Abstract: In a device of the invention, an SMIF type mini-environment (1) can be connected onto a purge station (2). The purge station comprises a leaktight purge compartment (2b) whose top face includes a closable transfer passage (2c) facing the bottom face (1b) of the mini-environment pod (1). An elevator (4) is suitable for vertically displacing the bottom wall (1b) of the mini-environment pod (1) when coupled thereto, simultaneously moving the stack (3) of substrate wafers carried by the bottom wall (1c) so as to introduce them together into the leaktight purge compartment (2b). The stack (3) of substrate wafers is then purged inside a leaktight purge compartment (2b) of the purge station (2), while simultaneously purging the mini-environment pod (1). This provides purging that is much more effective and much faster, thus encouraging the use of SMIF mini-environment pods in microelectronic processes.

Abstract: Pumping apparatus of the invention using thermal transpiration micropumps comprises a plurality of individual thermal transpiration micropumps distributed over a substrate (5) as a plurality of rows (A, B, C, . . . , D) each made up of a plurality of micropumps (1, 6, . . . , 7, 8, 9), thereby building up a plurality of columns (a, b, . . . , c, d). Respective heater elements (4) in each of the thermal transpiration micropumps are controlled by suitably controlling a row control conductor (10A) and a column control conductor (11a). This greatly simplifies multiplexed control of a large number of individual micropumps, thus enabling pumping capacity to be adapted.

Abstract: In a system for cleaning process chambers or vacuum lines, the progress of cleaning a process chamber or vacuum line is monitored by measuring the cleanliness of a sample of the inside surface of the process chamber or vacuum line. To this end, the surface sample is subjected at some times to the action of cleaning gases in the process chamber or vacuum line and at other times to the action of a test plasma generated by a test plasma source communicating with the process chamber or vacuum line via an interface. The test plasma excites the atoms on the surface sample and produces radiation that is measured by a spectrometer that sends signals to control means for closing a solenoid valve for feeding cleaning gas into the process chamber or vacuum line when cleaning is sufficient. This prevents excessive and overlong cleaning liable to degrade the inside surface of the process chamber or vacuum line.