Abstract: A method includes forming an emission pattern on an organic electroluminescent element including an organic functional layer between two electrodes by light irradiation to the organic electroluminescent element, and controlling at least one of light intensity and exposure time as variable factors during the light irradiation based on reciprocity failure characteristics involving modification of a function of the organic functional layer due to the light irradiation.

Abstract: The present invention provides a scanning optical system and radar that can suppress longitudinal distortion and spot rotation of a spot light radiated on an object. A light flux emitted from a light source is reflected on a first mirror surface of a mirror unit, then, proceeds to a second mirror surface, further is reflected on the second mirror surface, and is projected so as to scan on an object correspondingly to rotation of the mirror unit. The light flux emitted from the light projecting system is made longer in a sub scanning angle direction than in a scanning angle direction in a measurement range of the object and satisfies the following conditional expression, |·1?90|×|·|·255 . . . (1); in the expression, ˜1 is an intersection angle (°) between the first mirror surface and the second mirror surface, and · is a rotation angle (°).

Abstract: An object of the present invention is to provide a pattern-measuring apparatus and a semiconductor-measuring system which are able to obtain an evaluation result for suitably selecting processing with respect to a semiconductor device. In the present invention for attaining the object described above, there is proposed a pattern-measuring apparatus including an arithmetic device which compares a circuit pattern of an electronic device with a reference pattern, in which the arithmetic device classifies the circuit pattern in processing unit of the circuit pattern on the basis of a comparison of a measurement result between the circuit pattern and the reference pattern with at least two threshold values.

Abstract: The purpose of the present invention is to provide an image processing apparatus and a computer program such that correspondence points between design data and an edge line or between edge lines can be accurately identified for their matching. In an embodiment for achieving the purpose, when positioning between a first pattern formed by a first line segment and a second pattern formed by a second line segment is performed, a first correspondence point and a second correspondence point are set on the first line segment and the second line segment, respectively; a degree of alignment for performing the positioning of the first pattern and the second pattern is calculated on the basis of the distance between the first correspondence point and the second correspondence point; and the position of the first correspondence point and/or the second correspondence point is changed in accordance with a shape difference between the first line segment and the second line segment (see FIG. 2).

Abstract: Provided is a pattern inspecting and measuring device that decreases the influence of noise and the like and increases the reliability of an inspection or measurement result during inspection or measurement using the position of an edge extracted from image data obtained by imaging a pattern as the object of inspection or measurement. For this purpose, in the pattern inspecting and measuring device in which inspection or measurement of an inspection or measurement object pattern is performed using the position of the edge extracted, with the use of an edge extraction parameter, from the image data obtained by imaging the inspection or measurement object pattern, the edge extraction parameter is generated using a reference pattern having a shape as an inspection or measurement reference and the image data.

Abstract: An error of an outline point due to a brightness fluctuation cannot be corrected by a simple method such as a method of adding a certain amount of offset. However, in recent years as the miniaturization of the pattern represented by a resist pattern has progressed, it has been difficult to appropriately determine a region that serves as a reference. An outline of the resist pattern is extracted from an image of the resist pattern obtained by a charged particle beam apparatus in consideration of influence of the brightness fluctuation. That is, a plurality of brightness profiles in the vicinity of edge points configuring the outline are obtained and an evaluation value of a shape of the brightness profile in the vicinity of a specific edge is obtained based on the plurality of brightness profiles, and the outline of a specific edge point is corrected, based on the evaluation value.

Abstract: A pattern measurement device includes: a storage section storing mask edge data of a circuit pattern and image data obtained by imaging the circuit pattern; an SEM contour extracting section receiving the image data, SEM contour of the circuit pattern, and cause an exposure simulator to generate estimated SEM contour data of an estimated SEM contour on the basis of the mask edge data and SEM contour data of the extracted SEM contour; a shape classifying section receiving the mask edge data, the SEM contour data, and the estimated contour data to classify the SEM contour data and the estimated SEM contour data into a one-dimensionally shaped contour and a two-dimensionally shaped contour; and an SEM contour sampling section receiving the SEM contour data and the estimated SEM contour data to sample the SEM contour data on the basis of types of the one-dimensionally and two-dimensionally shaped contours.

Abstract: The present invention provides a pattern measuring apparatus (600) that: acquires the image contour of a circuit pattern formed by transferring design data; classifies the acquired image contour into shape structures; calculates normal vectors for each shape structure; maps the shape structures to the image contour; uses at least one normal direction for each shape structure to stabilize the normal directions to the image contour; and uses the normal vectors for each shape structure to determine the position of a SEM contour.

Abstract: An object of the invention is to provide a pattern measuring device for generating appropriate reference pattern data while suppressing an increase in the manufacturing cost that would occur when manufacturing conditions are finely changed. A pattern measuring device has an arithmetic processing unit for measuring a pattern formed on a sample. The arithmetic processing unit, on the basis of signals obtained with a charged particle beam device, acquires or generates image data or contour line data on a plurality of circuit patterns created under different manufacturing conditions of a manufacturing apparatus, and generates reference data to be used for measurement of a circuit pattern from the image data or contour line data.

Abstract: The present invention provides a semiconductor evaluation device for fabricating a suitable reference pattern utilized in comparison tests. The semiconductor evaluation device and computer program extract a process window in a more accurate range based on a two-dimensional evaluation of the pattern. In order to achieve the above described objects, the present invention includes a semiconductor evaluation device that measures the dimensions of the pattern formed over the sample based on a signal obtained by way of a charged particle beam device, selects a pattern whose dimensional measurement results satisfy specified conditions or exposure conditions when the pattern is formed, and forms synthesized contour data, by synthesizing contour data obtained from images of an identically shaped pattern in design data, and also a pattern formed under the selected exposure conditions or a pattern having a positional relation that is already known relative to the selected pattern.

Abstract: A pattern measurement device includes: a storage section storing mask edge data of a circuit pattern and image data obtained by imaging the circuit pattern; an SEM contour extracting section receiving the image data, SEM contour of the circuit pattern, and cause an exposure simulator to generate estimated SEM contour data of an estimated SEM contour on the basis of the mask edge data and SEM contour data of the extracted SEM contour; a shape classifying section receiving the mask edge data, the SEM contour data, and the estimated contour data to classify the SEM contour data and the estimated SEM contour data into a one-dimensionally shaped contour and a two-dimensionally shaped contour; and an SEM contour sampling section receiving the SEM contour data and the estimated SEM contour data to sample the SEM contour data on the basis of types of the one-dimensionally and two-dimensionally shaped contours.

Abstract: A screen in which observation distance may be adjusted while maintaining image brightness and a projection system using the screen. In a light control layer of a screen, a first angle region that determines a diffusion distribution of a reflected light is different according to the screen position in a control direction in which light diffusion control is performed. Accordingly, a diffusion distribution of image light emitted from a screen surface is adjusted to be tilted downward by an upper end and upward by a lower end according to the screen position. Thus, for example, a size of a diffused angle range is maintained to be 30°, and a direction in which the image light is diffusion-emitted corresponds to an assumed position of an observer. The projection image can be observed while maintaining brightness of an image and the observation distance L can be adjusted to be short.

Abstract: A sensor element is formed by cutting a laminated body and heating with the cutting taking place in a state where a difference in resistance on sides of a cutting component is as small as possible. That is, a uniform cutting is where resistance added to both sides of the cutting component is substantially the same. When uniform cutting cannot be performed, a nonuniform cutting in a state where resistance added to both sides of the cutting component is different is performed. Consequently, a surface perpendicular to a longitudinal direction of the sensor element is trapezoidal.

Abstract: A screen which reflects light emitted from a projector includes a light diffusion layer through which light incident from a specific angular region is diffused and transmitted and through which light incident from the other angular region is transmitted straight; area pairs having a mirror forming area and a non-mirror forming area; a light transmissive layer having a back surface, on which the area pairs are disposed, and an opposite surface being bonded to a back side of the light diffusion layer; and a specular reflection film formed on a back surface of each mirror forming area. An inclination of the mirror forming area with respect to a normal line of the screen close to the projector becomes larger than the inclination of the mirror forming area far from the projector within a cross section perpendicular to the mirror forming areas inside the screen.

Abstract: A method for manufacturing a gas sensor element includes (a) printing a wiring pattern of a conductive paste on a green sheet for an oxygen-ion conductive solid electrolyte; (b) laminating a plurality of green sheets including the green sheet having been subjected to step (a) and integrating the plurality of green sheets; (c) cutting out a plurality of element bodies from the laminated body; (d) baking the element body cut out by step (c); (e) heating the element body having been subjected to step (d), in a reducing atmosphere; (f) driving the element body having been subjected to step (e), in an inspection-purpose gas atmosphere for a predetermined time period; and (g) inspecting electrical characteristics of the element body having been subjected to step (f). The element body having passed the inspection of step (g) is assembled as a sensor element in a gas sensor.

Abstract: The present invention provides a pattern measuring apparatus (600) that: acquires the image contour of a circuit pattern formed by transferring design data; classifies the acquired image contour into shape structures; calculates normal vectors for each shape structure; maps the shape structures to the image contour; uses at least one normal direction for each shape structure to stabilize the normal directions to the image contour; and uses the normal vectors for each shape structure to determine the position of a SEM contour.

Abstract: A scanning electron microscope comprises an image processing system for carrying out a pattern matching between a first image and a second image. The image processing system comprises: a paint-divided image generator for generating a paint divided image based on the first image; a gravity point distribution image generator for carrying out a smoothing process of the paint divided image and generating a gravity point distribution image; an edge line segment group generation unit for generating a group of edge line segments based on the second image; a matching score calculation unit for calculating a matching score based on the gravity point distribution image and the group of edge line segments; and a maximum score position detection unit for detecting a position where the matching score becomes the maximum.

Abstract: A screen in which observation distance may be adjusted while maintaining image brightness and a projection system using the screen. In a light control layer of a screen, a first angle region that determines a diffusion distribution of a reflected light is different according to the screen position in a control direction in which light diffusion control is performed. Accordingly, a diffusion distribution of image light emitted from a screen surface is adjusted to be tilted downward by an upper end and upward by a lower end according to the screen position. Thus, for example, a size of a diffused angle range is maintained to be 30°, and a direction in which the image light is diffusion-emitted corresponds to an assumed position of an observer. The projection image can be observed while maintaining brightness of an image and the observation distance can be adjusted to be short.

Abstract: The purpose of the present invention is to provide an image processing apparatus and a computer program such that correspondence points between design data and an edge line or between edge lines can be accurately identified for their matching. In an embodiment for achieving the purpose, when positioning between a first pattern formed by a first line segment and a second pattern formed by a second line segment is performed, a first correspondence point and a second correspondence point are set on the first line segment and the second line segment, respectively; a degree of alignment for performing the positioning of the first pattern and the second pattern is calculated on the basis of the distance between the first correspondence point and the second correspondence point; and the position of the first correspondence point and/or the second correspondence point is changed in accordance with a shape difference between the first line segment and the second line segment (see FIG. 2).

Abstract: An optical pickup apparatus includes an objective lens having a numeric aperture and an incident face. An antireflection coating is formed on the incident face. A collimating lens converts laser light from a laser diode into parallel light, and causes the parallel light to be made incident on the incident face through the antireflection coating. The thickness of the antireflection coating causes a transmittance of laser light that enters the objective lens to be: set at a first predetermined transmittance value, when the numeric aperture is between zero and a first predetermined numeric aperture value; set to correlate linearly with the numeric aperture when the numeric aperture is between the first predetermined numeric aperture value and a second predetermined numeric aperture value; and set at a second predetermined transmittance value, when the numeric aperture is between the second predetermined numeric aperture value and a third predetermined numeric aperture value.