Abstract: A wafer of the invention is a silicon wafer of 0.02 &OHgr;cm or less in resistivity for deposition of an epitaxial layer, and the number of crystal originated particles (COP) and the number of interstitial-type large dislocation loops (L/D) are respectively 0 to 10 per wafer. A wafer of the invention is an epitaxial wafer having an epitaxial layer being 0.1 &OHgr;cm or more in resistivity and 0.5 to 5 &mgr;m in thickness formed on this wafer by means of a CVD method. A wafer of the invention is OSF-free and hardly makes traces of COP and L/D appear on the surface of an epitaxial layer when the epitaxial layer is formed. By heat treatment in a semiconductor device manufacturing process after the epitaxial layer is formed, BMDs occur uniformly and highly in density in the wafer and a uniform IG effect can be obtained in the wafer.

Abstract: A polyurethane resin having a total concentration of the urethane group and the urea group of not less than 15% by weight is prepared by reacting a diisocyanate component (e.g., an aromatic diisocyanate) with a diol component (e.g., a C2-8alkylene glycol). The repeating unit of the polyurethane resin may contain a constitutive unit of an aromatic or alicyclic compound. The polyurethane resin may be shaped into a film for use as a gas barrier film. The film may be a gas barrier composite film composed of a base film layer and a resin layer at least comprising the polyurethane resin. The present invention provides a polyurethane resin excellent in gas barrier properties against water vapor, oxygen, aromatics, and others, and a film containing the same.

Abstract: A first chopper between a laser device and a semiconductor substrate chops an excitation light at a specific frequency, and a second chopper between the first chopper and the semiconductor substrate chops the excitation light at a variable frequency higher than the first chopper. A photoluminescence light emitted by the semiconductor substrate when the semiconductor substrate is intermittently irradiated with the excitation light is introduced into a monochromator. A controller obtains the decay time constant T of the photoluminescence light from variation of the average intensity of the photoluminescence light when gradually increasing the chopping frequency of the excitation light by controlling the second chopper, and computes the life time &tgr; of the semiconductor substrate from an expression “&tgr;=T/C”, where C is a constant.

Abstract: A wafer of the invention is a silicon wafer of 0.02 &OHgr;cm or less in resistivity for deposition of an epitaxial layer, and the number of crystal originated particles (COP) and the number of interstitial-type large dislocation loops (L/D) are respectively 0 to 10 per wafer. A wafer of the invention is an epitaxial wafer having an epitaxial layer being 0.1 &OHgr;cm or more in resistivity and 0.5 to 5 &mgr;m in thickness formed on this wafer by means of a CVD method. A wafer of the invention is OSF-free and hardly makes traces of COP and L/D appear on the surface of an epitaxial layer when the epitaxial layer is formed. By heat treatment in a semiconductor device manufacturing process after the epitaxial layer is formed, BMDs occur uniformly and highly in density in the wafer and a uniform IG effect can be obtained in the wafer.

Abstract: Polyurethane resin water dispersion being good in storage stability and excellent in initial adhesion and resistance to moist heat, and aqueous polyurethane adhesive employing the polyurethane resin water dispersion. The polyurethane resin water dispersion is produced in the manner that polyisocyanate is allowed to react with polycaprolactone polyol comprising polycaprolactone polyol having a number average molecular weight of not less than 3,000 and active-hydrogen-group-containing compound having anionic group, to synthesize isocyanate terminated prepolymer, first, and, then, the isocyanate terminated prepolymer thus produced is allowed to react with polyamine in water. The use of the polyurethane resin water dispersion can produce the aqueous polyurethane adhesive having improved storage stability, initial adhesion and resistance to moist heat.

Abstract: A first chopper between a laser device and a semiconductor substrate chops an excitation light at a specific frequency, and a second chopper between the first chopper and the semiconductor substrate chops the excitation light at a variable frequency higher than the first chopper. A photoluminescence light emitted by the semiconductor substrate when the semiconductor substrate is intermittently irradiated with the excitation light is introduced into a monochromator. A controller obtains the decay time constant T of the photoluminescence light from variation of the average intensity of the photoluminescence light when gradually increasing the chopping frequency of the excitation light by controlling the second chopper, and computes the life time &tgr; of the semiconductor substrate from an expression “&tgr;=T/C”, where C is a constant.

Abstract: To provide an aqueous emulsion composition which has high adhesion strength for a wide variety of materials including molded products and affords sufficient wettability even for the object to be adhesive bonded of low surface polarity so that it can develop sufficient adhesiveness and whose emulsion is stable so satisfactorily as to provide good mechanical stability and storage stability, and to provide an adherent composition comprising the aqueous emulsion composition, at least ethylene-vinyl acetate copolymer or modified resin thereof, photo polymerization initiator, and unsaturated ethylenic monomer are mixed and dissolved or dispersed, to prepare oil drop component, followed by emulsifying the oil drop component in water by using a surface-active agent, whereby an aqueous emulsion composition, in which micelles each encapsulating at least the ethylene-vinyl acetate copolymer or modified resin thereof, the photo polymerization initiator and unsaturated ethylenic monomer are dispersed in water, is prepared

Abstract: A semiconductor device is provided. The semiconductor device includes a repeater performing buffering operation at some midpoint in a multiplex bus over which an address and data are transmitted by a time division method. The repeater includes a part which transmits only an address when the address does not indicate a data transmission destination which is located ahead of the repeater.

Abstract: A first chopper between a laser device and a semiconductor substrate chops an excitation light at a specific frequency, and a second chopper between the first chopper and the semiconductor substrate chops the excitation light at a variable frequency higher than the first chopper. A photoluminescence light emitted by the semiconductor substrate when the semiconductor substrate is intermittently irradiated with the excitation light is introduced into a monochromator. A controller obtains the decay time constant T of the photoluminescence light from variation of the average intensity of the photoluminescence light when gradually increasing the chopping frequency of the excitation light by controlling the second chopper, and computes the life time &tgr; of the semiconductor substrate from an expression “&tgr;=T/C”, where C is a constant.

Abstract: A semiconductor device is provided. The semiconductor device includes a repeater performing buffering operation at some midpoint in a multiplex bus over which an address and data are transmitted by a time division method. The repeater includes a part which transmits only an address when the address does not indicate a data transmission destination which is located ahead of the repeater.

Abstract: A powder coating composition comprising a multilayer polymer particle, in which at least one inner layer is a polymer layer having a glass transition temperature (Tg) of not over 20° C. and the outermost layer is a polymer layer having a Tg of not less than 60° C. and, the monomer components forming the polymer layer having a Tg of not over 20° C. are those having an unsaturated double bond in the molecule, and among the monomer components, a crosslinking monomer and a grafting monomer are used, respectively, within the ranges of 0.3 to 5 weight % and of 1 to 10 weight %, is dispersed in an amount of 1 to 30 parts by weight per 100 parts by weight of the total components other than the multilayer polymer particle can show excellent dispersibility to various powder coatings and can improve workability and impact resistance of a coat film while maintaining inherent characteristics of a powder coating such as appearance of a coat film and an anti-blocking property.

Abstract: In order to provide a general-purpose aqueous primer composition requiring no organic solvent and capable of improving adhesive strength and durability while ensuring an adequate application life required for the work of primer coating process, a primer composition according to the present invention contains (a) a modified polyisocyanate obtained by reaction of polyisocyanate; an emulsifying agent having an active hydrogen group reactable to an isocyanate group; and a silane coupling agent having an active hydrogen group reactable to an isocyanate group and (b) a core shell emulsion having a core layer of a rubbery polymer and a shell layer of a glassy polymer and having an active hydrogen group reactable to an isocyanate group in the core layer and/or the shell layer.

Abstract: The sulfobetaine-containing resin has much improved affinity for magnetic powders. Therefore, by using the same as a binder, it becomes possible to attain good dispersion of magnetic powders superfine in particle size and/or large in amount of magnetization.The binder can be used advantageously in the manufacture of magnetic recording media, such as magnetic tapes and magnetic disks.

Abstract: Urethane resin having hydrophilic polar groups (mercapto groups) shows excellent dispersibility of magnetic powder when used as a binder for magnetic recording media. Magnetic recording media prepared by using the binder are excellent in surface-smoothness and durability. The mercapto groups contained in the magnetic layer react with isocyanate groups in the polyisocyanate to form thiourethane bonds to leave no hydrophilic polar groups, i.e., mercapto groups, and thus is excellent in moisture- and heat-resistance as well.The resin and the binding agent are advantageously used in the production of magnetic recording media, for example, magnetic tape, magnetic disc, etc.

Abstract: A urethane acrylate resin obtained by reacting a polyisocyanate with a polyester polyol having a molecular weight of 500 to 3,000, a low-molecular-weight polyol having a molecular weight of 60 to 400 and a hydroxyalkyl acrylate containing at least 70 mole % of a monohydroxyalkyl acrylate at an NCO/OH equivalent ratio in the range of 0.7 to 1.20.The composition comprising the above urethane acrylate resin affords crosslinked products having extremely excellent, tough physical properties, and can therefore be advantageously employed, for example, for base coatings for paper and polyethylene films prior to vacuum metallizing, protective coatings after vacuum metallizing, covering materials for electromagnetic tapes and floppy discs, vehicles for printing ink, adhesives, etc.