Patents by Inventor Hisatomi Hosaka
Hisatomi Hosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8456186Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.Type: GrantFiled: June 27, 2007Date of Patent: June 4, 2013Assignees: Tokyo Electron Limited, Ibiden Co., Ltd.Inventors: Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido
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Patent number: 7750655Abstract: It is an object of the present invention to dramatically reduce thermal deformation without using any special material in a multilayer substrate and a probe card. According to the present invention, in a probe card including at least one circuit board connected in an electrically conductive manner to a probe brought into electrical contact with an inspection object, the circuit board includes a base layer and a surface layer stacked on at least an inspection object side surface of the base layer. The surface layer has a higher coefficient of thermal expansion than that of the base layer, and grooves dividing the surface layer into a plurality of areas are provided in the surface layer.Type: GrantFiled: May 24, 2005Date of Patent: July 6, 2010Assignee: Tokyo Electron LimitedInventors: Jun Mochizuki, Hisatomi Hosaka
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Patent number: 7663386Abstract: It is an object of the present invention to realize sure electrical connection between a contactor and an object to be inspected without influenced by heat, a reduction in the pre-heating time, and an enhanced throughput. A probe card of the present invention includes a contactor, a printed wiring board, an interposer provided between the contactor and the printed wiring board to have the both in elastic and electrical contact with each other, a coupling member integrating these, and a reinforcing member reinforcing the printed wiring board integrated via the coupling member.Type: GrantFiled: January 20, 2005Date of Patent: February 16, 2010Assignee: Tokyo Electron LimitedInventor: Hisatomi Hosaka
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Patent number: 7629806Abstract: A probe which can be easily formed, is not limited in a mounting position and number, and capable of sufficiently securing a space allowing a contact to move is provided. The probe has a contact to be brought into contact with an inspection object, and a beam part supporting the contact at a tip end portion. A rear portion of the beam part of the probe is joined to a surface at an inspection object side, of a contractor disposed to be opposed to the inspection object. The beam part of the probe is bent so that the above described contact at the tip end portion inclines to the above described inspection object side.Type: GrantFiled: March 8, 2006Date of Patent: December 8, 2009Assignee: Tokyo Electron LimitedInventor: Hisatomi Hosaka
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Patent number: 7621045Abstract: A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.Type: GrantFiled: February 5, 2007Date of Patent: November 24, 2009Assignee: Tokyo Electron LimitedInventors: Hisatomi Hosaka, Kiyoshi Takekoshi
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Patent number: 7541820Abstract: A probe card includes a contactor supporting probes, and a printed wiring board electrically connected to the contactor. An elastic sheet is interposed between the contactor and the printed wiring board. The elastic sheet is formed so that elasticity in a central side is smaller than that in an outer peripheral side of the contactor. An elastic reaction force which acts on the contactor from the elastic sheet when the elastic sheet is compressed becomes weaker at the central part side as compared with the outer peripheral side of the contactor. Thereby, the bending amount of a central part of the contactor which is away from a fixed end and bends the most is reduced, and horizontality of the contactor is maintained.Type: GrantFiled: June 27, 2006Date of Patent: June 2, 2009Assignee: Tokyo Electron LimitedInventors: Takashi Amemiya, Hisatomi Hosaka
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Patent number: 7498827Abstract: The present invention provides a probe card that can examine an object with small electrode spacing. A probe supporting plate is provided to a lower face side of a printed wiring board of a probe card. A plurality of probes are supported by the probe supporting plate. The probes comprise an upper contact, a lower contact, and a main body portion. An upper end portion of the upper contact protrudes toward an upper side of the probe supporting plate and contacts a terminal of the printed wiring board. A lower end portion of the lower contact protrudes toward a lower side of the probe supporting plate. On the probe supporting plate, a through-hole and a concave portion are formed to lock the probes, and the probes can be inserted and removed freely against the probe supporting plate from above.Type: GrantFiled: February 23, 2007Date of Patent: March 3, 2009Assignee: Tokyo Electron LimitedInventors: Jun Mochizuki, Hisatomi Hosaka
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Patent number: 7474110Abstract: The present invention provides a probe card that can examine an object with small electrode spacing. A probe supporting plate is provided to a lower face side of a printed wiring board of a probe card. A plurality of probes are supported by the probe supporting plate. The probes comprise an upper contact, a lower contact, and a main body portion. An upper end portion of the upper contact protrudes toward an upper side of the probe supporting plate and contacts a terminal of the printed wiring board. A lower end portion of the lower contact protrudes toward a lower side of the probe supporting plate. On the probe supporting plate, a through-hole and a concave portion are formed to lock the probes, and the probes can be inserted and removed freely against the probe supporting plate from above.Type: GrantFiled: February 23, 2007Date of Patent: January 6, 2009Assignee: Tokyo Electron LimitedInventors: Jun Mochizuki, Hisatomi Hosaka
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Publication number: 20080284458Abstract: A prove which can be easily formed, is not limited in a mounting position and number, and capable of sufficiently securing a space allowing a contact to move is provided. The probe has a contact to be brought into contact with an inspection object, and a beam part supporting the contact at a tip end portion. A rear portion of the beam part of the probe is joined to a surface at an inspection object side, of a contactor disposed to be opposed to the inspection object. The beam part of the probe is bent so that the above described contact at the tip end portion inclines to the above described inspection object side.Type: ApplicationFiled: March 8, 2006Publication date: November 20, 2008Inventor: Hisatomi Hosaka
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Publication number: 20080258745Abstract: It is an object of the present invention to realize sure electrical connection between a contactor and an object to be inspected without influenced by heat, a reduction in the pre-heating time, and an enhanced throughput. A probe card of the present invention includes a contactor, a printed wiring board, an interposer provided between the contactor and the printed wiring board to have the both in elastic and electrical contact with each other, a coupling member integrating these, and a reinforcing member reinforcing the printed wiring board integrated via the coupling member.Type: ApplicationFiled: January 20, 2005Publication date: October 23, 2008Inventor: Hisatomi Hosaka
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Publication number: 20080191720Abstract: It is an object of the present invention to dramatically reduce thermal deformation without using any special material in a multilayer substrate and a probe card. According to the present invention, in a probe card including at least one circuit board connected in an electrically conductive manner to a probe brought into electrical contact with an inspection object, the circuit board includes a base layer and a surface layer stacked on at least an inspection object side surface of the base layer. The surface layer has a higher coefficient of thermal expansion than that of the base layer, and grooves dividing the surface layer into a plurality of areas are provided in the surface layer.Type: ApplicationFiled: May 24, 2005Publication date: August 14, 2008Inventors: Jun Mochizuki, Hisatomi Hosaka
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Publication number: 20080150558Abstract: [OBJECT] Contact of a wafer and a probe is stabilized. [ORGANIZATION] A probe card includes a contactor supporting probes, and a printed wiring board electrically connected to the contactor. An elastic sheet is interposed between the contactor and the printed wiring board. The elastic sheet is formed so that elasticity in a central side is smaller than that in an outer peripheral side of the contactor. An elastic reaction force which acts on the contactor from the elastic sheet when the elastic sheet is compressed becomes weaker at the central part side as compared with the outer peripheral side of the contactor. Thereby, the bending amount of a central part of the contactor which is away from a fixed end and bends the most is reduced, and horizontality of the contactor is maintained.Type: ApplicationFiled: June 27, 2006Publication date: June 26, 2008Inventors: Takashi Amemiya, Hisatomi Hosaka
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Publication number: 20080048698Abstract: It is an object of the present invention to conduct highly reliable inspection by adjusting a contactor of a probe card and an inspection object in a prober to a parallel state even if the contactor and the inspection object become not parallel to each other. The present invention is a probe card mounted in a prober via a holder, the probe card including: a contactor; a circuit board electrically connected to the contactor; a reinforcing member reinforcing the circuit board; and a parallelism adjustment mechanism adjusting a degree of parallelism between the contactor and an inspection object disposed in the prober.Type: ApplicationFiled: June 29, 2005Publication date: February 28, 2008Inventors: Takashi Amemiya, Hisatomi Hosaka, Toshihiro Yonezawa, Syuichi Tsukada
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Publication number: 20080018355Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.Type: ApplicationFiled: June 27, 2007Publication date: January 24, 2008Inventors: Kiyoshi TAKEKOSHI, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido
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Publication number: 20070290699Abstract: The present invention provides a probe card that can examine an object with small electrode spacing. A probe supporting plate is provided to a lower face side of a printed wiring board of a probe card. A plurality of probes are supported by the probe supporting plate. The probes comprise an upper contact, a lower contact, and a main body portion. An upper end portion of the upper contact protrudes toward an upper side of the probe supporting plate and contacts a terminal of the printed wiring board. A lower end portion of the lower contact protrudes toward a lower side of the probe supporting plate. On the probe supporting plate, a through-hole and a concave portion are formed to lock the probes, and the probes can be inserted and removed freely against the probe supporting plate from above.Type: ApplicationFiled: February 23, 2007Publication date: December 20, 2007Applicant: Tokyo Electron LimitedInventors: Jun Mochizuki, Hisatomi Hosaka
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Publication number: 20070290698Abstract: The present invention provides a probe card that can examine an object with small electrode spacing. A probe supporting plate is provided to a lower face side of a printed wiring board of a probe card. A plurality of probes are supported by the probe supporting plate. The probes comprise an upper contact, a lower contact, and a main body portion. An upper end portion of the upper contact protrudes toward an upper side of the probe supporting plate and contacts a terminal of the printed wiring board. A lower end portion of the lower contact protrudes toward a lower side of the probe supporting plate. On the probe supporting plate, a through-hole and a concave portion are formed to lock the probes, and the probes can be inserted and removed freely against the probe supporting plate from above.Type: ApplicationFiled: February 23, 2007Publication date: December 20, 2007Applicant: Tokyo Electron LimitedInventors: Jun Mochizuki, Hisatomi Hosaka
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Patent number: 7256592Abstract: A probe is disclosed, comprising a beam, which has a front end, an intermediate portion and a base end. The leading end is a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe. The probe includes a substantially trapezoidal contactor, which is fixed to the leading end of the beam.Type: GrantFiled: December 11, 2002Date of Patent: August 14, 2007Assignee: Tokyo Electron LimitedInventors: Hisatomi Hosaka, Kiyoshi Takekoshi
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Patent number: 7242206Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.Type: GrantFiled: July 13, 2005Date of Patent: July 10, 2007Assignees: Tokyo Electron Limited, Kabushiki Kaisha Toshiba, Ibiden Co., Ltd.Inventors: Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido
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Publication number: 20070124932Abstract: A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.Type: ApplicationFiled: February 5, 2007Publication date: June 7, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Hisatomi HOSAKA, Kiyoshi Takekoshi
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Patent number: RE42637Abstract: The present invention provides a probe card that can examine an object with small electrode spacing. A probe supporting plate is provided to a lower face side of a printed wiring board of a probe card. A plurality of probes are supported by the probe supporting plate. The probes comprise an upper contact, a lower contact, and a main body portion. An upper end portion of the upper contact protrudes toward an upper side of the probe supporting plate and contacts a terminal of the printed wiring board. A lower end portion of the lower contact protrudes toward a lower side of the probe supporting plate. On the probe supporting plate, a through-hole and a concave portion are formed to luck the probes, and the probes can be inserted and removed freely against the probe supporting plate from above.Type: GrantFiled: August 3, 2010Date of Patent: August 23, 2011Assignee: Tokyo Electron LimitedInventors: Jun Mochizuki, Hisatomi Hosaka