Abstract: A piezoelectric resonator according to an embodiment of the present invention has a first transducer connected to a first signal terminal, and a second transducer connected to a second signal terminal. The first transducer and the second transducer are stacked in a predetermined direction. At least one of the first transducer and the second transducer has a first piezoelectric film sandwiched between a pair of electrode films on both sides, and a second piezoelectric film comprised of a film type different from that of the first piezoelectric film and sandwiched between a pair of electrode films on both sides.

Abstract: The electronic device includes a substrate, a lower conductive film provided on the substrate, a functional film provided on the lower conductive film, and a crystallinity barrier film provided between the lower conductive film and the functional film. The present invention prevents the crystallinity of the functional film being affected by the crystallinity or the material selection of the lower conductive film, so it becomes possible to use a low-cost metal such as aluminum (Al) for the lower conductive film, and to use a low-cost method for forming the film, thereby making it possible to improve the crystallinity of the functional film without using a costly film-formation method such as epitaxial growth. For the crystallinity barrier film, there can be used a material having an amorphous structure.

Abstract: A piezoelectric resonator according to an embodiment of the present invention is a piezoelectric resonator for obtaining a signal of a predetermined resonance frequency from a bulk acoustic wave propagating inside a piezoelectric film. This piezoelectric resonator has a plurality of transducers stacked in a predetermined direction, and a propagation area of the bulk acoustic wave varies in a propagation direction of the bulk acoustic wave.

Abstract: An electronic device includes a substrate, a lower conductive film formed on the substrate and a functional film formed on the lower conductive film. In the present invention, an adhesion of the lower conductive film on the side of the substrate is greater than or equal to 0.1 N/cm. The electronic device according to this invention exhibits high mechanical strength that makes it very reliable. This is because the invention prevents the physical exfoliation of the lower conductive film that is apt to occur during or after fabrication of the electronic device when the adhesion of the lower conductive film is lower than 0.1 N/cm.

Abstract: A piezoelectric resonator according to an embodiment of the present invention has a first transducer connected to a first signal terminal, and a second transducer connected to a second signal terminal. The first transducer and the second transducer are stacked in a predetermined direction. At least one of the first transducer and the second transducer has a first piezoelectric film sandwiched between a pair of electrode films on both sides, and a second piezoelectric film comprised of a film type different from that of the first piezoelectric film and sandwiched between a pair of electrode films on both sides.

Abstract: A piezoelectric resonator according to an embodiment of the present invention is a piezoelectric resonator for obtaining a signal of a predetermined resonance frequency from a bulk acoustic wave propagating inside a piezoelectric film. This piezoelectric resonator has a plurality of transducers stacked in a predetermined direction, and a propagation area of the bulk acoustic wave varies in a propagation direction of the bulk acoustic wave.

Abstract: The electronic device includes a substrate, a lower conductive film provided on the substrate, a functional film provided on the lower conductive film, and a crystallinity barrier film provided between the lower conductive film and the functional film. The present invention prevents the crystallinity of the functional film being affected by the crystallinity or the material selection of the lower conductive film, so it becomes possible to use a low-cost metal such as aluminum (Al) for the lower conductive film, and to use a low-cost method for forming the film, thereby making it possible to improve the crystallinity of the functional film without using a costly film-formation method such as epitaxial growth. For the crystallinity barrier film, there can be used a material having an amorphous structure.

Abstract: A component for fabricating the electronic device comprises a substrate and a conductive film provided on the substrate, in which the adhesion of the conductive film to the substrate is not greater than 0.1 N/cm. The adhesion of the conductive film to the substrate is weak enough to enable the conductive film to be readily peeled from the substrate. This makes it possible to form a component on a substrate other than the substrate used during film formation, thereby greatly increasing the degree of product configuration freedom. If the adhesion of a lower conductive film on the substrate side is made to be not greater than 0.04 N/cm, it becomes very easy to peel the conductive film from the substrate.

Abstract: A film bulk acoustic wave resonator of the invention includes a substrate; a resonant structure provided on the substrate constituted by a lower electrode, a piezoelectric film and an upper electrode; and an acoustic multilayer of a plurality of reflective films provided between the substrate and the resonant structure. At least one of the reflective films of the acoustic multilayer has a specified crystal plane orientation, and an X-ray rocking curve full width at half maximum that is preferably not greater than 10 degrees, and more preferably is not greater than 3 degrees. This makes it possible to obtain better resonance characteristics than in the case of the prior art, by increasing the efficiency with which bulk waves propagating towards the substrate are reflected.

Abstract: An electronic device includes a substrate, a lower conductive film formed on the substrate and a functional film formed on the lower conductive film. In the present invention, an adhesion of the lower conductive film on the side of the substrate is greater than or equal to 0.1 N/cm. The electronic device according to this invention exhibits high mechanical strength that makes it very reliable. This is because the invention prevents the physical exfoliation of the lower conductive film that is apt to occur during or after fabrication of the electronic device when the adhesion of the lower conductive film is lower than 0.1 N/cm.

Abstract: There is disclosed a multi-chamber container comprising a resin film or sheet formed into a bag shape by heat-sealing and having a partition portion formed therein which includes a heat-sealed portion comprising a specific propylene-based resin composition obtained by multi-stage polymerization. The multi-chamber container has a large difference in heat-seal strength between the partition portion and peripheral portions of the container as compared to conventional containers, and facilitates control of the temperature of a heat-sealing mold upon formation of the partition portion. Further, the multi-chamber container is excellent in safety, flexibility, transparency and heat resistance and, therefore, can be used in medical applications.

Abstract: A method for continuously forming bags comprising continuous steps of heat-sealing a continuous tubular plastic film, such as a continuously formed inflation tube or the like, widthwise at given positions thereof while the tubular film is being conveyed, cutting sequentially the tubular film along the heat-seals into bag-shaped containers, and conveying the tubular film over a set distance to a following step while the heat-seals of the heat-sealed tubular film being press-held and cooled. Also the present invention relates to an apparatus for continuously forming bags for heat-sealing a continuous tubular plastic film, such as a continuously formed inflation tube or the like, widthwise at given positions thereof while the tubular film is being conveyed, and then cutting the tubular film along the heat-seals into bag-shaped containers.

Abstract: A blowbag manufacturing method for manufacturing blowbags made of thermoplastic material and which are used for containing pharmaceuticals, foodstuffs, cosmetics and the like. The blowbag manufacturing method of the present invention, blowmolds a blowbag having a body portion (1) with opposing walls which are flat in section and an opening portion (2) connected to the body portion (1), supports the flat surfaces of the blowmolded blowbag body portion (1) by a pressing surface (8) of a pressing jig (6) having an area smaller than the flat surfaces and so that those flat surfaces are in close contact, and prints required items to an upper surface of those opposing wall surfaces of the body portion (1) in close contact.

Abstract: This invention provides an improved system for transporting plastics articles such as containers for foods from one place such as a plastics articles-manufacturing plant to another such as a goods-charging plant and encompasses vehicle means for transporting the articles in large quantities, devices which receive the articles from the vehicle means, convey the articles and discharge them into a pipeline for pneumatic conveyance and a device which is installed at the delivery end of the pipeline, which stores the articles and which is provided with means capable of discharging them therefrom at a predetermined rate.

Abstract: An egg inspecting apparatus utilizes the light reception signals of 575 m.mu., 590 m.mu., and 620 m.mu. obtained from the light beams passed through an egg to be inspected, in such a manner the light reception signal of 575 m.mu. is calibrated by basing on the light reception signal 590 m.mu. and is compared with a blood-containing egg level to select blood-containing eggs, and the light reception signal of 620 m.mu. is compared with an addled egg level to select addled eggs.

Abstract: An egg inspecting apparatus operating to apply different lights necessary for detecting blood-containing eggs, addled or turbid eggs and eggs affected with bacteria to an egg to be inspected, to subject lights from the egg to photo-electric conversion to obtain electrical signals, and to detect the levels of these electrical signals so as to determine whether or not the egg is inferior or defective.