Patents by Inventor Hisanori Fujita

Hisanori Fujita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4510515
    Abstract: An epitaxial wafer of a compound semiconductor comprising a single crystalline semiconductor substrate consisting of GaP and an active layer consisting of GaAs.sub.1-x P.sub.x, having a mixed crystal ratio (x) in the range of from 0.5 to 1 is used for an LED. According to the present invention, between the single crystalline semiconductor substrate and the active layer, a light-absorbing layer consisting of GaAs.sub.1-x P.sub.x having the mixed crystal ratio (x) smaller than that of the active layer, is formed to suppress the reflection of light from the surface of the substrate.
    Type: Grant
    Filed: February 10, 1984
    Date of Patent: April 9, 1985
    Assignees: Stanley Electric Co., Ltd., Mitsubishi Monsanto Chemical Co., Ltd.
    Inventors: Masaki Kajita, Tomio Nakaya, Shinichi Hasegawa, Hisanori Fujita
  • Patent number: 4378259
    Abstract: A method of manufacturing a mixed crystal compound semiconductor wafer suitable for the production of LED having a high light output. Upon a monocrystalline substrate of III-V semiconductor material a base layer is epitaxially grown of the same material as the substrate. An initial gradient layer is grown on the base layer having a mixed crystal ratio varying continuously from that of the base layer to a first value at a constant temperature. A combination sublayer is grown on the initial gradient sublayer which includes at least one constant sublayer having a constant crystal mixture ratio and at least one gradient sublayer having a crystal mixture ratio varying continuously between the mixed crystal ratios of its adjacent constant layers.
    Type: Grant
    Filed: December 24, 1980
    Date of Patent: March 29, 1983
    Assignee: Mitsubishi Monsanto Chemical Co.
    Inventors: Shinichi Hasegawa, Hisanori Fujita
  • Patent number: 4252576
    Abstract: An epitaxial wafer of GaAs.sub.1-x P.sub.x has been doped with nitrogen and used for the production of light emitting diode (LED). The carrier concentration of the conventional GaAs.sub.1-x P.sub.x was from 3.times.10.sup.16 to 2.times.10.sup.17 /cm.sup.3.According to the present invention, the carrier concentration is reduced lower than the conventional concentration and the luminance of LED is increased approximately two or three times the conventional luminance.
    Type: Grant
    Filed: July 6, 1979
    Date of Patent: February 24, 1981
    Assignee: Mitsubishi Monsanto Chemical Co.
    Inventors: Shinichi Hasegawa, Hisanori Fujita
  • Patent number: 4218270
    Abstract: An epitaxial layer of a photoelectric element, which is formed on a substrate and in which a p-n junction is formed has a high carrier density region adjacent the substrate, so that the provision of ohmic electrodes thereon is facilitated.
    Type: Grant
    Filed: November 22, 1977
    Date of Patent: August 19, 1980
    Assignee: Mitsubishi Monsanto Chemical Company
    Inventors: Shinichi Hasegawa, Hisanori Fujita
  • Patent number: 4216484
    Abstract: A method of manufacturing an electroluminescent compound semiconductor wafer having epitaxial film layers each composed of a semiconductor containing components belonging to III and V groups of the periodic table one of which layers has the mixed crystal ratio of the components being constant comprises the step of at least reducing the supply of at least one of the III and V components at least once during the formation of the one layer.
    Type: Grant
    Filed: May 8, 1978
    Date of Patent: August 5, 1980
    Assignee: Mitsubishi Monsanto Chemical Company
    Inventors: Shinichi Hasegawa, Hisanori Fujita
  • Patent number: 4168998
    Abstract: Semiconductor epitaxial wafers consisting of an epitaxial film and its substrate can be removed, in accordance with the present invention, from a substrate supporting component, without breaking the wafers into pieces after completion of vapor growth. The carbonaceous powder according to the present invention can greatly and effectively decrease the breaking of wafers, as compared with the conventional SiO.sub.2 or SiC-coated substrate supporting components.
    Type: Grant
    Filed: December 6, 1978
    Date of Patent: September 25, 1979
    Assignee: Mitsubishi Monsanto Chemical Co.
    Inventors: Shinichi Hasegawa, Hisanori Fujita