Abstract: An authentication method for authenticating an electronic ticket stored in a portable information device by an authentication apparatus, including a step of acquiring, by the portable information device, shared information that is sharable with the authentication apparatus when authentication of the electronic ticket is performed, a step of generating, by the portable information device, a bar code based on the acquired shared information and the electronic ticket, a step of displaying the bar code by the portable information device, a step of reading, by the authentication apparatus, the electronic ticket and the shared information from the bar code displayed on the portable information device, and a step of performing, by the authentication apparatus, the authentication of the electronic ticket by making a comparison between contents of the shared information read from the bar code together with the electronic ticket and shared information in the authentication apparatus.

Abstract: An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.

Abstract: An authentication method for authenticating an electronic ticket stored in a portable information device by an authentication apparatus, including a step of acquiring, by the portable information device, shared information that is sharable with the authentication apparatus when authentication of the electronic ticket is performed, a step of generating, by the portable information device, a bar code based on the acquired shared information and the electronic ticket, a step of displaying the bar code by the portable information device, a step of reading, by the authentication apparatus, the electronic ticket and the shared information from the bar code displayed on the portable information device, and a step of performing, by the authentication apparatus, the authentication of the electronic ticket by making a comparison between contents of the shared information read from the bar code together with the electronic ticket and shared information in the authentication apparatus.

Abstract: A high-side switching element is provided between a main output terminal having an intermediate potential and a high-side terminal. A signal transmission circuit includes a first point, a second point, a signal switching element, and a diode. The intermediate potential is applied to the first point. A referred potential between the low-side potential and the high-side potential is applied to the second point. The signal switching element has a first end connected to the first point and a second end, and is switched in accordance with a conversion signal. The diode is provided between the second point and the second end of the signal switching element and has a direction with which a forward current can flow by a voltage between the first point and the second point in a case where the intermediate potential is the low-side potential.

Abstract: In order to provide a novel cancer treatment method using a FTD?TPI combination drug that exhibits markedly excellent anti-tumor effects with fewer side effects, the present invention provides an anti-tumor agent characterized in that the FTD?TPI combination drug and an anti-tumor platinum complex are administered in combination.

Abstract: Provided is a novel method for treating a cancer using an FTD/TPI combination drug, which shows remarkably excellent antitumor effect and small adverse effects. An antitumor agent, in which a combination drug containing trifluridine and tipiracil hydrochloride at a molar ratio of 1:0.5 and an anti-VEGF antibody or anti-EGFR antibody are administered in combination.

Abstract: In order to provide a novel cancer treatment method using a FTD-TPI combination drug that exhibits markedly excellent anti-tumor effects with fewer side effects, the present invention provides an anti-tumor agent characterized in that the FTD-TPI combination drug and an anti-tumor platinum complex are administered in combination.

Abstract: In order to provide a novel cancer treatment method using a FTD•TPI combination drug that exhibits markedly excellent anti-tumor effects with fewer side effects, the present invention provides an anti-tumor agent characterized in that the FTD•TPI combination drug and a taxane compound are administered in combination.

Abstract: Provided is a novel combination therapy using an FTD/TPI combination drug which exhibits remarkable antitumor effects, and few side effects. An antitumor agent is characterized in that one cycle of an administration schedule, in which, in a period of 14 days, the FTD/TPI combination drug is administered on days 1 to 5, and CPT-11 is administered on day 1, is repeated at least once.

Abstract: Provided is a novel combination therapy using an FTD/TPI combination drug which exhibits remarkable antitumor effects, and few side effects. An antitumor agent is characterized in that the FTD/TPI combination drug is administered, using a reduced amount of trifluridine, at a dose in the range of 35 to 70 mg/m2/day and CPT-11 is administered at a dose in the range of 45 to 144 mg/m2/day.

Abstract: A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a sealing resin, and an unevenness is introduced on a bonding interface between the surface of the die pad and the semiconductor chip.

Abstract: Provided is a novel method for treating a cancer using an FTD/TPI combination drug, which shows remarkably excellent antitumor effect and small adverse effects. An antitumor agent, in which a combination drug containing trifluridine and tipiracil hydrochloride at a molar ratio of 1:0.5 and an anti-VEGF antibody or anti-EGFR antibody are administered in combination.

Abstract: This invention provides a method for predicting a therapeutic effect of chemotherapy that uses an antitumor agent comprising ?,?,?-trifluorothymidine and 5-chloro-6-(1-(2-iminopyrrolidinyl)methyl)uracil hydrochloride at a molar ratio of 1:0.5 on a colorectal cancer patient, the method comprising: (1) detecting the presence or absence of KRAS gene mutation in a biological sample obtained from the patient; and (2) predicting that the patient is likely to sufficiently respond to the chemotherapy, when KRAS gene mutation is detected in Step (1).

Abstract: A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic member having one end engaging with the case and an opposite end in abutting contact with the heat sink. The elastic member forms a gap between the case and the heat sink, and heat conductive grease is appliable to the gap to be interposed between the case and the heat sink.

Abstract: Provided is a novel combination therapy using an FTD/TPI combination drug which exhibits remarkable antitumor effects, and few side effects. An antitumor agent is characterized in that the FTD/TPI combination drug is administered, using a reduced amount of trifluridine, at a dose in the range of 35 to 70 mg/m2/day and CPT-11 is administered at a dose in the range of 45 to 144 mg/m2/day.

Abstract: Provided is a novel combination therapy using an FTD/TPI combination drug which exhibits remarkable antitumor effects, and few side effects. An antitumor agent is characterized in that one cycle of an administration schedule, in which, in a period of 14 days, the FTD/TPI combination drug is administered on days 1 to 5, and CPT-11 is administered on day 1, is repeated at least once.

Abstract: An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.

Abstract: An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.

Abstract: A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.

Abstract: A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a sealing resin, and an unevenness is introduced on a bonding interface between the surface of the die pad and the semiconductor chip.