Patents by Inventor Hisashi Yamazaki

Hisashi Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150109071
    Abstract: An elastic wave device includes a first elastic wave element, a second elastic wave element, and a first substrate. The first elastic wave element includes a first piezoelectric substrate. The second elastic wave element includes a second piezoelectric substrate. The second piezoelectric substrate is stacked on the first piezoelectric substrate. A coefficient of linear expansion of the second piezoelectric substrate is greater than a coefficient of linear expansion of the first piezoelectric substrate. The first substrate is bonded to the second piezoelectric substrate. A coefficient of linear expansion of the first substrate is lower than the coefficient of linear expansion of the second piezoelectric substrate.
    Type: Application
    Filed: January 5, 2015
    Publication date: April 23, 2015
    Inventors: Taku KIKUCHI, Hisashi YAMAZAKI
  • Patent number: 8997320
    Abstract: Provided is a method for manufacturing an acoustic wave device that has an excellent temperature coefficient of frequency (TCF) and high accuracy of IDT pattern forming and is capable of resisting high temperature processing of 200 degrees or more. The method for manufacturing an acoustic wave device according to the present invention includes forming an IDT (2) on a principal surface (1a) of a piezoelectric substrate (1), and forming a film by thermal spraying a material (3) having a smaller linear thermal expansion coefficient than the piezoelectric substrate onto an opposite principal surface (1b) of the piezoelectric substrate (1) where the IDT (2) is formed.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: April 7, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshiyuki Fuyutsume, Taro Nishino, Hisashi Yamazaki, Noboru Tamura, Nakaba Ichikawa, Masaki Aruga
  • Publication number: 20140003017
    Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.
    Type: Application
    Filed: September 3, 2013
    Publication date: January 2, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Seiji KAI, Shintaro NAKATANI, Mitsuyoshi HIRA, Takao MUKAI, Hisashi YAMAZAKI
  • Patent number: 8575818
    Abstract: A surface acoustic wave element has a small energy loss and when it is used in a filter device, suppresses a spurious component occurring near the resonant frequency of a principal response and improves the frequency characteristic near the pass band of the filter device. The surface acoustic wave element includes a piezoelectric substrate, a comb-shaped electrode, and an insulating film. The comb-shaped electrode is disposed on the piezoelectric substrate. The insulating film is disposed so as to cover the piezoelectric substrate and the comb-shaped electrode. Where ? is the wavelength of an elastic wave that propagates in the piezoelectric substrate and h is the difference between the maximum and minimum values of a thickness dimension from the top surface of the piezoelectric substrate to the top surface of the insulating film, 0.01?h/??0.03 is satisfied.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: November 5, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hisashi Yamazaki, Hideaki Takahashi, Taku Kikuchi
  • Patent number: 8319394
    Abstract: Provided are an acoustic wave device and a method for manufacturing the same, the acoustic wave device being effectively prevented from expanding and contracting due to temperature change and having a small frequency shift. The acoustic wave device of the present invention has a piezoelectric substrate (1) having an IDT (2) formed on one principal surface of the piezoelectric substrate (1), and a thermal spray film (3) formed on an opposite principal surface (1b) of the piezoelectric substrate (1), the thermal spray film being of a material having a smaller linear thermal expansion coefficient than the piezoelectric substrate (1) and having grain boundaries and pores (4), at least a part of which is filled with a filling material (5).
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: November 27, 2012
    Assignees: Murata Manufacturing Co., Ltd., Koike Co., Ltd.
    Inventors: Toshiyuki Fuyutsume, Taro Nishino, Hisashi Yamazaki, Kiyoto Araki, Noboru Tamura, Nakaba Ichikawa, Masaki Aruga
  • Publication number: 20110309719
    Abstract: A surface acoustic wave element has a small energy loss and when it is used in a filter device, suppresses a spurious component occurring near the resonant frequency of a principal response and improves the frequency characteristic near the pass band of the filter device. The surface acoustic wave element includes a piezoelectric substrate, a comb-shaped electrode, and an insulating film. The comb-shaped electrode is disposed on the piezoelectric substrate. The insulating film is disposed so as to cover the piezoelectric substrate and the comb-shaped electrode. Where ? is the wavelength of an elastic wave that propagates in the piezoelectric substrate and h is the difference between the maximum and minimum values of a thickness dimension from the top surface of the piezoelectric substrate to the top surface of the insulating film, 0.01?h/??0.03 is satisfied.
    Type: Application
    Filed: August 29, 2011
    Publication date: December 22, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Hisashi YAMAZAKI, Hideaki TAKAHASHI, Taku KIKUCHI
  • Publication number: 20110156531
    Abstract: An acoustic wave device includes a piezoelectric substrate and an IDT electrode disposed thereon. The IDT electrode includes a metal laminate. The metal laminate includes a first metal layer made of Al or an Al-based alloy, a second metal layer made of a metal or alloy different from that used in the first metal layer, a Cu layer, and a Ti layer. The Cu layer and the Ti layer are disposed between the first and second metal layers. The Cu layer is located on the first metal layer side.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 30, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Daisuke TAMAZAKI, Motoji TSUDA, Hisashi YAMAZAKI, Masahiko SAEKI, Harunobu HORIKAWA
  • Patent number: 7868523
    Abstract: An elastic wave device has a structure that prevents cracks from being formed in a piezoelectric substrate in flip-chip bonding using a bump, that minimizes the contact resistance in a contact portion where wiring patterns are electrically connected to each other, and that improves the insertion loss.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: January 11, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuhira Tanaka, Hisashi Yamazaki
  • Publication number: 20100301700
    Abstract: Provided are an acoustic wave device and a method for manufacturing the same, the acoustic wave device being effectively prevented from expanding and contracting due to temperature change and having a small frequency shift. The acoustic wave device of the present invention has a piezoelectric substrate (1) having an IDT (2) formed on one principal surface of the piezoelectric substrate (1), and a thermal spray film (3) formed on an opposite principal surface (1b) of the piezoelectric substrate (1), the thermal spray film being of a material having a smaller linear thermal expansion coefficient than the piezoelectric substrate (1) and having grain boundaries and pores (4), at least a part of which is filled with a filling material (5).
    Type: Application
    Filed: November 26, 2008
    Publication date: December 2, 2010
    Applicants: MURATA MANUFACTURING CO., LTD., KOIKE CO., LTD.
    Inventors: Toshiyuki Fuyutsume, Taro Nishino, Hisashi Yamazaki, Kiyoto Araki, Noboru Tamura, Nakaba Ichikawa, Masaki Aruga
  • Publication number: 20100293770
    Abstract: Provided is a method for manufacturing an acoustic wave device that has an excellent temperature coefficient of frequency (TCF) and high accuracy of IDT pattern forming and is capable of resisting high temperature processing of 200 degrees or more. The method for manufacturing an acoustic wave device according to the present invention includes forming an IDT (2) on a principal surface (1a) of a piezoelectric substrate (1), and forming a film by thermal spraying a material (3) having a smaller linear thermal expansion coefficient than the piezoelectric substrate onto an opposite principal surface (1b) of the piezoelectric substrate (1) where the IDT (2) is formed.
    Type: Application
    Filed: November 26, 2008
    Publication date: November 25, 2010
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Toshiyuki Fuyutsume, Taro Nishino, Hisashi Yamazaki, Noboru Tamura, Nakaba Ichikawa, Masaki Aruga
  • Publication number: 20100271856
    Abstract: To provide main I/O lines(MIOX) arranged along an X direction; a plurality of I/O nodes(ND) arranged along the X direction; an amplifier circuit area(AMPA) including a plurality of amplifier circuits(AMP); a plurality of main I/O lines(MIOY) arranged along a Y direction, which respectively connect each of the main I/O lines(MIOX) and each of the corresponding I/O nodes(ND). Among the main I/O lines(MIOY) allocated to the amplifier circuits different from one another, that having a longer wire length is connected more closely to a center of the corresponding main I/O line(MIOX); and that having a shorter wire length is connected more closely to an end of the corresponding main I/O line(MIOX). Accordingly, the difference in wire length for each signal route becomes smaller, and also the wire length of the longest wire route is reduced.
    Type: Application
    Filed: June 23, 2009
    Publication date: October 28, 2010
    Applicant: ELPIDAMEMORY INC.
    Inventor: Hisashi YAMAZAKI
  • Publication number: 20100117483
    Abstract: An elastic wave device has a structure that prevents cracks from being formed in a piezoelectric substrate in flip-chip bonding using a bump, that minimizes the contact resistance in a contact portion where wiring patterns are electrically connected to each other, and that improves the insertion loss.
    Type: Application
    Filed: January 29, 2010
    Publication date: May 13, 2010
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Nobuhira Tanaka, Hisashi Yamazaki
  • Patent number: 6221516
    Abstract: A radiation image storage panel has a phosphor layer which comprises a stimulable phosphor, and a protective film. The protective film is a coated layer containing at least 30% by weight of a fluorine-containing resin which is soluble in an organic solvent, such as a copolymer derived from a fluoroolefin and other copolymerizable monomer, polytetrafluoroethylene or a modified polytetrafluoroethylene.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: April 24, 2001
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Katsuhiro Kohda, Hisashi Yamazaki
  • Patent number: 5313356
    Abstract: A thin film magnetic head includes a magnetic core composed of upper and lower magnetic pole films spaced apart to define a read-write gap and a coil disposed between the upper and lower magnetic pole films in an area outside of the gap. The upper and lower magnetic pole films each comprise a thin-film laminate having alternating magnetic and non-magnetic thin films. The magnetic thin film includes an amorphous Co alloy having a soft magnetic property and a thickness within a range of 0.1 .mu.m to 0.5 .mu.m and the non-magnetic thin-film includes a non-magnetic metal or an insulating nitride.
    Type: Grant
    Filed: December 10, 1991
    Date of Patent: May 17, 1994
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Keiji Ohkubo, Hisashi Yamazaki, Kiyoto Yamaguchi, Yoshiharu Kashiwakura
  • Patent number: 5227253
    Abstract: A radiation image storage panel having a stimulable phosphor layer and an improved protective film is disclosed. The improved protective film is produced from a mixture of a film-forming resin and an oligomer having a polysiloxane skeleton or a perfluoroalkyl group. The improved protective film can be a coated layer containing a fluorocarbon resin which is soluble in an organic solvent. Otherwise, the improved protective film can be produced by coating on the phosphor layer a mixture of a film-forming resin composition containing a fluorocarbon resin which is soluble in an organic solvent, and a powdery resin of perfluoroolefin or silicone.
    Type: Grant
    Filed: April 7, 1992
    Date of Patent: July 13, 1993
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsunori Takasu, Katsuhiro Kohda, Hideki Suzuki, Hisashi Yamazaki
  • Patent number: 4791009
    Abstract: A process for the preparation of a radiation image storage panel which comprises a support, a light-reflecting layer and a stimulable phosphor layer, superposed in this order, characterized in that applying a binder solution-I containing a light-reflecting material and a binder solution-II containing a stimulable phosphor onto a surface of a support or a sheet in such a manner that both the binder solutions are superposed, to form a light-reflecting layer and a stimulable phosphor layer simultaneously.
    Type: Grant
    Filed: July 8, 1987
    Date of Patent: December 13, 1988
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Satoshi Arakawa, Yuichi Hosoi, Hisashi Yamazaki, Yoshiteru Ito
  • Patent number: 4788435
    Abstract: A radiation image storage panel comprising a support and a phosphor layer provided on the support which comprises a binder and a stimulable phosphor dispersed therein, characterized in that the side surfaces of said panel are covered with a polymer material composed of a linear polyester or a mixture of a linear polyester and a vinyl chloride-vinyl acetate copolymer.
    Type: Grant
    Filed: June 25, 1986
    Date of Patent: November 29, 1988
    Assignee: Fuji Photo Film Co., Ltd.
    Inventor: Hisashi Yamazaki
  • Patent number: 4728583
    Abstract: A radiation image storage panel comprising a support and a phosphor layer provided thereon which comprises a binder and a stimulable phosphor dispersed therein, characterized in that said phosphor layer consists essentially of one part on the support side which contains the stimulable phosphor and the other part on the panel surface side which does not substantially contain the stimulable phosphor. Processes for the preparation of said radiation image storage panel are also disclosed.
    Type: Grant
    Filed: August 30, 1985
    Date of Patent: March 1, 1988
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Hisashi Yamazaki, Akira Kitada, Kikuo Yamazaki
  • Patent number: 4608301
    Abstract: A radiographic intensifying screen comprising a support and a phosphor layer provided thereon which comprises a binder and a phosphor dispersed therein, characterized in that said binder contains a (meth)acrylic copolymer in the amount of 5-100% by weight, having repeating units represented by the formulas (I), (II) and (III): ##STR1## in which each of R.sub.1, R.sub.3 and R.sub.5 is independently a hydrogen atom or an alkyl group; R.sub.2 is a group selected from those consisting of an alkyl group, a cycloalkyl group, an aryl group, a heterocyclic group and an aralkyl group; R.sub.4 is a hydrogen atom or an alkyl group, provided that R.sub.4 is not identical to R.sub.2 ; and x, y and z which represent molar percents are numbers satisfying the conditions of 5.ltoreq.x.ltoreq.99, 1.ltoreq.y+z.ltoreq.95 and x+y+z.gtoreq.90. The (meth)acrylic copolymer is preferably employed in combination with a linear polyester having a hydroxyl value in the range of 20-70.
    Type: Grant
    Filed: August 1, 1984
    Date of Patent: August 26, 1986
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Akio Ishizuka, Hisashi Yamazaki, Kikuo Yamazaki
  • Patent number: 4604525
    Abstract: In a radiation image storage panel comprising a support and a phosphor layer which comprises a binder and a stimulable phosphor dispersed therein and is colored with a colorant, the improvement which comprises said colorant is a pigment capable of absorbing a portion of stimulating rays for the stimulable phosphor and said phosphor layer contains a dispersing agent of at least one fatty acid ester selected from the group consisting of sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters and polyoxyethylene fatty acid esters.
    Type: Grant
    Filed: July 2, 1985
    Date of Patent: August 5, 1986
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Akira Kitada, Kikuo Yamazaki, Hisashi Yamazaki