Abstract: Provided is a resin composition which is capable of forming a molded body that has excellent surface hardness, transparency, hue and weather resistance, while exhibiting excellent wet heat resistance. A resin composition which contains a (meth)acrylic copolymer (A) and a polycarbonate-based resin (B), and wherein: the (meth)acrylic copolymer (A) contains an aromatic (meth)acrylate unit (a1), a methyl (meth)acrylate unit (a2) and a (meth)acrylate unit (a3) represented by formula (1); the mass ratio (a1)/(a2) is from 5/95 to 85/15; the content of the unit (a3) is 0.1-10 parts by mass relative to 100 parts by mass of the total of the units (a1) and (a2); and the unit (a1) is different from the unit (a3).

Abstract: Provided is a resin composition which is capable of forming a molded body that has excellent surface hardness, transparency, hue and weather resistance, while exhibiting excellent wet heat resistance. A resin composition which contains a (meth)acrylic copolymer (A) and a polycarbonate-based resin (B), and wherein: the (meth)acrylic copolymer (A) contains an aromatic (meth)acrylate unit (a1), a methyl (meth)acrylate unit (a2) and a (meth)acrylate unit (a3) represented by formula (1); the mass ratio (a1)/(a2) is from 5/95 to 85/15; the content of the unit (a3) is 0.1-10 parts by mass relative to 100 parts by mass of the total of the units (a1) and (a2); and the unit (a1) is different from the unit (a3).

Abstract: Disclosed is a polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; and a filler (B), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the filler (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the polyamide (A).

Abstract: According to one embodiment, the present invention provides a resin composition, which comprises a polymer (A) containing 45% by mass or more of a (meth)acrylate unit (a) represented by the following formula (1), a polymer (B) containing 60% by mass or more of a methyl (meth)acrylate unit (b) and having a mass average molecular weight of 5,000 to 20,000, and a polycarbonate-based resin (C).

Abstract: Provided is a resin composition that, according to one embodiment, contains a (meth)acrylic copolymer (A), a polycarbonate-based resin (B), an ultraviolet absorber (C), and an antioxidant (D), the (meth)acrylic copolymer (A) containing 5-85% by mass of (meth)acrylate units (a) represented by general formula (1) and 15-95% by mass of methyl (meth)acrylate units (b), wherein the resin composition contains 0.1-1.5 parts by mass of (C) and 0.05-1.0 part by mass of (D) per 100 parts by mass of the resin component containing (A) and (B).

Abstract: According to one embodiment, the present invention provides a resin composition, which comprises a polymer (A) containing 45% by mass or more of a (meth)acrylate unit (a) represented by the following formula (1), a polymer (B) containing 60% by mass or more of a methyl (meth)acrylate unit (b) and having a mass average molecular weight of 5,000 to 20,000, and a polycarbonate-based resin (C).

Abstract: There are provided a novel aromatic aldehyde compound capable of providing an epoxy resin coating film and an epoxy resin cured material satisfying all of the excellent surface property (smoothness, gloss), drying property, water resistance, transparency and adhesion, and an epoxy resin curing agent and an epoxy resin composition containing the aromatic aldehyde compound. The aromatic aldehyde has a branched alkyl group having 10 to 14 carbon atoms.

Abstract: Provided is a resin composition that, according to one embodiment, contains a (meth)acrylic copolymer (A), a polycarbonate-based resin (B), an ultraviolet absorber (C), and an antioxidant (D), the (meth)acrylic copolymer (A) containing 5-85% by mass of (meth)acrylate units (a) represented by general formula (1) and 15-95% by mass of methyl (meth)acrylate units (b), wherein the resin composition contains 0.1-1.5 parts by mass of (C) and 0.05-1.0 part by mass of (D) per 100 parts by mass of the resin component containing (A) and (B).

Abstract: The present invention relates to a process for producing an amino compound by subjecting a polyamine and an alkenyl compound to addition reaction in the presence of an alkali metal hydride compound which is capable of supplying the amino compound in a stable manner without occurrence of odor.

Abstract: A polyamide resin which comprises a diamine unit containing 70 mol % or more of a paraxylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms, and which has a phosphorus atom concentration of from 50 to 1,000 ppm and a YI value of 10 or less in the color difference test in accordance with JIS-K-7105.

Abstract: There are provided a novel aromatic aldehyde compound capable of providing an epoxy resin coating film and an epoxy resin cured material satisfying all of the excellent surface property (smoothness, gloss), drying property, water resistance, transparency and adhesion, and an epoxy resin curing agent and an epoxy resin composition containing the aromatic aldehyde compound. The aromatic aldehyde has a branched alkyl group having 10 to 14 carbon atoms.

Abstract: A polyamide resin composed of constitutional units derived from a diamine component 70 mol % or more of which is derived from p-xylylenediamine and constitutional unit derived from a dicarboxylic acid 70 mol % or more of which is derived from an aliphatic dicarboxylic acid having 6 to 18 carbon atoms. The polyamide resin has a number average molecular weight (Mn) of 10,000 to 50,000 and a degree of dispersion (weight average molecular weight/number average molecular weight=Mw/Mn) satisfying the following formula (1): 1.5?(Mw/Mn)?6.0, wherein Mw and Mn are determined by gel permeation chromatography (GPC).

Abstract: Provided is a polyamide resin having high heat resistance, excellent moldability and excellent mechanical properties. The polyamide resin comprises a diamine unit containing 70 mol % or more of a xylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a straight chain aliphatic dicarboxylic acid unit, wherein the xylylenediamine unit is composed of 50 to 95 mol % of p-xylylenediamine and 50 to 5 mol % of m-xylylenediamine; the straight chain aliphatic dicarboxylic acid unit is composed of 50 to 100 mol % of adipic acid and 0 to less than 50 mol % of sebacic acid or other straight chain aliphatic dicarboxylic acids; the molar ratio of reacted diamine units to reacted dicarboxylic acid units (the number of moles of reacted diamine units/the number of moles of reacted dicarboxylic acid units) is less than 0.994; and the polyamide resin has a number average molecular weight of 10,000 to 25,000 and a melting point of 285° C. or more.

Abstract: A method of producing polyamide by the direct polycondensation of a diamine component and a dicarboxylic acid component without using a solvent, such as water. The diamine component containing 70 mol % or more of p-xylylenediamine is added to a reaction system containing the dicarboxylic acid component under pressure while maintaining the reaction system in a molten state. After the addition of the diamine component, the pressure of the reaction system is reduced to atmospheric pressure over 50 min or more at a pressure falling speed of 1.0 MPa/h or less. By the production method, polyamide with a small molecular weight dispersion is easily produced.

Abstract: The present invention relates to a process for producing an amino compound by subjecting a polyamine and an alkenyl compound to addition reaction in the presence of an alkali metal hydride compound which is capable of supplying the amino compound in a stable manner without occurrence of odor.

Abstract: Provided is a polyamide resin having high heat resistance, excellent moldability and excellent mechanical properties. The polyamide resin comprises a diamine unit containing 70 mol % or more of a xylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a straight chain aliphatic dicarboxylic acid unit, wherein the xylylenediamine unit is composed of 50 to 95 mol % of p-xylylenediamine and 50 to 5 mol % of m-xylylenediamine; the straight chain aliphatic dicarboxylic acid unit is composed of 50 to 100 mol % of adipic acid and 0 to less than 50 mol % of sebacic acid or other straight chain aliphatic dicarboxylic acids; the molar ratio of reacted diamine units to reacted dicarboxylic acid units (the number of moles of reacted diamine units/the number of moles of reacted dicarboxylic acid units) is less than 0.994; and the polyamide resin has a number average molecular weight of 10,000 to 25,000 and a melting point of 285° C. or more.

Abstract: Disclosed is a flame-retardant polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; an organic halogen compound (B) that serves as a flame retardant; an inorganic compound (C) that serves as a flame retardant aid; and an inorganic filler (D), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the organic halogen compound (B), a content of the inorganic compound (C), and a content of the inorganic filler (D) are 1 to 100 parts by mass, 0.5 to 50 parts by mass, and 0 to 100 parts by mass, respectively, with respect to 100 parts by mass of the polyamide (A).

Abstract: The present invention relates to a curing agent composition for epoxy resins comprising (A) a polyamine compound which is a reaction product of a compound having at least one glycidyl group in a molecule with a diamine having a specific structure, (B) a polyether-modified polysiloxane having a surface tension in the range of 19 dyne/cm to 25 dyne/cm and (C) an amino group-modified polysiloxane having a total amine value in the range of 150 mgKOH/g to 650 mgKOH/g which can provide excellent curing performances, excellent performances of epoxy resin cured coating films and excellent physical properties of epoxy resin cured products, an epoxy resin composition comprising said curing agent composition for epoxy resins and an epoxy resin cured product obtained by curing said epoxy resin composition.

Abstract: The present invention provides a polyurethane resin composition containing an active hydrogen compound (A) formed by adding m-xylylene diisocyanate and/or hexamethylene diisocyanate to a specific compound (C) at a reaction equivalent ratio ([the number of isocyanate groups]/[the number of hydroxyl groups]) of 0.80 to 0.10; and an organic polyisocyanate compound (B) formed by adding a specific compound (D) to m-xylylene diisocyanate and/or hexamethylene diisocyanate at a reaction equivalent ratio ([the number of isocyanate groups]/[the number of hydroxyl groups]) of 2 to 10; an adhesive and a coating material containing the resin composition; and a multi-layer film and a packaging bag containing any of these.

Abstract: Disclosed is a polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; and a filler (B), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the filler (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the polyamide (A).