Patents by Inventor Hisamitsu Yamamoto

Hisamitsu Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10927463
    Abstract: A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid comprises: a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y= an integer of 1 to 3).
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: February 23, 2021
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Nobuhiko Naka
  • Publication number: 20210047734
    Abstract: A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid contains a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y=an integer of 1 to 3).
    Type: Application
    Filed: November 4, 2020
    Publication date: February 18, 2021
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Nobuhiko NAKA
  • Publication number: 20200378008
    Abstract: A present invention provides a method for manufacturing a printed wiring board having excellent plating adhesion to a resin substrate having low surface roughness such as having surface roughness Ra of 0.2 ?m or less, having excellent treating solution stability, and having high penetrability into the resin substrate. The method for manufacturing a resin substrate includes a step 1A or a step 1B; and a step 2 after the step 1A or the step 1B; and the steps are conducted before conducting electroless plating.
    Type: Application
    Filed: May 22, 2020
    Publication date: December 3, 2020
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Nobuhiko NAKA
  • Patent number: 10773280
    Abstract: An ultrasonic treatment apparatus including: an ultrasonic bath for performing an ultrasonic treatment on a treatment target object; a first ultrasonic vibrator provided on the front surface side of the treatment target object; and a second ultrasonic vibrator provided on the back surface side of the treatment target object; wherein the first ultrasonic vibrator does not face the second ultrasonic vibrator.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: September 15, 2020
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Hisamitsu Yamamoto, Masayuki Utsumi, Yoshikazu Saijo, Tomoji Okuda, Yutaka Nishinaka, Yoshinori Nakanishi
  • Publication number: 20200002830
    Abstract: A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.
    Type: Application
    Filed: September 11, 2019
    Publication date: January 2, 2020
    Inventors: YUKO YOSHIOKA, TOMOHARU NAKAYAMA, HISAMITSU YAMAMOTO
  • Patent number: 10450666
    Abstract: A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: October 22, 2019
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Yuko Yoshioka, Tomoharu Nakayama, Hisamitsu Yamamoto
  • Patent number: 10435778
    Abstract: A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side of the substrate 54 that is held by the hanger 50. This pipe 56 is provided with a hole 58 from which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate 54, reaches a lower portion thereof, is circulated by a pump 60, and is released from the pipe 56 again.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: October 8, 2019
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Masayuki Utsumi, Hisamitsu Yamamoto, Syunsaku Hoshi, Junji Mizumoto
  • Publication number: 20190264329
    Abstract: A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid comprises: a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y=an integer of 1 to 3).
    Type: Application
    Filed: June 19, 2017
    Publication date: August 29, 2019
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Nobuhiko NAKA
  • Patent number: 10138558
    Abstract: The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: November 27, 2018
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Tetsuji Ishida, Takuya Komeda, Masayuki Utsumi
  • Publication number: 20180133760
    Abstract: An ultrasonic treatment apparatus including: an ultrasonic bath for performing an ultrasonic treatment on a treatment target object; a first ultrasonic vibrator provided on the front surface side of the treatment target object; and a second ultrasonic vibrator provided on the back surface side of the treatment target object; wherein the first ultrasonic vibrator does not face the second ultrasonic vibrator.
    Type: Application
    Filed: November 1, 2017
    Publication date: May 17, 2018
    Inventors: Hisamitsu YAMAMOTO, Masayuki UTSUMI, Yoshikazu SAIJO, Tomoji OKUDA, Yutaka NISHINAKA, Yoshinori NAKANISHI
  • Publication number: 20180087140
    Abstract: A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side of the substrate 54 that is held by the hanger 50. This pipe 56 is provided with a hole 58 from which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate 54, reaches a lower portion thereof, is circulated by a pump 60, and is released from the pipe 56 again.
    Type: Application
    Filed: May 22, 2017
    Publication date: March 29, 2018
    Inventors: Masayuki UTSUMI, Hisamitsu YAMAMOTO, Syunsaku HOSHI, Junji MIZUMOTO
  • Publication number: 20180023197
    Abstract: The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.
    Type: Application
    Filed: January 25, 2016
    Publication date: January 25, 2018
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Tetsuji ISHIDA, Takuya KOMEDA, Masayuki UTSUMI
  • Publication number: 20170268119
    Abstract: A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.
    Type: Application
    Filed: March 20, 2017
    Publication date: September 21, 2017
    Inventors: YUKO YOSHIOKA, TOMOHARU NAKAYAMA, HISAMITSU YAMAMOTO
  • Publication number: 20170253975
    Abstract: Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.
    Type: Application
    Filed: September 14, 2015
    Publication date: September 7, 2017
    Inventors: Hisamitsu YAMAMOTO, Tomohiro KAWASE, Masaharu TAKEUCHI
  • Patent number: 9374913
    Abstract: A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: June 21, 2016
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Masayuki Utsumi, Takuya Okamachi, Takuya Komeda
  • Patent number: 9359676
    Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: June 7, 2016
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Teruyuki Hotta, Hisamitsu Yamamoto, Takahiro Ishizaki, Masayuki Utsumi, Takuya Okamachi, Syunsaku Hoshi, Fujio Asa, Junji Mizumoto
  • Publication number: 20150289382
    Abstract: This method includes the steps of forming a second resin layer (4) covering a conductor circuit (3) on a first resin layer (2), forming a water-repellent protective layer (8) on the surface (4a) of the second resin layer (4), cutting a via hole (5) and a trench (6) through/in the second resin layer (4) via a through hole (9) of the protective layer (8), applying a catalyst (10) to the second resin layer (4) to allow the catalyst (10) to adhere to the via hole (5) and the trench (6), stripping the protective layer (8) formed on the surface (4a) of the second resin layer 4, and filling the via hole (5) and the trench (6), to each of which the catalyst (10) has adhered, with a plating metal by electroless plating.
    Type: Application
    Filed: October 29, 2013
    Publication date: October 8, 2015
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Masaharu Takeuchi, Hisamitsu Yamamoto, Teruyuki Hotta
  • Patent number: 9120113
    Abstract: A tank body 100 includes a liquid receiving part 2 for receiving processing solution Q applied to a plate-like work 10 and a liquid retaining part 4 for retaining liquids to be applied to the plate-like work 10 and a liquid outflowing part 6 for causing a flow of the processing solution Q which is spilled out of the liquid retaining part 4 and traveled down toward the plate-like work 10, wherein a tip 6a of the liquid outflowing part 6 is projected from a connecting part 5 connecting to the liquid retaining part 4 (or the liquid receiving part 2).
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: September 1, 2015
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Teruyuki Hotta, Hisamitsu Yamamoto, Masayuki Utsumi, Takahiro Ishizaki
  • Patent number: 9045836
    Abstract: The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: June 2, 2015
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Takahiro Ishizaki
  • Patent number: 8992756
    Abstract: A surface of an object to be plated is subjected to a treatment for palladium catalyst impartation to impart a palladium catalyst to the surface of an insulating part thereof. A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent. On the palladium conductor layer is then directly formed a copper deposit by electroplating. Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline. Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion. By adding an azole compound to the solution for palladium conductor layer formation, a palladium conductor layer is prevented from depositing on copper.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: March 31, 2015
    Assignee: C. Uyemura & Co., Ltd.
    Inventor: Hisamitsu Yamamoto