Patents by Inventor Hiroyuki Toyoda

Hiroyuki Toyoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170225705
    Abstract: A steering system includes a motor, a rack shaft, and a nut that is screw-thread on the rack shaft via a plurality of balls. The steering system further includes a reduction mechanism having a driving pulley, a driven pulley, a belt, and an idler pulley that applies tension to the belt. The steering system further includes a housing that houses the motor, the rack shaft, the nut, and the reduction mechanism. Compressive rigidity in an axial direction is set to vary between a near-end area and a far-end area of the housing. The idler pulley is provided so as to contact a portion of the belt which is loosened when end contact occurs at an axial end of the housing where the compressive rigidity is set to a larger value.
    Type: Application
    Filed: January 25, 2017
    Publication date: August 10, 2017
    Applicant: JTEKT CORPORATION
    Inventors: Takashi TOMIKAWA, Hiroyuki TOYODA
  • Publication number: 20170050669
    Abstract: A recessed portion is formed in an inner wall surface of a lower portion of a reduction gear housing (a lower wall in FIG. 2) in the direction of gravity and between a bearing 44 and an outer wall of the reduction gear housing (a right side wall in FIG. 2). The recessed portion is formed to have such a depth that the recessed portion does not penetrate the reduction gear housing. The recessed portion is formed in the reduction gear housing within a given range in a circumferential direction with respect to the axis of a rack shaft serving as the center. A moisture sensor is mounted in the recessed portion to detect water infiltrating into a housing. The moisture sensor has a transmission circuit that operates using a water battery as a power supply source. The water battery generates power when water flows into the water battery.
    Type: Application
    Filed: August 10, 2016
    Publication date: February 23, 2017
    Applicant: JTEKT CORPORATION
    Inventors: Toshihiro ASAKURA, Keisuke OGAWA, Hiroyuki TOYODA
  • Publication number: 20160226172
    Abstract: A socket includes power-supply blade receivers and a grounding blade receiver for retaining power-supply plug blades and a grounding plug blade of a plug, respectively. Each of the power-supply blade receivers includes a power-supply retaining portion and a power-supply contact portion. The grounding blade receiver includes a grounding retaining portion and a grounding contact portion which is installed further on the upstream side in the insertion direction of the plug than a position which is spaced away from the power-supply contact portion to the downstream side in the insertion direction by less than the certain distance. The grounding retaining portion is spaced away by the certain distance or more from the power-supply retaining portion to the downstream side in the insertion direction.
    Type: Application
    Filed: January 15, 2016
    Publication date: August 4, 2016
    Inventors: Hiroyuki TOYODA, Satoru TANAKA, Kiwamu SHIBATA, Noboru HASHIMOTO, Kazuya BABA
  • Publication number: 20150336604
    Abstract: An electric power-steering device 100 comprises a steering mechanism 10, an electric motor 20 which outputs an assist force to this steering mechanism 10, a transmission mechanism 30 which comprises toothed pulleys 31, 32 and a toothed belt 33 and transmits the output power of the electric motor 20 to the steering mechanism 10, and a torque limiter 40 which sets a limit on the extent of the torque transmitted between the electric motor 20 and an output member (11) of the steering mechanism 10. In this electric power-steering device 100, a variation lower limit of a teeth jump torque at which a teeth jump occurs between the toothed pulleys 31, 32 and the toothed belt 33 is set at a value larger than a variation upper limit of a limit torque in the torque limiter 40.
    Type: Application
    Filed: January 24, 2013
    Publication date: November 26, 2015
    Inventors: Shingo URABABA, Hiroyuki TOYODA, Takayuki MATSUNO
  • Publication number: 20150308511
    Abstract: This torque limiter is configured from a ring body and a spring-form part provided in the ring body. The ring body comprises a band-form metal plate and is bent approximately into a C-shape along the circumferential direction of a motor shaft and a lock holder. The spring-form part is formed so as to be capable of radial elastic deformation. The spring-form part is configured from main protrusions arranged in a compressed state between the motor shaft and the lock holder, and from sub-protrusions arranged in a non-compressed state. Further, grease is stored in a part or all of the concavities formed by the main protrusions and the sub-protrusions.
    Type: Application
    Filed: July 7, 2015
    Publication date: October 29, 2015
    Inventors: Toshihiro ASAKURA, Masatoshi FUJIMOTO, Toshiaki OGATA, Yukihiko KANAYAMA, Hirotsune SUZUKI, Yuji NAKAMURA, Yuzo HIRAKAWA, Kenji HAYASHI, Hiroyuki TOYODA
  • Patent number: 9109632
    Abstract: This torque limiter is configured from a ring body and a spring-form part provided in the ring body. The ring body comprises a band-form metal plate and is bent approximately into a C-shape along the circumferential direction of a motor shaft and a lock holder. The spring-form part is formed so as to be capable of radial elastic deformation. The spring-form part is configured from main protrusions arranged in a compressed state between the motor shaft and the lock holder, and from sub-protrusions arranged in a non-compressed state. Further, grease is stored in a part or all of the concavities formed by the main protrusions and the sub-protrusions.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: August 18, 2015
    Assignees: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, TOGO SEISAKUSYO CORPORATION
    Inventors: Toshihiro Asakura, Masatoshi Fujimoto, Toshiaki Ogata, Yukihiko Kanayama, Hirotsune Suzuki, Yuji Nakamura, Yuzo Hirakawa, Kenji Hayashi, Hiroyuki Toyoda
  • Patent number: 8813569
    Abstract: An ultrasonic sensor includes an ultrasonic element. The ultrasonic element includes an ultrasonic oscillator for sending, receiving or transceiving ultrasonic waves, an element body having an opening for passage of ultrasonic waves formed on one surface, the ultrasonic oscillator being arranged within the element body, and terminal portions protruding from the element body to feed an electric current to the ultrasonic oscillator. The ultrasonic sensor further includes a housing having an opening formed on one surface for communication with the opening of the element body. The housing includes a receiving portion for receiving the ultrasonic element and a positioning portion integrally formed with the receiving portion to position the ultrasonic element in place. The ultrasonic sensor includes a printed wiring board arranged to interpose the ultrasonic element between the printed wiring board and the receiving portion. The terminal portions of the ultrasonic element are mounted to the printed wiring board.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: August 26, 2014
    Assignee: Panasonic Corporation
    Inventors: Yutaka Abe, Hiroyuki Toyoda
  • Publication number: 20130324345
    Abstract: This torque limiter is configured from a ring body and a spring-form part provided in the ring body. The ring body comprises a band-form metal plate and is bent approximately into a C-shape along the circumferential direction of a motor shaft and a lock holder. The spring-form part is formed so as to be capable of radial elastic deformation. The spring-form part is configured from main protrusions arranged in a compressed state between the motor shaft and the lock holder, and from sub-protrusions arranged in a non-compressed state. Further, grease is stored in a part or all of the concavities formed by the main protrusions and the sub-protrusions.
    Type: Application
    Filed: February 23, 2012
    Publication date: December 5, 2013
    Applicants: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, TOGO SEISAKUSYO CORPORATION
    Inventors: Toshihiro Asakura, Masatoshi Fujimoto, Toshiaki Ogata, Yukihiko Kanayama, Hirotsune Suzuki, Yuji Nakamura, Yuzo Hirakawa, Kenji Hayashi, Hiroyuki Toyoda
  • Patent number: 8345425
    Abstract: A cooling system for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, has a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenser 320 receives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: January 1, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Hiroyuki Toyoda, Tadakatsu Nakajima, Yoshihiro Kondo, Shigeyuki Sasaki, Akio Idei, Shigemasa Satoh
  • Patent number: 8284640
    Abstract: An optical pickup, having an optical pickup housing made of resin, for maintaining the heat radiation performance or capacity of a semiconductor laser, also an objective lens driving mechanism, and further a driver IC for the semiconductor laser, while keeping small-size and light-weight thereof, comprises a pickup housing, in which an optical part and a semiconductor laser are fixed; an objective lens, which is attached within the pickup housing; and an objective lens driving mechanism, which is configured to drive the objective lens, further comprising: a metal-made bottom cover, which is configured to cover a lower surface of the pickup housing and a side surface of an inner periphery of an optical disc, wherein the metal-made bottom cover and the semiconductor laser are thermally connected with each other.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: October 9, 2012
    Assignee: Hitachi Media Electronics Co., Ltd.
    Inventors: Hiroyuki Toyoda, Takehiro Hayama, Junichi Senga, Hitoshi Matsushima, Takayuki Fujimoto
  • Patent number: 8164902
    Abstract: An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: April 24, 2012
    Assignees: Hitachi, Ltd., Hitachi Plant Technologies, Ltd.
    Inventors: Hitoshi Matsushima, Tadakatsu Nakajima, Takayuki Atarashi, Yoshihiro Kondo, Hiroyuki Toyoda, Tomoo Hayashi, Akio Idei, Shigeyasu Tsubaki, Takumi Sugiura, Yasuhiro Kashirajima
  • Patent number: 8130497
    Abstract: A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: March 6, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiro Kondo, Tadakatsu Nakajima, Akio Idei, Shigeyasu Tsubaki, Hiroyuki Toyoda, Tomoo Hayashi
  • Publication number: 20110277550
    Abstract: The ultrasonic element includes an ultrasonic oscillator for sending, receiving or transceiving ultrasonic waves, an element body having an opening for passage of ultrasonic waves formed on one surface, the ultrasonic oscillator being arranged within the element body, and terminal portions protruding from the element body to feed an electric current to the ultrasonic oscillator. The ultrasonic sensor further includes a housing having an opening formed on one surface for communication with the opening of the element body. The housing includes a receiving portion for receiving the ultrasonic element and a positioning portion integrally formed with the receiving portion to position the ultrasonic element in place. The ultrasonic sensor includes a printed wiring board arranged to interpose the ultrasonic element between the printed wiring board and the receiving portion. The terminal portions of the ultrasonic element are mounted to the printed wiring board.
    Type: Application
    Filed: May 6, 2011
    Publication date: November 17, 2011
    Applicant: Panasonic Electric Works Co., Ltd.
    Inventors: Yutaka ABE, Hiroyuki Toyoda
  • Patent number: 7936560
    Abstract: A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: May 3, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Hiroyuki Toyoda, Akio Idei, Shigeyasu Tsubaki, Tadakatsu Nakajima, Yoshihiro Kondo, Tomoo Hayashi
  • Publication number: 20110073603
    Abstract: The storage case has a structure in which a sample storage case (S) contained in a storage case is cooled and held at a low temperature by a Stirling refrigerator. A detection element is disposed in a room-temperature area of the storage case. The chemical or physical property of the detection element varies when a contaminant adheres to the detection element. Entrance of a contaminant into the storage case can be checked by contactlessly checking the detection element from the outside of the storage case. The storage case includes a server for receiving the result of the check from the detection device, storing the result, and setting up connection via a communication line to at least two out of a terminal operable by the forwarder, a terminal operable by the carrier, and a terminal operable by the recipient to transmit the result to the two.
    Type: Application
    Filed: April 20, 2009
    Publication date: March 31, 2011
    Applicant: HITACHI, LTD.
    Inventors: Norihide Saho, Mami Hakari, Hiroyuki Tanaka, Sachi Tanaka, Yoshihito Yasukawa, Akira Nomiyama, Shinjiro Saito, Azusa Amino, Daisuke Matsuka, Kohtaro Chiba, Hiroyuki Toyoda, Naoko Nakayama, Isao Kitagawa, Isao Hagiya
  • Publication number: 20110048676
    Abstract: A cooling system applying a thermo siphon therein, being superior in energy saving and/or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, comprises a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heats therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof, a condenser 320 for receiving refrigerant vapor from the heat-receiving jacket within a pressure-reduced inner space thereof and for condensing the refrigerant vapor into a liquid by transferring the heats into an outside of the apparatus, a vapor tube 331, and a liquid return tube 332, with applying the thermo siphon for circulating the refrigerant due to phase change thereof, wherein the condenser forms fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also
    Type: Application
    Filed: August 9, 2010
    Publication date: March 3, 2011
    Applicant: HITACHI, LTD.
    Inventors: Hiroyuki TOYODA, Tadakatsu NAKAJIMA, Yoshihiro KONDO, Shigeyuki SASAKI, Akio IDEI, Shigemasa SATOH
  • Patent number: 7890967
    Abstract: An optical pickup device 50 comprising a laser diode 1, a photo detector 2, a housing 3 having an optical system for guiding light from the laser diode 1 to an optical disk and guiding light reflected on the optical disk to the photo detector, a wiring 5 to supply current to the laser diode 1, and a metallic cover 9 provided outside of the housing 3, wherein the laser diode 1 is bonded to the housing 3 by adhesive, a metallic member 10 is mounted on the surface of the laser diode 1 by connecting thermally, and the metallic member 10 is thermally connected to the cover 9 by solder.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: February 15, 2011
    Assignee: Hitachi Media Electronics Co., Ltd.
    Inventors: Hiroyuki Toyoda, Junichi Senga, Takayuki Fujimoto, Seiichi Katou, Hitoshi Matsushima
  • Patent number: 7839640
    Abstract: An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conductin
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: November 23, 2010
    Assignee: Hitachi, Ltd
    Inventors: Tomoo Hayashi, Tadakatsu Nakajima, Yoshihiro Kondo, Hiroyuki Toyoda, Akio Idei, Shigeyasu Tsubaki
  • Patent number: 7826217
    Abstract: It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: November 2, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiro Kondo, Akio Idei, Shigeyasu Tsubaki, Hitoshi Matsushima, Tadakatsu Nakajima, Hiroyuki Toyoda, Tomoo Hayashi, Tatsuya Saito, Takeshi Kato, Kenji Ogiro
  • Publication number: 20100124012
    Abstract: A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink.
    Type: Application
    Filed: November 18, 2009
    Publication date: May 20, 2010
    Inventors: Yoshihiro KONDO, Tadakatsu NAKAJIMA, Akio IDEI, Shigeyasu TSUBAKI, Hiroyuki TOYODA, Tomoo HAYASHI