Patents by Inventor Hiroyuki Takahama
Hiroyuki Takahama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12125728Abstract: Embodiments of a substrate carrier are provided herein. In some embodiments, a substrate carrier includes a base plate, wherein the base plate is a thin, solid plate with no through holes or embedded components; and a plurality of raised portions extending from the base plate, wherein the plurality of raised portions include first raised portions and second raised portions, the first raised portions disposed radially inward from the second raised portions, wherein the base plate and the plurality of raised portions define pockets configured to retain a plurality of substrates, and wherein an upper surface of the second raised portions have a greater surface area than an upper surface of the first raised portions.Type: GrantFiled: January 17, 2020Date of Patent: October 22, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Fred Eric Ruhland, Sumit S. Patankar, Vijay D. Parkhe, Daniel Lee Diehl, Mingwei Zhu, Hiroyuki Takahama, Randy D. Schmieding
-
Publication number: 20220099426Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.Type: ApplicationFiled: November 19, 2021Publication date: March 31, 2022Inventors: Tomoharu MATSUSHITA, Aravind KAMATH, Jallepally RAVI, Cheng-Hsiung TSAI, Hiroyuki TAKAHAMA
-
Patent number: 11251028Abstract: Substrate processing chambers with integrated shutter garage are provided herein. In some embodiments, a pre-clean substrate processing chamber may include a chamber body, wherein the chamber body includes a first side configured to be attached to mainframe substrate processing tool, and a second side disposed opposite the first side, a substrate support configured to support a substrate when disposed thereon, a shutter disk garage disposed on the second side of the process chamber, and a shutter disk assembly mechanism comprising a rotatable shaft, and a robot shutter arm coupled to the shaft, wherein the robot shutter arm includes a shutter disk assembly support section configured to support a shutter disk assembly, and wherein the shutter disk assembly mechanism is configured to move the robot shutter arm between a storage position within the shutter garage and a processing position within the process chamber over the substrate support.Type: GrantFiled: May 7, 2019Date of Patent: February 15, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Cheng-Hsiung Matt Tsai, Ananthkrishna Jupudi, Sarath Babu, Manjunatha P. Koppa, Hiroyuki Takahama
-
Patent number: 11201078Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.Type: GrantFiled: March 24, 2017Date of Patent: December 14, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Tomoharu Matsushita, Aravind Kamath, Jallepally Ravi, Cheng-Hsiung Tsai, Hiroyuki Takahama
-
Publication number: 20200234991Abstract: Embodiments of a substrate carrier are provided herein. In some embodiments, a substrate carrier includes a base plate, wherein the base plate is a thin, solid plate with no through holes or embedded components; and a plurality of raised portions extending from the base plate, wherein the plurality of raised portions include first raised portions and second raised portions, the first raised portions disposed radially inward from the second raised portions, wherein the base plate and the plurality of raised portions define pockets configured to retain a plurality of substrates, and wherein an upper surface of the second raised portions have a greater surface area than an upper surface of the first raised portions.Type: ApplicationFiled: January 17, 2020Publication date: July 23, 2020Inventors: FRED ERIC RUHLAND, SUMIT S. PATANKAR, VIJAY D. PARKHE, DANIEL LEE DIEHL, MINGWEI ZHU, HIROYUKI TAKAHAMA, RANDY D. SCHMIEDING
-
Publication number: 20190348264Abstract: Substrate processing chambers with integrated shutter garage are provided herein. In some embodiments, a pre-clean substrate processing chamber may include a chamber body, wherein the chamber body includes a first side configured to be attached to mainframe substrate processing tool, and a second side disposed opposite the first side, a substrate support configured to support a substrate when disposed thereon, a shutter disk garage disposed on the second side of the process chamber, and a shutter disk assembly mechanism comprising a rotatable shaft, and a robot shutter arm coupled to the shaft, wherein the robot shutter arm includes a shutter disk assembly support section configured to support a shutter disk assembly, and wherein the shutter disk assembly mechanism is configured to move the robot shutter arm between a storage position within the shutter garage and a processing position within the process chamber over the substrate support.Type: ApplicationFiled: May 7, 2019Publication date: November 14, 2019Inventors: Cheng-Hsiung Matt Tsai, Ananthkrishna Jupudi, Sarath Babu, Manjunatha P. Koppa, Hiroyuki Takahama
-
Publication number: 20180233396Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.Type: ApplicationFiled: March 24, 2017Publication date: August 16, 2018Inventors: TOMOHARU MATSUSHITA, ARAVIND KAMATH, JALLEPALLY RAVI, CHENG-HSIUNG TSAI, HIROYUKI TAKAHAMA
-
Patent number: 9095600Abstract: The present invention relates to a novel preventive and/or therapeutic drug for myocardial infarction. The present invention provides a preventive and/or therapeutic drug for myocardial infarction or myocardial ischemia-reperfusion injury, the drug containing a lipid membrane structure retaining adenosine.Type: GrantFiled: September 18, 2009Date of Patent: August 4, 2015Assignees: OSAKA UNIVERSITY, NATIONAL CEREBRAL AND CARDIOVASCULAR CENTER, DAIICHI SANKYO COMPANY, LIMITEDInventors: Tetsuo Minamino, Masafumi Kitakaze, Masatsugu Hori, Hiroyuki Takahama, Hiroshi Kikuchi, Kouichi Hashimoto, Hideo Kobayashi, Ayako Iijima, Daigo Asano
-
Publication number: 20100098753Abstract: The present invention relates to a novel preventive and/or therapeutic drug for myocardial infarction. The present invention provides a preventive and/or therapeutic drug for myocardial infarction or myocardial ischemia-reperfusion injury, the drug containing a lipid membrane structure retaining adenosine.Type: ApplicationFiled: September 18, 2009Publication date: April 22, 2010Applicants: Osaka University, JAPAN AS REP. BY THE PRES. OF NAT'L. CARDIO. CENTR, DAIICHI SANKYO COMPANY, LIMITEDInventors: Tetsuo MINAMINO, Masafumi Kitakaze, Masatsugu Hori, Hiroyuki Takahama, Hiroshi Kikuchi, Kouichi Hashimoto, Hideo Kobayashi, Ayako IIJIMA, Daigo Asano
-
Publication number: 20050194100Abstract: A substrate support is provided that features a lift pin having at least one larger diameter shoulder section that forms a relief region between the lift pin and a guide hole disposed through a substrate support. The shoulder section minimizes contact between the substrate support and lift pin guide hole, thereby reducing pin scratching, particle generation, component wear, and increasing the useful life of the pin. In another embodiment, a flat-bottom tip is provided to promote self-standing of the lift pin, reducing pin tilting or leaning of the lift pin within the guide hole.Type: ApplicationFiled: May 3, 2005Publication date: September 8, 2005Inventors: David Or, Keith Koai, Hiroyuki Takahama, Takahiro Ito, Koji Ota, Hiroshi Sato
-
Patent number: 6887317Abstract: A substrate support is provided that features a lift pin having at least one larger diameter shoulder section that forms a relief region between the lift pin and a guide hole disposed through a substrate support. The shoulder section minimizes contact between the substrate support and lift pin guide hole, thereby reducing pin scratching, particle generation, component wear, and increasing the useful life of the pin. In another embodiment, a flat-bottom tip is provided to promote self-standing of the lift pin, reducing pin tilting or leaning of the lift pin within the guide hole.Type: GrantFiled: September 10, 2002Date of Patent: May 3, 2005Assignee: Applied Materials, Inc.Inventors: David T. Or, Keith K. Koai, Hiroyuki Takahama, Takahiro Ito, Koji Ota, Hiroshi Sato
-
Publication number: 20040045509Abstract: A substrate support is provided that features a lift pin having at least one larger diameter shoulder section that forms a relief region between the lift pin and a guide hole disposed through a substrate support. The shoulder section minimizes contact between the substrate support and lift pin guide hole, thereby reducing pin scratching, particle generation, component wear, and increasing the useful life of the pin. In another embodiment, a flat-bottom tip is provided to promote self-standing of the lift pin, reducing pin tilting or leaning of the lift pin within the guide hole.Type: ApplicationFiled: September 10, 2002Publication date: March 11, 2004Inventors: David T. Or, Keith K. Koai, Hiroyuki Takahama, Takahiro Ito, Koji Ota, Hiroshi Sato
-
Patent number: 5589224Abstract: The present invention provides a shield arrangement that prevents deposition in the area of the chamber surrounding the substrate. This shield arrangement is equipped with a wall-like member which surrounds a substrate, and includes a projecting annular flange and a substrate support which extends in the horizontal direction beyond the substrate, and includes a groove therein. The annular flange is received in the groove to shield the deposition region of the chamber from the remainder of the chamber.Type: GrantFiled: September 22, 1994Date of Patent: December 31, 1996Assignee: Applied Materials, Inc.Inventors: Avi Tepman, Takeshi Jinbo, Hiroyuki Takahama, Akihiko Saito
-
Patent number: 5548964Abstract: A cooling structure for a vacuum device includes an external frame portion positioned between vacuum chamber flange and cryopump flange; a cooling panel formed in a partition surrounded by said external frame, the cooling panel having an opening that allows a fluid flow between said vacuum chamber and said cryopump; a cooling means positioned in contact with an exposed peripheral cooling panel surface for cooling said cooling panel; and a coolant feeding means for supplying coolant to the cooling means.Type: GrantFiled: June 27, 1994Date of Patent: August 27, 1996Assignee: Applied Materials, Inc.Inventors: Takeshi Jinbo, Hiroyuki Takahama
-
Patent number: D568914Type: GrantFiled: March 24, 2006Date of Patent: May 13, 2008Assignee: Applied Materials, Inc.Inventors: David T. Or, Keith K. Koai, Hiroyuki Takahama, Takahiro Ito, Koji Ota, Hiroshi Sato
-
Patent number: D904640Type: GrantFiled: January 21, 2019Date of Patent: December 8, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Fred Eric Ruhland, Sumit S. Patankar, Vijay D. Parkhe, Daniel Lee Diehl, Mingwei Zhu, Hiroyuki Takahama, Randy D. Schmieding