Patents by Inventor Hisashi Yamazaki
Hisashi Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240030893Abstract: An acoustic wave device includes a piezoelectric substrate including a support and a piezoelectric layer provided on the support and including first and second main surfaces, one or more functional electrodes provided on the first or second main surface, and including at least one pair of electrodes, a first support provided on the piezoelectric substrate so as to surround the functional electrodes, one or more second supports provided on the piezoelectric substrate and on a portion surrounded by the first support, and a cover on the first support and the second supports. A direction in which adjacent electrodes face each other is an electrode facing direction, a region in which the adjacent electrodes overlap each other when viewed from the electrode facing direction is an intersecting region, and the second support at least partially overlaps the intersecting region when viewed from the electrode facing direction.Type: ApplicationFiled: September 28, 2023Publication date: January 25, 2024Inventors: Takeshi NAKAO, Seiji KAI, Hisashi YAMAZAKI
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Publication number: 20240030890Abstract: An acoustic wave device includes a piezoelectric substrate including a support and a piezoelectric layer on the support and including first and second main surfaces, one or more functional electrodes on the first or second main surfaces, and including at least one pair of electrodes, a first support surrounding the functional electrodes, one or more second supports on the piezoelectric substrate and on a portion surrounded by the first support, and a cover on the first and second supports. A direction in which adjacent electrodes face each other is an electrode facing direction, a region in which the adjacent electrodes overlap each other when viewed from the electrode facing direction is an intersecting region, a direction in which at least one pair of electrodes extend is an electrode extending direction, and the second support at least partially overlaps the intersecting region when viewed from the electrode extending direction.Type: ApplicationFiled: September 28, 2023Publication date: January 25, 2024Inventors: Takeshi NAKAO, Seiji KAI, Hisashi YAMAZAKI
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Publication number: 20240014802Abstract: An acoustic wave device includes a support including a support substrate with a thickness direction in a first direction, a piezoelectric layer on the support, and resonators each including a functional electrode provided to the piezoelectric layer. The support is provided with a hollow portion at a position overlapping at least a portion of each of the resonators in plan view in the first direction. The resonators include a first resonator and a second resonator adjacent to each other. A through hole reaching the hollow portion is provided to the piezoelectric layer between the first resonator and the second resonator.Type: ApplicationFiled: September 20, 2023Publication date: January 11, 2024Inventors: Tetsuya KIMURA, Hisashi YAMAZAKI, Katsumi SUZUKI
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Publication number: 20240014799Abstract: An acoustic wave device includes a piezoelectric substrate including a support including a support substrate and a piezoelectric layer on the support and including first and second main surfaces, a functional electrode on the first or second main surface and including a pair of electrodes, a first support on the piezoelectric substrate and surrounding the functional electrode, at least one second support on the piezoelectric substrate in a portion surrounded by the first support, and a lid on the first and second supports. The second support does not overlap an intersecting region when viewed from an electrode extending direction and from an electrode facing direction.Type: ApplicationFiled: September 19, 2023Publication date: January 11, 2024Inventors: Takeshi NAKAO, Seiji KAI, Hisashi YAMAZAKI
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Publication number: 20240007076Abstract: An acoustic wave device includes a piezoelectric substrate including a support including a support substrate and a piezoelectric layer on the support, a functional electrode on the piezoelectric layer, at least one support, and a lid. One of the at least one support surrounds the functional electrode on the piezoelectric substrate and the lid is provided on the support. A first cavity is provided in the support. The first cavity overlaps at least a portion of the functional electrode in plan view. A second cavity is surrounded by the piezoelectric substrate, a support provided between the piezoelectric substrate and the lid, and the lid. A height of the first cavity is greater than a height of the second cavity.Type: ApplicationFiled: September 19, 2023Publication date: January 4, 2024Inventors: Seiji KAI, Hisashi YAMAZAKI, Takeshi NAKAO, Takuya KOYANAGI
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Publication number: 20220321091Abstract: An acoustic wave device includes a support, a piezoelectric layer on the support, a functional electrode at the piezoelectric layer, a frame-shaped support frame on the piezoelectric layer and surrounding the functional electrode in plan view in a stacking direction of the support and the piezoelectric layer, and a lid covering an opening of the support frame, wherein the support includes a first cavity overlapping at least a portion of the functional electrode in the plan view, a second cavity defined by the piezoelectric layer, the support frame, and the lid between the piezoelectric layer and the lid, the piezoelectric layer includes a through hole communicating with the first and second cavities, and a gas is provided in the first and second cavities.Type: ApplicationFiled: March 29, 2022Publication date: October 6, 2022Inventors: Hisashi YAMAZAKI, Seiji KAI, Takeshi NAKAO
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Publication number: 20220321097Abstract: An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support, a functional electrode at the piezoelectric layer, a frame-shaped support frame on the piezoelectric layer and surrounding the functional electrode in a plan view in a stacking direction of the support and the piezoelectric layer, and a lid covering an opening of the support frame, wherein the support includes a first cavity at a position overlapping at least a portion of the functional electrode in the plan view, a second cavity defined by the piezoelectric layer, the support frame, and the lid between the piezoelectric layer and the lid, the piezoelectric layer includes a through hole communicating with the first and second cavities, and the first and second cavities are under vacuum.Type: ApplicationFiled: March 29, 2022Publication date: October 6, 2022Inventors: Hisashi YAMAZAKI, Seiji KAI, Takeshi NAKAO
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Patent number: 10659001Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.Type: GrantFiled: December 5, 2017Date of Patent: May 19, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Koji Yamamoto, Tsutomu Takai, Seiji Kai, Hisashi Yamazaki, Yuji Miwa, Takashi Yamane
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Patent number: 10659002Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode has a width of about 6 ?m and extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.Type: GrantFiled: August 22, 2018Date of Patent: May 19, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Koji Yamamoto, Tsutomu Takai, Seiji Kai, Hisashi Yamazaki, Yuji Miwa, Takashi Yamane, Noriyoshi Ota, Atsushi Tanaka
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Patent number: 10320362Abstract: An elastic wave device includes a multilayer film provided on a support substrate and including a piezoelectric thin film and a layer other than the piezoelectric thin film, an interdigital transducer electrode provided on one surface of the piezoelectric thin film, and an external connection terminal electrically connected to the interdigital transducer electrode. In a plan view, the multilayer film is partially absent or omitted in a region outside a region where the interdigital transducer electrode is provided, and the elastic wave device further includes a first insulating layer provided on the support substrate in at least a portion of a region where the multilayer film is absent or omitted.Type: GrantFiled: June 2, 2016Date of Patent: June 11, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Taku Kikuchi, Shin Saijo, Hisashi Yamazaki, Masahiro Fukushima, Yuji Miwa
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Patent number: 10250220Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, wiring, a pad, an under bump metal, a first dielectric layer, and a second dielectric layer. At least a portion of the IDT electrode includes a first electrically conductive film, at least a portion of the wiring includes a multilayer body including the first electrically conductive film and a second electrically conductive film, and at least a portion of the pad includes the second electrically conductive film. The second dielectric layer covers the region other than the contact region between the second electrically conductive film and the under bump metal. Consequently, the second electrically conductive film is covered with the second dielectric layer and the under bump metal and is not exposed to air.Type: GrantFiled: February 3, 2016Date of Patent: April 2, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuji Miwa, Hijiri Sumii, Junpei Yasuda, Taku Kikuchi, Hisashi Yamazaki
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Patent number: 10243536Abstract: In an elastic wave device, a multilayer film including a piezoelectric thin film is provided on a support substrate, an interdigital transducer electrode is provided on one surface of the piezoelectric thin film, a wiring electrode is connected to the interdigital transducer electrode, the wiring electrode includes a lead electrode portion and a pad electrode portion, an external connection terminal is located above the pad electrode portion, the external connection terminal is electrically connected to the pad electrode portion, and the external connection terminal is bonded onto the pad electrode portion on the support substrate so that at least the piezoelectric thin film of the multilayer film is not present below the pad electrode portion.Type: GrantFiled: June 13, 2016Date of Patent: March 26, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shin Saijo, Hisashi Yamazaki, Koji Yamamoto, Seiji Kai, Munehisa Watanabe
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Publication number: 20180358950Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode has a width of about 6 ?m and extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.Type: ApplicationFiled: August 22, 2018Publication date: December 13, 2018Inventors: Koji YAMAMOTO, Tsutomu TAKAI, Seiji KAI, Hisashi YAMAZAKI, Yuji MIWA, Takashi YAMANE, Noriyoshi OTA, Atsushi TANAKA
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Publication number: 20180097502Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.Type: ApplicationFiled: December 5, 2017Publication date: April 5, 2018Inventors: Koji Yamamoto, Tsutomu Takai, Seiji Kai, Hisashi Yamazaki, Yuji Miwa, Takashi Yamane
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Publication number: 20160294354Abstract: In an elastic wave device, a multilayer film including a piezoelectric thin film is provided on a support substrate, an interdigital transducer electrode is provided on one surface of the piezoelectric thin film, a wiring electrode is connected to the interdigital transducer electrode, the wiring electrode includes a lead electrode portion and a pad electrode portion, an external connection terminal is located above the pad electrode portion, the external connection terminal is electrically connected to the pad electrode portion, and the external connection terminal is bonded onto the pad electrode portion on the support substrate so that at least the piezoelectric thin film of the multilayer film is not present below the pad electrode portion.Type: ApplicationFiled: June 13, 2016Publication date: October 6, 2016Inventors: Shin SAIJO, Hisashi YAMAZAKI, Koji YAMAMOTO, Seiji KAI, Munehisa WATANABE
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Publication number: 20160277003Abstract: An elastic wave device includes a multilayer film provided on a support substrate and including a piezoelectric thin film and a layer other than the piezoelectric thin film, an interdigital transducer electrode provided on one surface of the piezoelectric thin film, and an external connection terminal electrically connected to the interdigital transducer electrode. In a plan view, the multilayer film is partially absent or omitted in a region outside a region where the interdigital transducer electrode is provided, and the elastic wave device further includes a first insulating layer provided on the support substrate in at least a portion of a region where the multilayer film is absent or omitted.Type: ApplicationFiled: June 2, 2016Publication date: September 22, 2016Inventors: Taku KIKUCHI, Shin SAIJO, Hisashi YAMAZAKI, Masahiro FUKUSHIMA, Yuji MIWA
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Publication number: 20160156331Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, wiring, a pad, an under bump metal, a first dielectric layer, and a second dielectric layer. At least a portion of the IDT electrode includes a first electrically conductive film, at least a portion of the wiring includes a multilayer body including the first electrically conductive film and a second electrically conductive film, and at least a portion of the pad includes the second electrically conductive film. The second dielectric layer covers the region other than the contact region between the second electrically conductive film and the under bump metal. Consequently, the second electrically conductive film is covered with the second dielectric layer and the under bump metal and is not exposed to air.Type: ApplicationFiled: February 3, 2016Publication date: June 2, 2016Inventors: Yuji MIWA, Hijiri SUMII, Junpei YASUDA, Taku KIKUCHI, Hisashi YAMAZAKI
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Patent number: 9271400Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.Type: GrantFiled: September 3, 2013Date of Patent: February 23, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Seiji Kai, Shintaro Nakatani, Mitsuyoshi Hira, Takao Mukai, Hisashi Yamazaki
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Patent number: 9184367Abstract: An elastic wave device includes a piezoelectric substrate and an interdigital transducer electrode. The piezoelectric substrate includes a principal surface with a groove tapered in lateral cross section. The interdigital transducer electrode is arranged on the principal surface such that at least one portion thereof is located in the groove. The interdigital transducer electrode is a laminate including a first conductive layer, a second conductive layer, and a diffusion-preventing layer located between the first conductive layer and the second conductive layer and made of an oxide or nitride of Ti or Cr.Type: GrantFiled: March 13, 2013Date of Patent: November 10, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Kenji Sakaguchi, Shin Saijo, Hisashi Yamazaki
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Patent number: 9130539Abstract: An elastic wave device includes a first elastic wave element, a second elastic wave element, and a first substrate. The first elastic wave element includes a first piezoelectric substrate. The second elastic wave element includes a second piezoelectric substrate. The second piezoelectric substrate is stacked on the first piezoelectric substrate. A coefficient of linear expansion of the second piezoelectric substrate is greater than a coefficient of linear expansion of the first piezoelectric substrate. The first substrate is bonded to the second piezoelectric substrate. A coefficient of linear expansion of the first substrate is lower than the coefficient of linear expansion of the second piezoelectric substrate.Type: GrantFiled: January 5, 2015Date of Patent: September 8, 2015Assignee: Murata Manufacturing Co. Ltd.Inventors: Taku Kikuchi, Hisashi Yamazaki