Patents by Inventor Hiroyuki Morimoto

Hiroyuki Morimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9829205
    Abstract: In an air-conditioning apparatus including a refrigerant circulating circuit A and a heat medium circulating circuit B that performs passing of heat to and from the refrigerant circulating circuit A, the heat medium circulating circuit is a closed circuit, the maximum pump head Pp of a pump of the heat medium circulating circuit is 150 kPa or more, and a pressure near at least a suction side of the pump is set to a charged pressure that is maintained equal to or higher than the atmospheric pressure during operation of the pump.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: November 28, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroyuki Morimoto, Koji Yamashita
  • Patent number: 9822995
    Abstract: A refrigeration cycle apparatus including a heat source side heat exchanger including a first heat exchanger and a second heat exchanger connected in parallel; an air-sending device that supplies air, which is an object to be heat exchanged in the first heat exchanger and the second heat exchanger, in a variable manner; solenoid valves that each opens and closes a refrigerant passage of the first heat exchanger and the second heat exchanger; a third refrigerant circuit that is parallelly connected to the first heat exchanger and the second heat exchanger; and a flow control valve that controls the flow rate of the refrigerant flowing in the third refrigerant circuit. The refrigeration cycle apparatus can improve continuity of control of a heat exchange capacity of a heat source side heat exchanger.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: November 21, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shinichi Wakamoto, Naofumi Takenaka, Koji Yamashita, Hiroyuki Morimoto, Yuji Motomura, Takeshi Hatomura
  • Patent number: 9797618
    Abstract: In an air-conditioning apparatus, a heat source side heat exchanger, intermediate heat exchangers, and use side heat exchangers are formed in separate bodies respectively and adapted to be disposed at separate locations one another. In a heat medium circulation circuit where the intermediate heat exchanger and the use side heat exchanger are connected, temperature sensors are installed. An anti-freezing operation mode is provided in which, when the detection temperatures of the temperature sensors become equal to or lower than a set temperature Ts while a compressor or pumps are stopped, the heat medium is circulated to perform anti-freezing of the heat medium.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: October 24, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Yamashita, Hiroyuki Morimoto, Yuji Motomura, Takeshi Hatomura
  • Patent number: 9777367
    Abstract: A surface coated member having improved stability and a longer service life is provided. The surface coated member of the present invention includes a base member and a hard coating formed on a surface thereof. The hard coating is constituted of one or more layers. At least one of the layers is formed by a CVD method and includes a multilayer structure having a first unit layer and a second unit layer being layered alternately. The first unit layer includes a first compound containing Ti and one or more kind of element selected from the group consisting of B, C, N, and O. The second unit layer includes a second compound containing Al and one or more kind of element selected from the group consisting of B, C, N, and O.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: October 3, 2017
    Assignee: Sumitomo Electric Hardmetal Corp.
    Inventors: Anongsack Paseuth, Kazuo Yamagata, Susumu Okuno, Hideaki Kanaoka, Hiroyuki Morimoto, Minoru Itoh
  • Publication number: 20170277600
    Abstract: A primary storage system is equipped with a local storage subsystem having a mirror volume of a volume in a primary storage subsystem, and a remote storage subsystem having a mirror volume of the volume in the primary storage subsystem at a secondary site. When storing a write data from a host to a volume, the primary storage subsystem determines an SEQ# to be stored in a journal corresponding to the write request, creates a journal including the relevant SEQ# and a replica of the write data, and transmits the relevant SEQ# to the local storage subsystem, which creates a journal including the relevant SEQ# and stores it in its own journal volume. But when creation of the journal including the relevant SEQ# is stopped, the local storage subsystem creates a dummy journal including the relevant SEQ# but not including the write data.
    Type: Application
    Filed: November 26, 2014
    Publication date: September 28, 2017
    Inventors: Ryunosuke KAMIMOTO, Hideo SAITO, Azusa JIN, Keishi TAMURA, Takahiko TAKEDA, Takashi SAKAGUCHI, Hiroyuki MORIMOTO
  • Patent number: 9758453
    Abstract: A composition, consisting essentially of copper, a fluoroalkyl group, and a ligand comprising at least one group-V donor. The molar ratio of copper to the fluoroalkyl group is approximately 1.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: September 12, 2017
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: John F. Hartwig, Hiroyuki Morimoto, Patrick Fier
  • Patent number: 9746222
    Abstract: A computing device calculates an evaporating temperature Te* and a dew-point temperature Tdew* from a quality X, a temperature glide ?T determined by a difference between a boiling temperature and a dew-point temperature at a predetermined pressure, and a refrigerant temperature detected by second temperature detection device.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: August 29, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroyuki Morimoto, Koji Yamashita
  • Patent number: 9726409
    Abstract: An air-conditioning apparatus includes a controller which calculates a composition ratio of a refrigerant mixture using a high-pressure-side pressure of a refrigerant discharged from a compressor, a low-pressure-side pressure of a refrigerant to be sucked into the compressor, a high-pressure-side temperature of a refrigerant at an inlet side of a second expansion device in a high/low pressure bypass pipe, and a low-pressure-side temperature of a refrigerant at an outlet side of the second expansion device in the high/low pressure bypass pipe and which determines whether to open or close a bypass-channel opening/closing device.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: August 8, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koji Yamashita, Toshihide Koda, Hiroyuki Morimoto
  • Patent number: 9709304
    Abstract: An air-conditioning apparatus includes an outdoor-side flow rate control device (a fourth flow rate control device) that generates an intermediate pressure for injection into a compressor, and a bypass flow rate control device (a sixth flow rate control device) that is placed at a bypass pipe allowing bypassing of an outdoor heat exchanger in parallel to the outdoor-side flow rate control device and that controls the amount of heat exchange of the outdoor heat exchanger together with the outdoor-side flow rate control device.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: July 18, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Naofumi Takenaka, Shinichi Wakamoto, Koji Yamashita, Hiroyuki Morimoto, Takeshi Hatomura, Katsuhiro Ishimura
  • Patent number: 9671119
    Abstract: An air-conditioning apparatus includes a refrigerant circuit including a low-pressure shell structure compressor into which a refrigerant flowing through an injection pipe flows, a first heat exchanger, a second heat exchanger, a first expansion device, a refrigerant flow switching device, and a second expansion device configured to allow the refrigerant which has passed through the first expansion device and flows from the second heat exchanger to the first heat exchanger to have an intermediate pressure, the compressor, the first heat exchanger, the second heat exchanger, the first expansion device, the refrigerant flow switching device, and the second expansion device being connected by pipes to constitute the refrigerant circuit, and further includes a controller that controls an amount of refrigerant flowing through the injection pipe into a compression chamber. A part of a high-pressure refrigerant flowing from the first heat exchanger to the second heat exchanger flows through the injection pipe.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: June 6, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Yamashita, Hiroyuki Morimoto, Katsuhiro Ishimura, Shinichi Wakamoto, Naofumi Takenaka
  • Patent number: 9657955
    Abstract: To obtain an air-conditioning apparatus that does not make a refrigerant circulate up to an indoor unit and further can achieve energy-saving. A refrigeration cycle is configured by connecting a compressor that pressurizes a refrigerant, a four-way valve that switches a circulation path of the refrigerant, a heat source side heat exchanger that performs heat exchange, expansion valves for pressure-adjusting the refrigerant, and a plurality of intermediate heat exchangers that performs heat exchange between the refrigerant and the heat medium to heat and cool the heat medium, with piping. A heat medium circuit is configured by connecting intermediate heat exchangers, pumps that pressurize the heat medium, and a plurality of use side heat exchangers that perform heat exchange between the heat medium and the air in the indoor space, with piping.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: May 23, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Yamashita, Hiroyuki Morimoto, Yuji Motomura, Takeshi Hatomura, Naoki Tanaka, Shinichi Wakamoto, Takashi Okazaki, Yusuke Shimazu
  • Patent number: 9651287
    Abstract: A computing device calculates a quality of a refrigerant flowing out of an expansion device on the basis of an inlet liquid enthalpy calculated on the basis of a temperature of the refrigerant flowing into the expansion device, and a saturated gas enthalpy and a saturated liquid enthalpy calculated on the basis of a temperature or pressure of the refrigerant flowing out of the expansion device; calculates a liquid-phase concentration and a gas-phase concentration of the refrigerant flowing out of the expansion device on the basis of the temperature and pressure of the refrigerant flowing out of the expansion device; and calculates a composition of the refrigerant circulating in a refrigeration cycle on the basis of the calculated quality, liquid-phase concentration, and gas-phase concentration.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: May 16, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroyuki Morimoto, Koji Yamashita, Yoshihiro Sumida
  • Publication number: 20170121581
    Abstract: A heat pump apparatus is provided in which refrigerant circulates between an indoor unit and an outdoor unit, wherein the refrigerant is a mixed refrigerant of HFO-1123 and an HFC refrigerant other than HFO-1123, the outdoor unit has a cooling capacity (kW) in the range of 2.2 to 9.5 kW, the outer diameter ? (mm) of a gas pipe between the indoor unit and the outdoor unit and the cooling capacity (kW) of the outdoor unit satisfy the relation (1.00?outer diameter ? (mm) of gas pipe/cooling capacity (kW) of outdoor unit?5.77), and the outer diameter ? (mm) of a liquid pipe between the indoor unit and the outdoor unit and the cooling capacity (kW) of the outdoor unit satisfy the relation (0.67?outer diameter ? (mm) of liquid pipe/cooling capacity (kW) of outdoor unit?5.77).
    Type: Application
    Filed: March 17, 2014
    Publication date: May 4, 2017
    Inventors: Shinya HORIIKE, Hiroyuki MORIMOTO, Hiroshi SATA
  • Patent number: 9631849
    Abstract: Obtained is a heat medium relay unit capable of having improved serviceability and an air-conditioning apparatus equipped with the heat medium relay unit. Heat medium flow control devices are each disposed below a corresponding one of the first heat medium flow switching devices. The heat medium flow control devices are similarly disposed in a zigzag manner along with the zigzag arrangement of the first heat medium flow switching devices.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: April 25, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroyuki Morimoto, Koji Yamashita, Yuji Motomura
  • Patent number: 9618241
    Abstract: An air-conditioning apparatus controls that a discharge temperature does not become too high with a refrigerant whose compressor discharge temperature readily rises, and thus suppress degradation of the refrigerant and a refrigerating machine oil. An injection pipe that injects a heat source side refrigerant into a compressor is installed, connected a pipe between a backflow prevention device and an opening and closing device installed on a branching pipe, and an aperture unit in the compressor.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: April 11, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Yamashita, Hiroyuki Morimoto, Katsuhiro Ishimura, Shinichi Wakamoto, Naofumi Takenaka
  • Patent number: 9599378
    Abstract: A heat pump hot-water supply apparatus controls a second expansion device during a heating operation so as to adjust the amount of refrigerant flowing through an injection pipe, and controls a third expansion device during a cooling operation so as to adjust the amount of refrigerant flowing through the injection pipe.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: March 21, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koji Yamashita, Hiroyuki Morimoto, Katsuhiro Ishimura, Shinichi Wakamoto, Naofumi Takenaka
  • Publication number: 20170074577
    Abstract: Provided are a refrigeration cycle that is formed by connecting a compressor, a condenser, expansion means, and an evaporator and that performs cooling operation; an evaporator heating device that heats the evaporator; a drain pan that receives drain-water from the evaporator and drains the drain-water; a drain-pan heating device that heats the drain pan; frost detecting means including a light-emitting element that emits light to the evaporator and a light-receiving element that receives reflected light from the evaporator and outputs a voltage according to the reflected light; and a control device that controls on-off operation of the evaporator heating device and the drain-pan heating device. The control device determines a frosting condition on the evaporator from an output of the frost detecting means and individually controls the evaporator heating device and the drain-pan heating device in accordance with the determination result.
    Type: Application
    Filed: November 23, 2016
    Publication date: March 16, 2017
    Inventors: Mamoru HAMADA, Fumitake UNEZAKI, Akira MORIKAWA, Satoshi UEYAMA, Koji YAMASHITA, Hiroyuki MORIMOTO, Yuji MOTOMURA, Tetsuya YAMASHITA, Yusuke OTSUBO
  • Patent number: 9593872
    Abstract: A heat pump capable of operating in a high COP state even if influx temperature of a medium to be heated flowing into the radiators has increased. The heat pump includes a compressor, a first radiator, a second radiator, an expansion valve, and an evaporator sequentially connected by refrigerant piping to form a first refrigeration cycle, in which a first refrigerant circulates in the first refrigeration cycle, and in which the first radiator and the second radiator are serially connected. A first heat exchange unit that heats the first refrigerant is provided in a refrigerant piping at a refrigerant inlet side of the second radiator, and a second heat exchange unit that cools the first refrigerant is provided in a refrigerant piping at a refrigerant outlet side of the second radiator.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: March 14, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Naofumi Takenaka, Shinichi Wakamoto, Koji Yamashita, Hiroyuki Morimoto, Takeshi Hatomura, Yusuke Shimazu
  • Patent number: 9587861
    Abstract: In an air-conditioning apparatus, an expansion device, a second refrigerant flow switching device, and heat exchangers related to heat medium, connected between the expansion device and the second refrigerant flow switching device such that a heat source side refrigerant flows in parallel, are connected in a part of refrigerant passages, and an expansion device, a second refrigerant flow switching device, and heat exchangers related to heat medium, connected between the expansion device and the second refrigerant flow switching device such that the heat source side refrigerant flows in series, are connected in the rest of the refrigerant passages.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: March 7, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Yamashita, Hiroyuki Morimoto, Yuji Motomura, Junichi Ue, Shinichi Wakamoto, Naofumi Takenaka
  • Patent number: 9587843
    Abstract: A refrigeration cycle is configured by connecting a compressor, a four-way valve, a heat source side heat exchanger, expansion valves, and intermediate heat exchangers by piping. A heat medium circulation circuit is configured by connecting intermediate heat exchangers, pumps, and use side heat exchangers by piping. The outdoor unit accommodates the compressor, the four-way valve, and the heat source side heat exchanger, and the relay unit that is installed in a non-subject space which is different from an indoor space and is on an installation floor separated by two or more floors and accommodates the expansion valves, the pump, and intermediate heat exchangers are connected by two pipelines. The relay unit and an indoor unit that accommodates use side heat exchangers and is installed at a position where an indoor space can be air-conditioned are connected by two pipelines.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: March 7, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Yamashita, Hiroyuki Morimoto, Yuji Motomura, Takeshi Hatomura, Naoki Tanaka, Shinichi Wakamoto, Takashi Okazaki, Yusuke Shimazu