Abstract: A turbomolecular vacuum pump is provided, including: a stator; a rotor configured to rotate in the stator about an axis of rotation; and a regulation valve configured to modify an inlet conductance of the turbomolecular vacuum pump by axial displacement towards or away from a suction orifice of the turbomolecular vacuum pump, a face of the regulation valve facing the suction orifice having a hollow form.

Abstract: An increase in the capacity of a power storage unit is effectively suppressed. An in-vehicle backup power source control apparatus includes a discharge unit, a control unit, and a temperature obtaining unit. The control unit controls a discharge operation such that an output voltage of the discharge unit reaches a target voltage. The temperature obtaining unit obtains the temperature of a power storage unit. When the temperature obtained by the temperature obtaining unit is within a predetermined first temperature range, the control unit sets the target voltage to a first target voltage, and when the temperature obtained by the temperature obtaining unit is within a predetermined second temperature range that is higher than the first temperature range, the control unit sets the target voltage to a second target voltage that is higher than first target voltage.

Abstract: Provided is an in-vehicle backup power supply control device or an in-vehicle backup power supply configured to generate a notification indicating the state of a power storage unit to an external device. When a main power supply fails, a control device applies a voltage to a backup target load from a power storage unit. The control device is provided with a charging/discharging unit for charging the power storage unit and discharging the power storage unit, a voltage detection unit for detecting a voltage of the power storage unit, a control unit for controlling the operation of the charging/discharging unit, and a signal interruption unit for interrupting the output of the predetermined signal to a device external to the control device in a case where the voltage value (Vout) of the power storage unit detected by the voltage detection unit is smaller than a predetermined first threshold.

Abstract: Provided is a vehicle power source control device and system that supplies power from an auxiliary power source to an in-vehicle load while suppressing the consumption of power when a failure occurs in the main power source when a vehicle has not been started. When a drive signal generation unit generates an off-signal and a main power source has failed, a power source drive circuit in an in-vehicle power source control device controls a power source circuit such that power is supplied from an auxiliary power source to a control unit. If the drive signal generation unit is generating an off-signal and the main power source is in a failed state, the control unit uses power supplied from the auxiliary power source to control the relay to switch to the first stopped state, and controls the converter to switch to the second permissive state.

Abstract: Provided is an in-vehicle backup power supply control device or an in-vehicle backup power supply configured to generate a notification indicating the state of a power storage unit to an external device. When a main power supply fails, a control device applies a voltage to a backup target load from a power storage unit. The control device is provided with a charging/discharging unit for charging the power storage unit and discharging the power storage unit, a voltage detection unit for detecting a voltage of the power storage unit, a control unit for controlling the operation of the charging/discharging unit, and a signal interruption unit for interrupting the output of the predetermined signal to a device external to the control device in a case where the voltage value (Vout) of the power storage unit detected by the voltage detection unit is smaller than a predetermined first threshold.

Abstract: A configuration that can increase the reliability of a backup operation is realized in a simpler manner. An in-vehicle backup power source control apparatus includes a first control unit that causes a charge/discharge unit (first discharge unit) to perform a first discharge operation when power supply that is based on a power source unit enters a failure state, and a second control unit that causes a second discharge unit to perform a second discharge operation when power supply that is based on the power source unit enters a failure state and at least the first discharge operation performed by the charge/discharge unit is in an abnormal state.

Abstract: An increase in the capacity of a power storage unit is effectively suppressed. An in-vehicle backup power source control apparatus includes a discharge unit, a control unit, and a temperature obtaining unit. The control unit controls a discharge operation such that an output voltage of the discharge unit reaches a target voltage. The temperature obtaining unit obtains the temperature of a power storage unit. When the temperature obtained by the temperature obtaining unit is within a predetermined first temperature range, the control unit sets the target voltage to a first target voltage, and when the temperature obtained by the temperature obtaining unit is within a predetermined second temperature range that is higher than the first temperature range, the control unit sets the target voltage to a second target voltage that is higher than first target voltage.

Abstract: Provided is a vehicle power source control device and system that supplies power from an auxiliary power source to an in-vehicle load while suppressing the consumption of power when a failure occurs in the main power source when a vehicle has not been started. When a drive signal generation unit generates an off-signal and a main power source has failed, a power source drive circuit in an in-vehicle power source control device controls a power source circuit such that power is supplied from an auxiliary power source to a control unit. If the drive signal generation unit is generating an off-signal and the main power source is in a failed state, the control unit uses power supplied from the auxiliary power source to control the relay to switch to the first stopped state, and controls the converter to switch to the second permissive state.

Abstract: A power supply system includes a high-potential side output end and a low-potential side output end that output the power; an input end to which a positive voltage is applied from a DC power source; a power storage element including a positive terminal connected to the high-potential side output end and a negative terminal connected to the low-potential side output end; a diode including a cathode and an anode, the anode being connected to the input end; a power source line connected between the cathode and the positive terminal; and a switch, connected to the diode in parallel, that turns on when a current value of current flowing in the power source line from the cathode toward the positive terminal is greater than or equal to a positive threshold, and turns off when the current value is less than the threshold.

Abstract: A power supply system includes a high-potential end; a low-potential end; a power storage element including a positive terminal and a negative terminal, the negative terminal being connected to the low-potential end; a diode including an anode and a cathode, the cathode being connected to the high-potential end; a power source line connected between the anode and the positive terminal; and a first switch, connected in parallel to the diode, the first switch turning on when the power storage element is to be charged from the DC power source through the high-potential end or when a current value of discharge current flowing in the power source line from the positive terminal toward the anode is greater than or equal to a positive threshold, and the first switch turning off when the power storage element is not to be charged and the current value is less than the threshold.

Abstract: A transport pod (1) of the invention for a mask or a semiconductor wafer (2) comprises a leakproof peripheral wall (3) surrounding an inside space (4) receiving the mask or the semiconductor wafer (2). Thermally conductive support means (11) hold the mask or the semiconductor wafer (2). A cold plate (7) thermally coupled to a cold source (8) generates a temperature gradient facing the main face (6) of the mask or the semiconductor wafer (2) that is to be protected against particulate pollution. The cold plate (7) is held by connection means (7b) including thermal insulation means (7c). An on-board energy source (9) powers the cold source (8). This significantly reduces deposition of polluting particles on the main face (6) of the mask or the semiconductor wafer (2).

Abstract: Apparatus of the invention for transporting substrates (3) comprises a mini-environment enclosure (1) that is movable and that can be coupled to a conditioning station (22). The mini-environment enclosure (1) includes a micropump (12) whose inlet is connected to an inside cavity (2) that is to contain the substrate (3) to be transported. An energy supply (16) is also provided in the mini-environment enclosure (1) to power the micropump (12). The mini-environment enclosure (1) comprises a peripheral shell (4) open to two opposite main faces (5, 6), and including a closable side opening (7). A first main wall (8) is fitted to close the first main face (5) in leaktight manner. A second main wall (9) is fitted and secured to close the second main face (6) in leaktight manner. The first and second main walls are disposed in planes parallel to the plane containing the substrate.

Abstract: Pumping apparatus of the invention using thermal transpiration micropumps comprises a plurality of individual thermal transpiration micropumps distributed over a substrate (5) as a plurality of rows (A, B, C, . . . , D) each made up of a plurality of micropumps (1, 6, . . . , 7, 8, 9), thereby building up a plurality of columns (a, b, . . . , c, d). Respective heater elements (4) in each of the thermal transpiration micropumps are controlled by suitably controlling a row control conductor (10A) and a column control conductor (11a). This greatly simplifies multiplexed control of a large number of individual micropumps, thus enabling pumping capacity to be adapted.

Abstract: In apparatus of the invention, a transport pod (1) can be coupled to an article-passing opening (11) of process equipment (9) in leaktight manner with sealing being provided by an interposed interface peripheral gasket (16). The pod door (4) can be secured selectively to the interface door (12) so that they can be moved together as a unit along an axial stroke followed by a transverse stroke under drive from door actuator means (14). The transport pod (1) is held by retaining means (15). The peripheral volume (21) around the two doors can be pumped out by means of a pump (22) and a duct (23). The pod door (4) can be locked on the transport door (1) by locking means (20) that guarantee good sealing while the transport pod (1) is separate from the process equipment (9). This ensures good sealing of the transport pod (1), and enables the doors (4, 12) to be opened under a vacuum without polluting the inside atmosphere.

Abstract: The present invention relates to a sealed enclosure for transporting and storing semiconductor substrates, the enclosure comprising a sealed container and support means placed inside the container and including trays for supporting substrates. The container comprises two touching half-shells that can be spaced apart in order to open the container, and each end of said support means is secured mechanically to a respective one of said half-shells. The total height of said means varies depending on whether the container is opened or closed, the trays being separated from one another by equal distances. Said support means preferably comprise an alternation of segments and ball joints having end segments that are mechanically connected to respective ones of the half-shells. Under such circumstances, the total height of said support means varies by the alternation of segments and ball joints moving concertina-like.

Abstract: A SMIF type mini-environment (1) can be connected onto a purge station (2). The purge station comprises a leaktight purge compartment (2b) whose top face includes a closable transfer passage (2c) facing the bottom face (1b) of the mini-environment pod (1). An elevator (4) is suitable for vertically displacing the bottom wall (1b) of the mini-environment pod (1) when coupled thereto, simultaneously moving the stack (3) of substrate wafers carried by the bottom wall (1c) so as to introduce them together into the leaktight purge compartment (2b). The stack (3) of substrate wafers is then purged inside a leaktight purge compartment (2b) of the purge station (2), while simultaneously purging the mini-environment pod (1). This provides purging that is much more effective and much faster, thus encouraging the use of SMIF mini-environment pods in microelectronic processes.

Abstract: In apparatus of the invention, a transport pod (1) can be coupled to an article-passing opening (11) of process equipment (9) in leaktight manner with sealing being provided by an interposed interface peripheral gasket (16). The pod door (4) can be secured selectively to the interface door (12) so that they can be moved together as a unit along an axial stroke followed by a transverse stroke under drive from door actuator means (14). The transport pod (1) is held by retaining means (15). The peripheral volume (21) around the two doors can be pumped out by means of a pump (22) and a duct (23). The pod door (4) can be locked on the transport door (1) by locking means (20) that guarantee good sealing while the transport pod (1) is separate from the process equipment (9). This ensures good sealing of the transport pod (1), and enables the doors (4, 12) to be opened under a vacuum without polluting the inside atmosphere.

Abstract: A transport pod (1) of the invention for a mask or a semiconductor wafer (2) comprises a leakproof peripheral wall (3) surrounding an inside space (4) receiving the mask or the semiconductor wafer (2). Thermally conductive support means (11) hold the mask or the semiconductor wafer (2). A cold plate (7) thermally coupled to a cold source (8) generates a temperature gradient facing the main face (6) of the mask or the semiconductor wafer (2) that is to be protected against particulate pollution. The cold plate (7) is held by connection means (7b) including thermal insulation means (7c). An on-board energy source (9) powers the cold source (8). This significantly reduces deposition of polluting particles on the main face (6) of the mask or the semiconductor wafer (2).

Abstract: Apparatus of the invention for transporting substrates (3) comprises a mini-environment enclosure (1) that is movable and that can be coupled to a conditioning station (22). The mini-environment enclosure (1) includes a micropump (12) whose inlet is connected to an inside cavity (2) that is to contain the substrate (3) to be transported. An energy supply (16) is also provided in the mini-environment enclosure (1) to power the micropump (12). The mini-environment enclosure (1) comprises a peripheral shell (4) open to two opposite main faces (5, 6), and including a closable side opening (7). A first main wall (8) is fitted to close the first main face (5) in leaktight manner. A second main wall (9) is fitted and secured to close the second main face (6) in leaktight manner. The first and second main walls are disposed in planes parallel to the plane containing the substrate.

Abstract: In a device of the invention, an SMIF type mini-environment (1) can be connected onto a purge station (2). The purge station comprises a leaktight purge compartment (2b) whose top face includes a closable transfer passage (2c) facing the bottom face (1b) of the mini-environment pod (1). An elevator (4) is suitable for vertically displacing the bottom wall (1b) of the mini-environment pod (1) when coupled thereto, simultaneously moving the stack (3) of substrate wafers carried by the bottom wall (1c) so as to introduce them together into the leaktight purge compartment (2b). The stack (3) of substrate wafers is then purged inside a leaktight purge compartment (2b) of the purge station (2), while simultaneously purging the mini-environment pod (1). This provides purging that is much more effective and much faster, thus encouraging the use of SMIF mini-environment pods in microelectronic processes.