Patents by Inventor Hisayasu Kaneshiro
Hisayasu Kaneshiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9656410Abstract: A film is formed by extruding a resin from a lip opening (3) of a multilayer extrusion die (1) in a state in which a rectifying jig (10) does not cover the lip opening (3) but covers a seal part (6) while being located adjacent to each end in a longer side direction of the lip opening (3).Type: GrantFiled: November 28, 2013Date of Patent: May 23, 2017Assignee: KANEKA CORPORATIONInventors: Takashi Urabe, Hisayasu Kaneshiro, Koji Hanada
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Patent number: 9441082Abstract: A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component.Type: GrantFiled: December 24, 2014Date of Patent: September 13, 2016Assignee: KANEKA CORPORATIONInventors: Hisayasu Kaneshiro, Toshihisa Itoh, Kiyokazu Akahori
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Patent number: 9393721Abstract: In the present invention, (i) a polyamic acid solution for forming a thermoplastic polyimide layer to be in no contact with a support contains no chemical dehydrating agent or imidization catalyst, (ii) a polyamic acid solution for forming a thermoplastic polyimide layer to be in contact with the support contains an imidization catalyst, and (iii) a polyamic acid solution for forming a non-thermoplastic polyimide layer contains a chemical dehydrating agent and an imidization catalyst. This arrangement eliminates a property difference between the thermoplastic polyimide layers.Type: GrantFiled: December 7, 2011Date of Patent: July 19, 2016Assignee: KANEKA CORPORATIONInventors: Teruo Matsutani, Yasutaka Kondo, Hisayasu Kaneshiro
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Publication number: 20150336293Abstract: A film is formed by extruding a resin from a lip opening (3) of a multilayer extrusion die (1) in a state in which a rectifying jig (10) does not cover the lip opening (3) but covers a seal part (6) while being located adjacent to each end in a longer side direction of the lip opening (3).Type: ApplicationFiled: November 28, 2013Publication date: November 26, 2015Applicant: KANEKA CORPORATIONInventors: Takashi URABE, Hisayasu KANESHIRO, Koji HANADA
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Publication number: 20150118472Abstract: A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component.Type: ApplicationFiled: December 24, 2014Publication date: April 30, 2015Applicant: KANEKA CORPORATIONInventors: Hisayasu Kaneshiro, Toshihisa Itoh, Katsunori Yabuta, Kiyokazu Akahori
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Publication number: 20150119534Abstract: A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component.Type: ApplicationFiled: December 24, 2014Publication date: April 30, 2015Applicant: KANEKA CORPORATIONInventors: Hisayasu KANESHIRO, Toshihisa Itoh, Kiyokazu Akahori
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Patent number: 8993108Abstract: An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100° C. to 200° C. in a range of 5 ppm/° C. to 20 ppm/° C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100° C. to 200° C. in a range of 9 ppm/° C. to 30 ppm/° C.Type: GrantFiled: July 18, 2008Date of Patent: March 31, 2015Assignee: Kaneka CorporationInventors: Masayoshi Shimizu, Hisayasu Kaneshiro, Shogo Fujimoto
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Patent number: 8962790Abstract: A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component.Type: GrantFiled: February 13, 2007Date of Patent: February 24, 2015Assignee: Kaneka CorporationInventors: Hisayasu Kaneshiro, Toshihisa Itoh, Katsunori Yabuta, Kiyokazu Akahori
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Publication number: 20130256943Abstract: In the present invention, (i) a polyamic acid solution for forming a thermoplastic polyimide layer to be in no contact with a support contains no chemical dehydrating agent or imidization catalyst, (ii) a polyamic acid solution for forming a thermoplastic polyimide layer to be in contact with the support contains an imidization catalyst, and (iii) a polyamic acid solution for forming a non-thermoplastic polyimide layer contains a chemical dehydrating agent and an imidization catalyst. This arrangement eliminates a property difference between the thermoplastic polyimide layers.Type: ApplicationFiled: December 7, 2011Publication date: October 3, 2013Applicant: KANEKA CORPORATIONInventors: Teruo Matsutani, Yasutaka Kondo, Hisayasu Kaneshiro
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Patent number: 8513373Abstract: A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process for the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid dianhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can giveType: GrantFiled: September 20, 2005Date of Patent: August 20, 2013Assignee: Kaneka CorporationInventors: Hisayasu Kaneshiro, Takashi Kikuchi
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Patent number: 8426548Abstract: A polyimide film which, especially when superposed on a metal layer by the laminating method, has the function of diminishing the thermal distortion to be imposed on the material; an adhesive film and a flexible metal-clad laminate each comprising or obtained with the polyimide film. the polyimide film is obtained by reacting an aromatic diamine with an aromatic acid dianhydride and imidiating the polyamic acid obtained, and has a storage elastic modulus in a specific range.Type: GrantFiled: September 14, 2005Date of Patent: April 23, 2013Assignee: Kaneka CorporationInventors: Takashi Kikuchi, Hisayasu Kaneshiro
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Publication number: 20130011687Abstract: Provided are a multilayer polyimide film that hardly suffers from the peeling of the layers from each other or the clouding of a space between the layers (turning white in color) during heating at a high temperature and a flexible metal-clad laminate using such a multilayer polyimide film. This object can be attained by a multilayer polyimide film having a thermoplastic polyimide layer on at least one side of a nonthermoplastic polyimide layer, wherein at least 60% of the total number of moles of an acid dianhydride monomer and a diamine monomer that constitute the thermoplastic polyimide is the same type of monomer as at least one type of acid dianhydride monomer and at least one type of diamine monomer that constitute the nonthermoplastic polyimide.Type: ApplicationFiled: January 13, 2011Publication date: January 10, 2013Applicant: KANEKA CORPORATIONInventors: Teruo Matsutani, Yasutaka Kondo, Shogo Fujimoto, Shinji Matsukubo, Hisayasu Kaneshiro
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Patent number: 8338560Abstract: The present invention provides a polyimide film and its usage. The polyimide film according to the present invention does not cause dimensional change due to thermal stress. The present invention particularly relates to a polyimide film and its usage, which polyimide film has a characteristic of suppressing thermal deformation of the material in lamination of a polyimide film and a metal layer by a laminate method. The polyimide film according to the present invention has the following characteristics: (1) an inflexion point of storage modulus ranges from 270° C. to 340° C.; (2) tan ?, which is a value obtained by dividing a loss elastic modulus by a storage modulus, has a peak-top in a range of 320° C. to 410° C.; (3) a storage modulus at 380° C. ranges from 0.4 GPa to 2.0 GPa; and (4) a storage modulus ?1 at the inflexion point (GPa) and a storage modulus ?2 at 380° C. (GPa) satisfy: 85?{(?1??2)/?1}×100?65.Type: GrantFiled: April 25, 2006Date of Patent: December 25, 2012Assignee: Kaneka CorporationInventors: Hisayasu Kaneshiro, Takashi Kikuchi
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Patent number: 8298366Abstract: Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulating layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E?2/E?1 between the storage elasticity modulus E?1 at 25° C. and the storage elasticity modulus E?2 at 380° C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200° C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250° C. after heat treatment at 380° C. for 30 seconds under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.Type: GrantFiled: August 30, 2011Date of Patent: October 30, 2012Assignee: Kaneka CorporationInventors: Hisayasu Kaneshiro, Takashi Kikuchi
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Patent number: 8293331Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.Type: GrantFiled: February 9, 2012Date of Patent: October 23, 2012Assignee: Kaneka CorporationInventors: Hisayasu Kaneshiro, Takashi Kikuchi, Shogo Fujimoto
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Publication number: 20120156388Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.Type: ApplicationFiled: February 9, 2012Publication date: June 21, 2012Applicant: Kaneka CorporationInventors: Hisayasu Kaneshiro, Takashi Kikuchi, Shogo Fujimoto
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Patent number: 8158268Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.Type: GrantFiled: February 1, 2008Date of Patent: April 17, 2012Assignee: Kaneka CorporationInventors: Hisayasu Kaneshiro, Takashi Kikuchi, Shogo Fujimoto
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Publication number: 20110308725Abstract: Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulting layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E?2/E?1 between the storage elasticity modulus E?1 at 25° C. and the storage elasticity modulus E?2 at 380° C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200° C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250° C. after heat treatment at 380° C. for 30 second under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.Type: ApplicationFiled: August 30, 2011Publication date: December 22, 2011Applicant: Kaneka CorporationInventors: Hisayasu Kaneshiro, Takashi Kikuchi
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Patent number: 7951251Abstract: It is an object of the present invention to provide an adhesive film which is used for producing, by a laminating method, a flexible metal-clad laminate in which the change in dimensions is suppressed, a flexible metal-clad laminate including the adhesive film, and a production method therefor.Type: GrantFiled: December 28, 2004Date of Patent: May 31, 2011Assignee: Kaneka CorporationInventors: Takashi Kikuchi, Hiroyuki Tsuji, Hisayasu Kaneshiro
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Publication number: 20110033682Abstract: An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100° C. to 200° C. in a range of 5 ppm/° C. to 20 ppm/° C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100° C. to 200° C. in a range of 9 ppm/° C. to 30 ppm/° C.Type: ApplicationFiled: July 18, 2008Publication date: February 10, 2011Inventors: Masayoshi Shimizu, Hisayasu Kaneshiro, Shogo Fujimoto