film of a material different from the polymer of the first film by performing a substitution processing to the first film by supplying a reaction gas, which reacts with the polymerization raw material to generate a product, to the substrate while heating the substrate to depolymerize the polymer.Type: GrantFiled: March 13, 2018Date of Patent: April 21, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Tatsuya Yamaguchi, Reiji Niino, Hiroyuki Hashimoto, Syuji Nozawa, Makoto Fujikawa
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Patent number: 10593556Abstract: There is provided a method of fabricating a semiconductor device by performing a process on a substrate, which includes: forming a masking film made of a polymer having a urea bond by supplying polymerizing raw materials to a surface of the substrate on which an etching target film formed; forming an etching pattern on the masking film; subsequently, etching the etching target film with a processing gas using the etching pattern; and subsequently, removing the masking film by heating the substrate to depolymerize the polymer.Type: GrantFiled: July 19, 2017Date of Patent: March 17, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Koichi Yatsuda, Takashi Hayakawa, Hiroshi Okuno, Reiji Niino, Hiroyuki Hashimoto, Tatsuya Yamaguchi
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Publication number: 20190392368Abstract: A system for assigning commuter vehicles (CVs) in a multi-modal transportation network having the CVs and fixed schedule vehicles to passengers is disclosed. The system receives itinerary requests from the passengers, wherein the itinerary requests of the passengers include initial locations, target locations, departure times from the initial locations, and arrival time windows including deadlines at the target locations. The system includes a memory to store computer executable programs including a grouping program, a route-search program, an operation route map program of the CVs, and a commuter assigning program, and a processor to perform steps of the programs in connection with the memory, wherein the steps include grouping the passengers into a set of groups, assigning the CVs to the groups by performing the commuter assigning program and generating assignment information of assigned CVs among the available CVs.Type: ApplicationFiled: December 6, 2018Publication date: December 26, 2019Applicants: Mitsubishi Electric Research Laboratories, Inc., Mitsubishi Electric CorporationInventors: Arvind Raghunathan, David Bergman, Hiroyuki Hashimoto, Shingo Kobori
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Publication number: 20190393083Abstract: A method of manufacturing a semiconductor device by performing a process on a substrate includes: forming a protective layer made of a polymer having a urea bond by supplying a raw material for polymerization to a surface of a substrate on which a protected film to be protected is formed; forming a sealing film at a first temperature lower than a second temperature at which the polymer is depolymerized so cover a portion where the protective layer is exposed; subsequently, subjecting the substrate to a treatment at a third temperature equal to or higher than the second temperature at which the polymer as the protective layer is depolymerized; subsequently, performing a treatment which causes damage to the protected film when the protective layer is not present; and after the performing a treatment which causes damage to the protected film, depolymerizing the polymer by heating the substrate.Type: ApplicationFiled: September 6, 2019Publication date: December 26, 2019Inventors: Tatsuya YAMAGUCHI, Reiji NIINO, Hiroyuki HASHIMOTO, Syuji NOZAWA, Makoto FUJIKAWA
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Patent number: 10490405Abstract: There is provided a semiconductor device manufacturing method including: forming a first mask film composed of a polymer having a urea bond by supplying a raw material to a surface of the substrate for polymerization; forming a second mask inorganic film to be laminated on the first mask film; forming a pattern on the first mask film and the second mask inorganic film and performing an ion implantation on the surface of the substrate; removing the second mask inorganic film after the ion implantation; and removing the first mask film by heating the substrate after the ion implantation and depolymerizing the polymer.Type: GrantFiled: March 2, 2018Date of Patent: November 26, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Tatsuya Yamaguchi, Reiji Niino, Hiroyuki Hashimoto, Syuji Nozawa, Makoto Fujikawa
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Patent number: 10446818Abstract: In order to allow gas discharged from a pouch cell to be guided to a predetermined position, a power source device includes one or a plurality of pouch cells (10) having laminated film outer casing (11), and a housing member (20) enclosing the one or multiple pouch cells (10). The one or plurality of pouch cells (10) each includes thermally welded portion (13) formed by thermally welding the laminated film, and gas discharge portion (14) provided in at least a part of thermally welded portion (13). Housing member (20) includes exhaust port (22) communicating with gas discharge portion (14) of one or a plurality of pouch cells (10).Type: GrantFiled: July 7, 2015Date of Patent: October 15, 2019Assignee: SANYO ELECTRIC CO., LTD.Inventors: Hiroyuki Hashimoto, Shingo Ochi, Tatsuhito Horiuchi
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Patent number: 10446438Abstract: A method of manufacturing a semiconductor device by performing a process on a substrate includes: forming a protective layer made of a polymer having a urea bond by supplying a raw material for polymerization to a surface of a substrate on which a protected film to be protected is formed; forming a sealing film at a first temperature lower than a second temperature at which the polymer is depolymerized so cover a portion where the protective layer is exposed; subsequently, subjecting the substrate to a treatment at a third temperature equal to or higher than the second temperature at which the polymer as the protective layer is depolymerized; subsequently, performing a treatment which causes damage to the protected film when the protective layer is not present; and after the performing a treatment which causes damage to the protected film, depolymerizing the polymer by heating the substrate.Type: GrantFiled: March 27, 2018Date of Patent: October 15, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Tatsuya Yamaguchi, Reiji Niino, Hiroyuki Hashimoto, Syuji Nozawa, Makoto Fujikawa
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Publication number: 20190286578Abstract: A communication system includes a first communication device and a second communication device communicating with the first communication device. The first communication device includes: a first communication unit receiving, from a first input device, first input information and first information about an attribute of the first input device; and a second communication unit which does not transmit the first information received by the first communication unit to the second communication device but transmits the first input information received by the first communication unit to the second communication device.Type: ApplicationFiled: March 12, 2019Publication date: September 19, 2019Applicant: SEIKO EPSON CORPORATIONInventor: Hiroyuki HASHIMOTO
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Publication number: 20190166507Abstract: A data supply device includes a transmission section adapted to transmit data via an electrical wave, and a control section adapted to switch an operation mode of the transmission section to either one of a first mode of searching for an optimum transmission direction of the electrical wave while transmitting the data, and a second mode in which the transmission direction is fixed.Type: ApplicationFiled: November 9, 2016Publication date: May 30, 2019Applicant: SEIKO EPSON CORPORATIONInventor: Hiroyuki HASHIMOTO
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Publication number: 20190095088Abstract: An electronic apparatus includes an execution section that executes communication of image information with an external apparatus, an attachment section to which a device is attachable, and a control section that controls communication between the device attached to the attachment section and the external apparatus during a period for which the execution section executes the communication of the image information with the external apparatus.Type: ApplicationFiled: September 24, 2018Publication date: March 28, 2019Applicant: SEIKO EPSON CORPORATIONInventor: Hiroyuki HASHIMOTO
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Publication number: 20190095089Abstract: An electronic apparatus connectable with an external apparatus includes: a communication unit which communicates with the external apparatus; an interface where a plurality of devices can be connected; and a control unit which controls plug and play for a device connected to the interface. The control unit does not cause the external apparatus to execute plug and play accompanying the connection between the electronic apparatus and the external apparatus when a first device is connected to the interface, the first device is not a specific type. The control unit causes the external apparatus to execute plug and play accompanying the connection between the electronic apparatus and the external apparatus when a second device is connected to the interface, the second device is the specific type.Type: ApplicationFiled: September 24, 2018Publication date: March 28, 2019Applicant: SEIKO EPSON CORPORATIONInventor: Hiroyuki HASHIMOTO