Abstract: An antenna device according to the present disclosure includes two wiring layers and an antenna layer. One of the two wiring layers is divided in the x-direction by a first slit extending in the y-direction, and the antenna layer is divided in the x-direction into first and second antenna areas by a second slit extending in the y-direction. The first and second slits overlap each other in the z-direction. One of the first and second slits is larger in width than the other one thereof. The antenna layer includes an antenna conductor formed in the first antenna area and another antenna conductor formed in the second antenna area.

Abstract: Disclosed herein is an antenna device that includes: a substrate having a plurality of insulating layers laminated in a z-direction; a first ground pattern formed on a first insulating layer; a first radiating conductor pattern formed on a second insulating layer; a second ground pattern constituted by a first via conductor provided so as to penetrate at least two insulating layers; and a second radiating conductor pattern constituted by a second via conductor provided so as to penetrate at least one insulating layer. The first radiating conductor pattern overlaps the first ground pattern in the z-direction. The second radiating conductor pattern overlaps the second ground pattern in a y-direction.

Abstract: An antenna device according to the present disclosure includes two wiring layers and an antenna layer. One of the two wiring layers is divided in the x-direction by a first slit extending in the y-direction, and the antenna layer is divided in the x-direction into first and second antenna areas by a second slit extending in the y-direction. The first and second slits overlap each other in the z-direction. One of the first and second slits is larger in width than the other one thereof. The antenna layer includes an antenna conductor formed in the first antenna area and another antenna conductor formed in the second antenna area.

Abstract: Provided is a more versatile black marker composition which achieves excellent adhesion between a mark and an electronic component element body and excellent contrast of a mark regardless of the composition of the electronic component element body, the black marker composition containing borosilicate glass and a black oxide, in which a crystallization temperature of the borosilicate glass is less than 910° C., and an amount of Zn in terms of ZnO is 0.05% by mass or less based on 100% by mass of an inorganic solid content in terms of an oxide contained in the black marker composition.

Abstract: Disclosed herein is an antenna device that includes: a substrate having a plurality of insulating layers laminated in a z-direction; a first ground pattern formed on a first insulating layer; a first radiating conductor pattern formed on a second insulating layer; a second ground pattern constituted by a first via conductor provided so as to penetrate at least two insulating layers; and a second radiating conductor pattern constituted by a second via conductor provided so as to penetrate at least one insulating layer. The first radiating conductor pattern overlaps the first ground pattern in the z-direction. The second radiating conductor pattern overlaps the second ground pattern in a y-direction.

Abstract: Provided is a more versatile black marker composition which achieves excellent adhesion between a mark and an electronic component element body and excellent contrast of a mark regardless of the composition of the electronic component element body, the black marker composition containing borosilicate glass and a black oxide, in which a crystallization temperature of the borosilicate glass is less than 910° C., and an amount of Zn in terms of ZnO is 0.05% by mass or less based on 100% by mass of an inorganic solid content in terms of an oxide contained in the black marker composition.

Abstract: A dielectric ceramic composition includes: Mg2SiO4 as main component; R-containing, Cu-containing, and B-containing compounds, and Li-containing glass, as sub-component. R is an alkaline earth metal. R-containing compound greater than or equal to 0.2 part by mass and less than or equal to 4.0 parts by mass, contained in terms of oxide, Cu-containing compound of greater than or equal to 0.5 part by mass and less than or equal to 3.0 parts by mass, contained in terms of oxide, and B-containing compound greater than or equal to 0.2 part by mass and less than or equal to 3.0 parts by mass, contained in terms of oxide, to 100 parts by mass of main component. Li-containing glass of greater than or equal to 2 parts by mass and less than or equal to 10 parts by mass contained to total a 100 parts by mass of main component, and sub-component excluding Li-containing glass.

Abstract: A dielectric ceramic composition includes: Mg2SiO4 as main component; R-containing, Cu-containing, and B-containing compounds, and Li-containing glass, as sub-component. R is an alkali earth metal. R-containing compound greater than or equal to 0.2 part by mass and less than or equal to 4.0 parts by mass, contained in terms of oxide, Cu-containing compound of greater than or equal to 0.5 part by mass and less than or equal to 3.0 parts by mass, contained in terms of oxide, and B-containing compound greater than or equal to 0.2 part by mass and less than or equal to 3.0 parts by mass, contained in terms of oxide, to 100 parts by mass of main component. Li-containing glass of greater than or equal to 2 parts by mass and less than or equal to 10 parts by mass contained to total a 100 parts by mass of main component, and sub-component excluding Li-containing glass.

Abstract: [Problem] To realize high reliability and high functionalization while suppressing characteristics variation in a multilayer interconnection substrate used in a microwave or millimeter-wave band integrated with an antenna. [Resolution Means] A multilayer substrate for high frequency with an antenna element formed on a surface. The multilayer substrate for high frequency has an intermediate substrate. The intermediate substrate consists of a low-temperature co-fired glass-ceramic substrate and has intermediate insulating layers consisting of a glass-ceramic and an internal conductor formed between these intermediate insulating layers. A surface insulating layer consisting of an organic material having a dielectric constant lower than a glass-ceramic material is stacked on a surface of the intermediate substrate. An outer-side via conductor penetrating this surface insulating layer is configured by a sintered metal that forms a metallic bond with a wiring conductor in the substrate.

Abstract: [Problem] The aim of the present invention lies in providing a glass ceramic sintered compact in which dielectric loss in a high-frequency region is reduced, without any reduction in sintering density, and also in providing a wiring board employing same. [Solution] A glass ceramic sintered compact containing a glass component, a ceramic filler and a composite oxide, characterized in that the glass component is crystallized glass on which is deposited a diopside oxide crystal phase including at least Mg, Ca and Si, and the composite oxide includes at least Al and Co.

Abstract: [Problem] The aim of the present invention lies in providing a glass ceramic sintered compact in which dielectric loss in a high-frequency region is reduced, without any reduction in sintering density, and also in providing a wiring board employing same. [Solution] A glass ceramic sintered compact containing a glass component, a ceramic filler and a composite oxide, characterized in that the glass component is crystallized glass on which is deposited a diopside oxide crystal phase including at least Mg, Ca and Si, and the composite oxide includes at least Al and Co.

Abstract: A multilayer glass ceramic substrate includes a number of insulating layers composed of glass ceramics. An embedded resistor is formed between the insulating layers. The resistor includes scattered microvoids and includes materials containing conductive powders and glass powders. First and second internal conductors are provided where a first end of the embedded resistor is connected to the first internal conductor and a second end of the embedded resistor is connected to the second internal conductor.

Abstract: A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Abstract: A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Abstract: A multilayer glass ceramic substrate includes a number of insulating layers composed of glass ceramics. An embedded resistor is formed between the insulating layers. The resistor includes scattered microvoids and includes materials containing conductive powders and glass powders. First and second internal conductors are provided where a first end of the embedded resistor is connected to the first internal conductor and a second end of the embedded resistor is connected to the second internal conductor.

Abstract: A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and a boundary reaction layer. The first dielectric layer is a layer containing BaO, Nd2O3, and TiO2, the second dielectric layer is a layer containing a material different from the material of the first dielectric layer, and the boundary reaction layer is a layer formed between the first dielectric layer and the second dielectric layer and containing at least one of Zn, Ti, Cu, and Mg.

Abstract: Provided is a dielectric ceramic that includes a main component which contains Mg2SiO4 and additives which contain a zinc oxide and a glass component, in which, in X-ray diffraction. The peak intensity ratio, IB/IA, of the X-ray diffraction peak intensity IB of zinc oxide remaining unreacted, for which 2? is between 31.0° and 32.0° and between 33.0° and 34.0°, with respect to the peak intensity IA of Mg2SiO4 as the main phase, for which 2? is between 36.0° and 37.0°, is 10% or less. The dielectric ceramic has a relative density of 96% or greater.

Abstract: A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and an intermediate layer. The first dielectric layer is a layer containing BaO, Nd2O3, and TiO2, the second dielectric layer is a layer containing a different material from the material of the first dielectric layer, and the intermediate layer is a layer formed between the first dielectric layer and the second dielectric layer and containing main components that are not contained in the first dielectric layer and the second dielectric layer in common as the main components.

Abstract: To provide a dielectric ceramic composition which is free from variation in breakdown voltage, and has excellent electric properties. The dielectric ceramic composition according the present invention includes: as a main component, a component represented by a composition formula {?(xBaO-yNd2O3-zTiO2)+?(2MgO—SiO2)}, wherein x, y, and z representing a molar ratio of the BaO Nd2O3, and TiO2 are each in a specific molar ratio range, and ? and ? representing a volume ratio of each component, zinc oxide, boron oxide, a glass having a softening point at a specific temperature or less, and silver, wherein a, b, c, and d representing a mass ratio of each of the minor components based on the main component are each in a specific mass ration range.

Abstract: Provided is a dielectric ceramic that includes a main component which contains Mg2SiO4 and additives which contain a zinc oxide and a glass component, in which, in X-ray diffraction. The peak intensity ratio, IB/IA, of the X-ray diffraction peak intensity IB of zinc oxide remaining unreacted, for which 2? is between 31.0° and 32.0° and between 33.0° and 34.0°, with respect to the peak intensity IA of Mg2SiO4 as the main phase, for which 2? is between 36.0° and 37.0°, is 10% or less. The dielectric ceramic has a relative density of 96% or greater.