Patents by Inventor Hisashi Hatano
Hisashi Hatano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160178360Abstract: In related art, consideration is not given to that a spatial distribution of scattered light changes in various direction such as forward/backward/sideways according to a difference in micro roughness. Particularly, although a step-terrace structure appearing on an epitaxial growth wafer produces anisotropy in the scattered light distribution, consideration is not given to this point in the related art. The invention includes a process in which light is illuminated to a sample surface, plural detection optical systems mutually different in directions of optical axes detect a spatial distribution of scattered light, and a spatial frequency spectrum of the sample surface is calculated.Type: ApplicationFiled: February 26, 2016Publication date: June 23, 2016Inventors: Masaaki ITO, Takahiro JINGU, Hisashi HATANO
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Publication number: 20160109382Abstract: In defect scanning carried out in a process of manufacturing a semiconductor or the like, a light detection optical system comprising a plurality of photosensors is used for detecting scattered light reflected from a sample. The photosensors used for detecting the quantity of weak background scattered light include a photon counting type photosensor having few pixels whereas the photosensors used for detecting the quantity of strong background scattered light include a photon counting type photosensor having many pixels or an analog photosensor. In addition, nonlinearity caused by the use of the photon counting type photosensor as nonlinearity of detection strength of defect scattered light is corrected in order to correct a detection signal of the defect scattered light.Type: ApplicationFiled: December 22, 2015Publication date: April 21, 2016Inventors: Toshifumi Honda, Yuta Urano, Hisashi Hatano
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Patent number: 9310190Abstract: In related art, consideration is not given to that a spatial distribution of scattered light changes in various direction such as forward/backward/sideways according to a difference in micro roughness. Particularly, although a step-terrace structure appearing on an epitaxial growth wafer produces anisotropy in the scattered light distribution, consideration is not given to this point in the related art. The invention includes a process in which light is illuminated to a sample surface, plural detection optical systems mutually different in directions of optical axes detect a spatial distribution of scattered light, and a spatial frequency spectrum of the sample surface is calculated.Type: GrantFiled: July 27, 2012Date of Patent: April 12, 2016Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Masaaki Ito, Takahiro Jingu, Hisashi Hatano
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Patent number: 9255888Abstract: In defect scanning carried out in a process of manufacturing a semiconductor or the like, a light detection optical system comprising a plurality of photosensors is used for detecting scattered light reflected from a sample. The photosensors used for detecting the quantity of weak background scattered light include a photon counting type photosensor having few pixels whereas the photosensors used for detecting the quantity of strong background scattered light include a photon counting type photosensor having many pixels or an analog photosensor. In addition, nonlinearity caused by the use of the photon counting type photosensor as nonlinearity of detection strength of defect scattered light is corrected in order to correct a detection signal of the defect scattered light.Type: GrantFiled: October 22, 2012Date of Patent: February 9, 2016Assignee: Hitachi High-Technologies CorporationInventors: Toshifumi Honda, Yuta Urano, Hisashi Hatano
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Patent number: 9182359Abstract: Provided is a pattern defect inspecting apparatus wherein inspection performance is stabilized. The defect inspecting apparatus, which has a plurality of configuration units and inspects defects on the surface of a sample, is provided with a means for monitoring time-dependent changes and failures of some of or all of the configuration units, and a means for notifying the user of the results of the monitoring. Furthermore, a unit which can perform correction is provided with a correcting means, and also a means for replacing a failure component with a spare component which has been prepared in the device.Type: GrantFiled: June 21, 2010Date of Patent: November 10, 2015Assignee: Hitachi High-Technologies CorporationInventors: Hisashi Hatano, Hiroyuki Yamashita, Hidetoshi Nishiyama
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Publication number: 20150109435Abstract: When a size of a block on a wafer is equal to or smaller than an optical resolution of imaging optics, room for improvement in a signal-to-noise ratio has not been sufficiently considered in a conventional technique. One feature of the defect determination of the present invention is to include a filter processing for setting a predetermined partial area serving as a predetermined matrix for a first difference image, scanning the first difference image in the partial area, and outputting a second difference image, and a first threshold processing using a first threshold value for the second difference image. As a result, highly sensitive defect detection can be achieved.Type: ApplicationFiled: October 16, 2014Publication date: April 23, 2015Inventors: Masaaki ITO, Hisashi HATANO
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Patent number: 8902417Abstract: This invention implements reduction in the amount of background-scattered light from a semiconductor wafer surface and highly sensitive inspection, without increasing the number of detectors. A surface inspection apparatus that detects defects on the surface of an object (semiconductor wafer surface) to be inspected, by irradiating the surface of the object with a beam of light such as laser light and detecting the light reflected or scattered from the surface; wherein a widely apertured lens with an optical Fourier transform function is disposed between the object to be inspected and a detector, a filter variable in position as well in aperture diameter is provided on a Fourier transform plane, and background-scattered light from the semiconductor wafer surface is effectively blocked, whereby only a signal from a defect such as a foreign substance is detected.Type: GrantFiled: November 9, 2011Date of Patent: December 2, 2014Assignee: Hitachi High-Technologies CorporationInventors: Nobuaki Hirose, Takahiro Jingu, Hidetoshi Nishiyama, Kazuo Takahashi, Hisashi Hatano
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Publication number: 20140253912Abstract: In defect scanning carried out in a process of manufacturing a semiconductor or the like, a light detection optical system comprising a plurality of photosensors is used for detecting scattered light reflected from a sample. The photosensors used for detecting the quantity of weak background scattered light include a photon counting type photosensor having few pixels whereas the photosensors used for detecting the quantity of strong background scattered light include a photon counting type photosensor having many pixels or an analog photosensor. In addition, nonlinearity caused by the use of the photon counting type photosensor as nonlinearity of detection strength of defect scattered light is corrected in order to correct a detection signal of the defect scattered light.Type: ApplicationFiled: October 22, 2012Publication date: September 11, 2014Applicant: Hitachi High- Technologies CorporationInventors: Toshifumi Honda, Yuta Urano, Hisashi Hatano
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Publication number: 20140198321Abstract: In related art, consideration is not given to that a spatial distribution of scattered light changes in various direction such as forward/backward/sideways according to a difference in micro roughness. Particularly, although a step-terrace structure appearing on an epitaxial growth wafer produces anisotropy in the scattered light distribution, consideration is not given to this point in the related art. The invention includes a process in which light is illuminated to a sample surface, plural detection optical systems mutually different in directions of optical axes detect a spatial distribution of scattered light, and a spatial frequency spectrum of the sample surface is calculated.Type: ApplicationFiled: July 27, 2012Publication date: July 17, 2014Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Masaaki Ito, Takahiro Jingu, Hisashi Hatano
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Publication number: 20130271754Abstract: This invention implements reduction in the amount of background-scattered light from a semiconductor wafer surface and highly sensitive inspection, without increasing the number of detectors. A surface inspection apparatus that detects defects on the surface of an object (semiconductor wafer surface) to be inspected, by irradiating the surface of the object with a beam of light such as laser light and detecting the light reflected or scattered from the surface; wherein a widely apertured lens with an optical Fourier transform function is disposed between the object to be inspected and a detector, a filter variable in position as well in aperture diameter is provided on a Fourier transform plane, and background-scattered light from the semiconductor wafer surface is effectively blocked, whereby only a signal from a defect such as a foreign substance is detected.Type: ApplicationFiled: November 9, 2011Publication date: October 17, 2013Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Nobuaki Hirose, Takahiro Jingu, Hidetoshi Nishiyama, Kazuo Takahashi, Hisashi Hatano
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Publication number: 20120268742Abstract: Provided is a pattern defect inspecting apparatus wherein inspection performance is stabilized. The defect inspecting apparatus, which has a plurality of configuration units and inspects defects on the surface of a sample, is provided with a means for monitoring time-dependent changes and failures of some of or all of the configuration units, and a means for notifying the user of the results of the monitoring. Furthermore, a unit which can perform correction is provided with a correcting means, and also a means for replacing a failure component with a spare component which has been prepared in the device.Type: ApplicationFiled: June 21, 2010Publication date: October 25, 2012Inventors: Hisashi Hatano, Hiroyuki Yamashita, Hidetoshi Nishiyama
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Patent number: 8289507Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: GrantFiled: May 27, 2011Date of Patent: October 16, 2012Assignee: Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Publication number: 20110228258Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: ApplicationFiled: May 27, 2011Publication date: September 22, 2011Inventors: Akira HAMAMATSU, Minori NOGUCHI, Yoshimasa OHSHIMA, Sachio UTO, Taketo UENO, Hiroyuki NAKANO, Takahiro JINGU, Hisashi HATANO, Yukihisa MOHARA, Seiji OTANI, Takahiro TOGASHI
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Patent number: 7952700Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: GrantFiled: October 19, 2010Date of Patent: May 31, 2011Assignee: Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Publication number: 20110032515Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: ApplicationFiled: October 19, 2010Publication date: February 10, 2011Inventors: Akira HAMAMATSU, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Patent number: 7817261Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: GrantFiled: May 2, 2008Date of Patent: October 19, 2010Assignee: Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Publication number: 20080204724Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: ApplicationFiled: May 2, 2008Publication date: August 28, 2008Inventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Patent number: 7369223Abstract: An apparatus for inspecting a pattern to detect a small pattern defect has an illuminating light source, as illuminating optical system having a plurality of illuminating portions for switching an optical path of illuminating light flux to a surface of board constituting the inspected object from a plurality of directions different from each other, a detecting optical system having a variable magnification using an object lens for condensing reflected diffracted light from the illuminated board, a focusing optical system having a variable magnification capable of focusing an optical image by converged reflected diffracted light with a desired focusing magnification and an optical detector for detecting the optical image focused by the focusing optical system to convert it into an image signal, an A/D converter for converting the image signal into a digital image signal, and an image signal processor for processing the digital image signal to detect the defect.Type: GrantFiled: March 23, 2005Date of Patent: May 6, 2008Assignee: Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Publication number: 20050213086Abstract: An apparatus for inspecting a pattern to detect a small pattern defect has an illuminating light source, as illuminating optical system having a plurality of illuminating portions for switching an optical path of illuminating light flux to a surface of board constituting the inspected object from a plurality of directions different from each other, a detecting optical system having a variable magnification using an object lens for condensing reflected diffracted light from the illuminated board, a focusing optical system having a variable magnification capable of focusing an optical image by converged reflected diffracted light with a desired focusing magnification and an optical detector for detecting the optical image focused by the focusing optical system to convert it into an image signal, an A/D converter for converting the image signal into a digital image signal, and an image signal processor for processing the digital image signal to detect the defect.Type: ApplicationFiled: March 23, 2005Publication date: September 29, 2005Inventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Patent number: 5403539Abstract: A method and apparatus for molding an inflation film even from a thermoplastic resin having a small melt tension, in which a melt resin bubble extruded from an extruder is molded, while controlling a resin temperature of the bubble to a certain temperature range by an air ring provided with a plurality of annular slits for blowing cooling air in a take-up direction of the melt resin bubble and provided at a position at which the melt resin bubble is remarkably expanded, after (a) cooling air is blown to a melt resin bubble from a first air ring provided at the proximity of a die outlet to cool said melt resin bubble; and, then, the bubble is either (i) brought into contact, on the inner surface thereof, with the surface of a stabilizer provided on a die surface, or (ii) is supported in a non-contact state through an air layer, while being taken up.Type: GrantFiled: July 14, 1993Date of Patent: April 4, 1995Assignee: Showa Denko K.K.Inventors: Toshio Taka, Takeshi Onoda, Hisashi Hatano, Tomoaki Kobayashi, Terumitu Kotani