Abstract: A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.

Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.

Abstract: A probe card of this invention includes a contactor, printed wiring board, interposer, connecting member, and reinforcing member. The interposer is arranged between the contactor and printed wiring board to bring the contactor and printed wiring board into contact with each other flexibly and electrically. The connecting member integrates the contactor, printed wiring board, and interposer. The reinforcing member reinforces the printed wiring board integrated through the connecting member.

Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: Disclosed is a probe arrangement assembly comprising a conductive foil, a plurality of supporting body-corresponding sections formed in the conductive foil, and contact terminal-corresponding members each fixed to one end of each of the supporting body-corresponding sections. Also disclosed are a method of manufacturing the probe arrangement assembly, as well as a method and an apparatus for mounting a probe to a contactor substrate by using the probe arrangement assembly.

Abstract: A probe system according to the present invention has a plurality of exploration portions disposed in a line, spaced apart from one another for predetermined distances and each having a test head, for establishing electrical connection between the test head and electrodes of a subject of exploration so as to explore electrical characteristics of the subject of exploration, a conveyance passage running parallel to the line of the exploration portions, a retainer portion on which a plurality of the subjects of exploration are placed, which is facing to the conveyance passage and which is capable of elevating vertical with respect to the conveyance passage at a position above the conveyance passage, and delivery and acceptance unit arranged capable of moving along the conveyance passage and arranged to deliver and accept the subjects of exploration between the retainer portion and each of the exploration portions.