Abstract: A polyimide multilayer wiring substrate that includes a plurality of wiring layer blocks, each of which include a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by way of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting the anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure including N pieces of wiring layer blocks.

Abstract: A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.

Abstract: A disc discharging toy for discharging discs is provided which comprises a plurality of resilient discs, a magazine for holding the discs in a stacked position, a forcibly feeding device for forcibly feeding the discs so held in the supply portion piece by piece toward a discharging position, and a discharging device for discharging the disc so fed. The discharging device includes two rollers and a motor for rotating at least one of the two rollers in a direction in which the disc is discharged.

Abstract: A multi-layer wiring board has at least one stacking block with an insulating hard substrate, a grounding layer being provided in the insulating hard substrate. A plurality of wiring layers are provided over upper and lower major surfaces of the insulating hard substrate. A plurality of throughholes are provided in the insulating hard substrate for connecting wiring layers on the top and bottom surfaces of the substrate. A base block has an insulating base board, and at least one wiring layer provided over one major surface of the insulating base board. Connections electrically and mechanically connect the at least one stacking block and the base block. The stacking block and the base block may be simultaneously manufactured in parallel with others. The stacking block and the base block may be adhered to each other by an adhesive layer. Each electrical connection between the stacking block and the base block may be achieved with bumps and pads.

Abstract: A multi-layer wiring board has at least one stacking block with an insulating hard substrate, a grounding layer being provided in the insulating hard substrate. A plurality of wiring layers are provided over upper and lower major surfaces of the insulating hard substrate. A plurality of throughholes are provided in the insulating hard substrate for connecting wiring layers on the top and bottom surfaces of the substrate. A base block has an insulating base board, and at least one wiring layer provided over one major surface of the insulating base board. Connections electrically and mechanically connect the at least one stacking block and the base block. The stacking block and the base block may be simultaneously manufactured in parallel with others. The stacking block and the base block may be adhered to each other by an adhesive layer. Each electrical connection between the stacking block and the base block may be achieved with bumps and pads.

Abstract: Disclosed are a semiconductor integrated circuit device and methods for production thereof. An embodiment of the invention is a semiconductor chip that comprises fuses constituting part of redundancy circuits formed therein, the fuses being made of the same ingredients CCB bump substrate metal. The fuses are patterned simultaneously during the patterning of the CCB bump substrate metal. This involves forming the fuses using at least part of the ingredients of an electrode conductor pattern in the chip. The cutting regions of the fuses are made of only one of the metal layers constituting the substrate. The principal plane of the semiconductor chip has a fuse protective film formed over at least the cutting regions of the fuses for protection of the latter. In operation, a switch MOSFET under switching control of a redundancy signal is used to select one of two transmission paths, one carrying an address signal or a decode signal, the other carrying a reference voltage.

Abstract: A disc discharging toy for discharging discs is provided which comprises a plurality of resilient discs, a magazine for holding the discs in a stacked position, a forcibly feeding device for forcibly feeding the discs so held in the supply portion piece by piece toward a discharging position, and a discharging device for discharging the disc so fed. The discharging device includes two rollers and a motor for rotating at least one of the two rollers in a direction in which the disc is discharged.

Abstract: A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.

Abstract: The multilayer printed wiring board of this invention consists of a base substrate, a plurality of multilayer interconnections formed by lamination of metal wiring layer and insulation layer on the base substrate and ceramic substrates provided with through holes for electrical connection of the multilayer interconnections and inserted between two multilayer interconnections. The manufacturing method comprises lamination of metal wiring layers and insulation layers on both sides of ceramic substrates to form multilayer interconnections, forming of a multilayer interconnection on the base substrate by laminating a wiring layer and an insulation layer, and integration of the ceramic substrates with metal wiring layers and the base substrate placed together under heated and pressurized conditions.

Abstract: Disclosed are a semiconductor integrated circuit device and methods for production thereof. An embodiment of the invention is a semiconductor chip that comprises fuses constituting part of redundancy circuits formed therein, the fuses being made of the same ingredients as those of a CCB bump substrate metal. The fuses are patterned simultaneously during the patterning of the CCB bump substrate metal. This involves forming the fuses using at least part of the ingredients of an electrode conductor pattern in the chip. The cutting regions of the fuses are made of only one of the metal layers constituting the substrate. The principal plane of the semiconductor chip has a fuse protective film formed over at least the cutting regions of the fuses for protection of the latter. In operation, a switch MOSFET under switching control of a redundancy signal is used to select one of two transmission paths, one carrying an address signal or a decode signal, the other carrying a reference voltage.

Abstract: The multilayer printed wiring board of this invention consists of a base substrate, a plurality of multilayer interconnections formed by lamination of metal wiring layer and insulation layer on the base substrate and ceramic substrates provided with through holes for electrical connection of the multilayer interconnections and inserted between two multilayer interconnections. The manufacturing method comprises lamination of metal wiring layers and insulation layers on both sides of ceramic substrates to form multilayer interconnections, forming of a multilayer interconnection on the base substrate by laminating a wiring layer and an insulation layer, and integration of the ceramic substrates with metal wiring layers and the base substrate placed together under heated and pressurized conditions.

Abstract: A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.

Abstract: A semiconductor device having improved heat-dissipating characteristics employs a thin insulator film made of diamond, which has excellent thermal conductivity, as an insulator film which is formed on a chip immediately below a heat-dissipating bump electrode. Since the thin diamond film has excellent insulating properties and high thermal conductivity, it is possible to improve heat-dissipating characteristics of even a high-power semiconductor device such as a multichip module. In the case of, particularly, a multichip module, the insulation between a mother chip and a child chip can also be ensured by the presence of the thin diamond film.