Patents by Inventor Hiroyuki Oda
Hiroyuki Oda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12110422Abstract: Provided are a polishing method and a polishing composition that are applied to polishing of silicon carbide and allows reduction of rise in pH of the polishing composition and increase in pad temperature during polishing Provided is a method of polishing an object to be polished having a surface formed of silicon carbide. The method includes steps of preparing a polishing composition, and supplying the polishing composition to the object to be polished and polishing the object to be polished. The polishing composition contains permanganate, a metal salt A, and water. The metal salt A is a salt of a metal cation having a pKa of less than 7.0 in form of a hydrated metal ion, and an anion.Type: GrantFiled: December 5, 2023Date of Patent: October 8, 2024Assignee: FUJIMI INCORPORATEDInventors: Yuichiro Nakagai, Hiroyuki Oda, Yasuaki Ito, Shogaku Ide, Shinichiro Takami
-
Publication number: 20240316520Abstract: An ammonia decomposition system includes: a reactor filled with a catalyst for a decomposition reaction where ammonia which is a raw material is decomposed into hydrogen and nitrogen; and a diluent gas supply line for supplying a diluent gas having a lower ammonia concentration than the raw material, such that the diluent gas is mixed with the raw material before the raw material flows into the catalyst.Type: ApplicationFiled: December 7, 2021Publication date: September 26, 2024Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Masakazu Sakaguchi, Shinya Tachibana, Hiroyuki Furuichi, Takahito Yonekawa, Erika Oda, Hiromi Ishii
-
Publication number: 20240199915Abstract: Provided is a polishing composition containing an abrasive, permanganate, an aluminum salt, and water. In the polishing composition, a relation of a content W1 [% by weight] of the abrasive, a concentration C1 [mM] of the permanganate, and a concentration C2 [mM] of the aluminum salt satisfies at least one condition of the following conditions [A], [B], and [C]: satisfying both of 500?(C1/W1) and 0.04?(C2/C1);??[A] satisfying both of 200?(C1/?(W1)) and 8?C2; and??[B] satisfying both of 500?(C1/W1) and 8?C2.Type: ApplicationFiled: February 2, 2022Publication date: June 20, 2024Inventors: Yuichiro Nakagai, Yasuaki ITO, Hiroyuki ODA, Shogaku IDE, Shinichiro TAKAMI
-
Publication number: 20240181422Abstract: Provided is a method for producing an organic compound, said method including a step for repeating an operation in which a liquid containing an organic solvent is passed through a packed column packed with magnesium, a material containing an organic halide being added to the liquid before it is passed through. Further provided is a device for producing an organic compound, said device comprising: a packed column which is packed with magnesium; a liquid passing unit which repeats an operation in which a liquid containing an organic solvent is passed through the packed column; and a material adding unit which adds a material containing an organic halide to the liquid before it is passed through.Type: ApplicationFiled: April 19, 2022Publication date: June 6, 2024Applicant: TOKUYAMA CORPORATIONInventors: Ryosuke NISHIMOTO, Hiroyuki ODA, Daisuke ABIKO, Wataru ICHINOSE, Takenori ISOMURA
-
Publication number: 20240117219Abstract: Provided is a polishing composition that can reduce increase in temperature of a polishing pad during polishing. The polishing composition provided by the present invention contains water, oxidant A selected from compounds other than peroxide, a first metal salt selected from alkaline-earth metal salts, and a second metal salt selected from salts each of which has a cation of a metal belonging to groups 3 to 16 in the periodic table, and an anion.Type: ApplicationFiled: February 2, 2022Publication date: April 11, 2024Inventors: Yasuaki ITO, Hiroyuki ODA, Yuichiro NAKAGAI, Shogaku IDE, Naoto NOGUCHI, Shinichiro TAKAMI
-
Publication number: 20240117218Abstract: Provided are a polishing method and a polishing composition that are applied to polishing of silicon carbide and allows reduction of rise in pH of the polishing composition and increase in pad temperature during polishing. Provided is a method of polishing an object to be polished having a surface formed of silicon carbide. The method includes steps of preparing a polishing composition, and supplying the polishing composition to the object to be polished and polishing the object to be polished. The polishing composition contains permanganate, a metal salt A, and water. The metal salt A is a salt of a metal cation having a pKa of less than 7.0 in form of a hydrated metal ion, and an anion.Type: ApplicationFiled: February 2, 2022Publication date: April 11, 2024Inventors: Yuichiro NAKAGAI, Hiroyuki ODA, Yasuki ITO, Shogaku IDE, Shinichiro TAKAMI
-
Publication number: 20240110080Abstract: Provided is a polishing composition containing an abrasive, permanganate, an aluminum salt, and water. In the polishing composition, a relation of a content W1 [% by weight] of the abrasive, a concentration C1 [mM] of the permanganate, and a concentration C2 [mM] of the aluminum salt satisfies at least one condition of the following conditions [A], [B], and [C]: satisfying both of 500?(C1/W1) and 0.04?(C2/C1);??[A] satisfying both of 200?(C1/?(W1)) and 8?C2; and??[B] satisfying both of 500?(C1/W1) and 8?C2.Type: ApplicationFiled: December 5, 2023Publication date: April 4, 2024Inventors: Yuichiro NAKAGAI, Yasuaki ITO, Hiroyuki ODA, Shogaku IDE, Shinichiro TAKAMI
-
Publication number: 20240101867Abstract: Provided are a polishing method and a polishing composition that are applied to polishing of silicon carbide and allows reduction of rise in pH of the polishing composition and increase in pad temperature during polishing Provided is a method of polishing an object to be polished having a surface formed of silicon carbide. The method includes steps of preparing a polishing composition, and supplying the polishing composition to the object to be polished and polishing the object to be polished. The polishing composition contains permanganate, a metal salt A, and water. The metal salt A is a salt of a metal cation having a pKa of less than 7.0 in form of a hydrated metal ion, and an anion.Type: ApplicationFiled: December 5, 2023Publication date: March 28, 2024Inventors: Yuichiro NAKAGAI, Hiroyuki ODA, Yasuaki ITO, Shogaku IDE, Shinichiro TAKAMI
-
Publication number: 20230063355Abstract: According to the present invention, there is provided a polishing composition used for polishing a gallium compound-based semiconductor substrate. The polishing composition includes a silica abrasive; a compound Cpho having a phosphoric acid group or a phosphonic acid group; and water. In addition, according to the present invention, there is provided a method for polishing a gallium compound-based semiconductor substrate. The method includes a first polishing step in which polishing is performed using a slurry S1 containing an abrasive A1 and water; and a second polishing step in which polishing is performed using a slurry S2 containing an abrasive A2 and water, in this order. The abrasive A2 contains a silica abrasive. The slurry S2 further contains a compound Cpho having a phosphoric acid group or a phosphonic acid group.Type: ApplicationFiled: October 28, 2022Publication date: March 2, 2023Inventors: Hiroyuki Oda, Hiroki Kon, Naoto Noguchi, Shinichiro Takami
-
Publication number: 20230050880Abstract: Provided is a method for producing a halogenated hydrocarbon magnesium compound, the method including bringing a halogenated hydrocarbon compound into contact with magnesium having a specific surface area of 1×10?5 to 2×10?4 m2/g. Also provided are methods for producing a tertiary alcohol compound and an organosilicon compound, wherein said production method is utilized.Type: ApplicationFiled: January 21, 2021Publication date: February 16, 2023Applicant: TOKUYAMA CORPORATIONInventors: Hiroyuki Oda, Ryosuke Nishimoto, Daisuke Abiko, Takenori Isomura
-
Patent number: 11319460Abstract: Provided is a polishing composition that can effectively improve a polishing removal rate. According to the present invention, a polishing composition for polishing a polishing target material is provided. The polishing composition contains water, an oxidant, and a polishing removal accelerator, and does not contain abrasive. At least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt is contained as the polishing removal accelerator.Type: GrantFiled: March 19, 2018Date of Patent: May 3, 2022Assignee: FUJIMI INCORPORATEDInventors: Yasuaki Ito, Hiroyuki Oda, Naoto Noguchi
-
Publication number: 20220089911Abstract: Provided is a polishing composition that can effectively improve a polishing removal rate. According to the present invention, a polishing composition for polishing a polishing target material is provided. The polishing composition contains water, an oxidant, and a polishing removal accelerator, and does not contain abrasive. At least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt is contained as the polishing removal accelerator.Type: ApplicationFiled: December 3, 2021Publication date: March 24, 2022Applicant: FUJIMI INCORPORATEDInventors: Yasuaki ITO, Hiroyuki ODA, Naoto NOGUCHI
-
Publication number: 20210276458Abstract: A controller, which serves as a pressure-feeding control portion, drives an air pump to pressure-feed air to massage airbags located in a seat. In addition, the controller, which serves as an inflation-deflation control portion, performs massage control that inflates and deflates the airbags while keeping the air pump driven by controlling the operation of intake-discharge valves in second flow passage (branch lines), which connects the air pump to the airbags. Furthermore, the controller, which serves as a decompression control portion, opens a discharge valve, which is located upstream of the intake-discharge valves, in a state in which the airbags are deflated during the massage control.Type: ApplicationFiled: September 28, 2017Publication date: September 9, 2021Applicants: Aisin Seiki Kabushiki Kaisha, Toyota Jidosha Kabushiki KaishaInventors: Yuki FUJII, Akiyoshi SHIBATA, Hiroyuki ODA, Shunsuke HAYAKAWA, Shunsuke TANAKA, Shinichiro KOMAKI, Kenji HASHIMOTO
-
Patent number: 10953469Abstract: A metal powder having a BET specific surface area of 5 to 250 m2/g is obtained by contacting and mixing together a gas of a metal chloride (metal source gas) and a reducing gas (e.g., hydrogen gas) that have been separately heated so as to instantaneously form fine metal particles based on the gas phase reduction reaction thereof, and collecting the fine metal particles from the gas stream after the reaction.Type: GrantFiled: April 7, 2017Date of Patent: March 23, 2021Assignee: TOKUYAMA CORPORATIONInventors: Hiroyuki Oda, Naoto Mochizuki
-
Publication number: 20210024781Abstract: According to the present invention, there is provided a polishing composition used for polishing a gallium compound-based semiconductor substrate. The polishing composition includes a silica abrasive; a compound Cpho having a phosphoric acid group or a phosphonic acid group; and water. In addition, according to the present invention, there is provided a method for polishing a gallium compound-based semiconductor substrate. The method includes a first polishing step in which polishing is performed using a slurry S1 containing an abrasive A1 and water; and a second polishing step in which polishing is performed using a slurry S2 containing an abrasive A2 and water, in this order. The abrasive A2 contains a silica abrasive. The slurry S2 further contains a compound Cpho having a phosphoric acid group or a phosphonic acid group.Type: ApplicationFiled: March 22, 2019Publication date: January 28, 2021Inventors: Hiroyuki ODA, Hiroki KON, Naoto NOGUCHI, Shinichiro TAKAMI
-
Publication number: 20200109313Abstract: Provided is a polishing composition that can effectively improve a polishing removal rate. According to the present invention, a polishing composition for polishing a polishing target material is provided. The polishing composition contains water, an oxidant, and a polishing removal accelerator, and does not contain abrasive. At least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt is contained as the polishing removal accelerator.Type: ApplicationFiled: March 19, 2018Publication date: April 9, 2020Applicant: FUJIMI INCORPORATEDInventors: Yasuaki ITO, Hiroyuki ODA, Naoto NOGUCHI
-
Publication number: 20200023800Abstract: A vehicle seat device includes a reproduction control portion configured to inflate an airbag provided in a seat based on an internal pressure target value, an occupant detection portion configured to detect a seated state in which an occupant is seated on the seat, a body size detection portion configured to detect a size of the occupant, and a correction amount calculation portion configured to calculate, based on the size of the occupant, a correction amount to be used to correct the internal pressure target value in a non-seated state in which the occupant is not seated on the seat.Type: ApplicationFiled: October 5, 2017Publication date: January 23, 2020Applicants: AISIN SEIKI KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yuki FUJII, Akiyoshi SHIBATA, Hiroyuki ODA, Shunsuke HAYAKAWA, Shunsuke TANAKA, Shinichiro KOMAKI, Kenji HASHIMOTO
-
Patent number: 10406939Abstract: A pneumatic pressure control method for a vehicle seat includes: repeatedly detecting an internal pressure of a bladder provided inside the vehicle seat at intervals; correcting the internal pressure of the bladder based on a differential pressure between a detection value and a target value; and lengthening a detection interval to detect the internal pressure depending on a time elapsing from starting of the vehicle.Type: GrantFiled: March 23, 2017Date of Patent: September 10, 2019Assignees: AISIN SEIKI KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Akiyoshi Shibata, Yuki Fujii, Hiroyuki Oda, Shunsuke Hayakawa, Shunsuke Tanaka, Kenji Hashimoto, Shinichiro Komaki
-
Patent number: 10315547Abstract: A vehicle seat device includes: a plurality of air bags configured to be provided inside a seat; a flow path having a shared section to communicate with each of the air bags; a plurality of intake valves each of which is arranged at a flow path position at an upstream of each of the air bags when air is pumped into each of the air bags; a plurality of exhaust valves arranged at flow path positions communicating with the shared section; and a control device configured to control operations of the intake valves and the exhaust valves, in which the control device adjusts a discharge speed of internal air by selectively opening the exhaust valves when the internal air of each of the air bags is discharged.Type: GrantFiled: June 19, 2017Date of Patent: June 11, 2019Assignee: AISIN SEIKI KABUSHIKI KAISHAInventors: Akiyoshi Shibata, Yuki Fujii, Hiroyuki Oda, Shunsuke Hayakawa
-
Publication number: 20190152372Abstract: A pneumatic control device for a vehicle seat includes a forcible-delivery control unit, an opening-closing control unit, and a residual pressure release control unit. The forcible-delivery control unit drives an air pump to forcibly deliver air to an airbag, which is provided in a seat. The opening-closing control unit opens and closes an inlet valve, which is provided in a passage of the air. The passage is in communication with the airbag. The residual pressure release control unit opens an outlet valve provided in the passage on an upstream side of the inlet valve after driving of the air pump is stopped, thereby releasing the air sealed on the upstream side of the inlet valve in a closed state from the passage.Type: ApplicationFiled: March 27, 2017Publication date: May 23, 2019Applicant: AISIN SEIKI KABUSHIKI KAISHAInventors: Yuki FUJII, Akiyoshi SHIBATA, Hiroyuki ODA, Shunsuke HAYAKAWA