Patents by Inventor Hisayuki Kuwahara

Hisayuki Kuwahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120172512
    Abstract: Disclosed is a flame-retardant polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; an organic halogen compound (B) that serves as a flame retardant; an inorganic compound (C) that serves as a flame retardant aid; and an inorganic filler (D), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the organic halogen compound (B), a content of the inorganic compound (C), and a content of the inorganic filler (D) are 1 to 100 parts by mass, 0.5 to 50 parts by mass, and 0 to 100 parts by mass, respectively, with respect to 100 parts by mass of the polyamide (A).
    Type: Application
    Filed: September 14, 2010
    Publication date: July 5, 2012
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kentaro Ishii, Hisayuki Kuwahara, Shun Ogawa, Shinichi Ayuba, Takahiko Sumino
  • Publication number: 20120065327
    Abstract: A polyamide resin which comprises a diamine unit containing 70 mol % or more of a paraxylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms, and which has a phosphorus atom concentration of from 50 to 1,000 ppm and a YI value of 10 or less in the color difference test in accordance with JIS-K-7105.
    Type: Application
    Filed: May 28, 2010
    Publication date: March 15, 2012
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY INC
    Inventors: Shun Ogawa, Shinichi Ayuba, Takahiko Sumino, Hisayuki Kuwahara, Kentaro Ishii
  • Publication number: 20110245454
    Abstract: A method of producing polyamide by the direct polycondensation of a diamine component and a dicarboxylic acid component without using a solvent, such as water. The diamine component containing 70 mol % or more of p-xylylenediamine is added to a reaction system containing the dicarboxylic acid component under pressure while maintaining the reaction system in a molten state. After the addition of the diamine component, the pressure of the reaction system is reduced to atmospheric pressure over 50 min or more at a pressure falling speed of 1.0 MPa/h or less. By the production method, polyamide with a small molecular weight dispersion is easily produced.
    Type: Application
    Filed: September 11, 2009
    Publication date: October 6, 2011
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hisayuki Kuwahara, Tomomichi Kanda, Shun Ogawa, Shinichi Ayuba, Kentaro Ishii, Takahiko Sumino
  • Publication number: 20110224370
    Abstract: A polyamide resin composed of constitutional units derived from a diamine component 70 mol % or more of which is derived from p-xylylenediamine and constitutional unit derived from a dicarboxylic acid 70 mol % or more of which is derived from an aliphatic dicarboxylic acid having 6 to 18 carbon atoms. The polyamide resin has a number average molecular weight (Mn) of 10,000 to 50,000 and a degree of dispersion (weight average molecular weight/number average molecular weight=Mw/Mn) satisfying the following formula (1): 1.5?(Mw/Mn)?6.0, wherein Mw and Mn are determined by gel permeation chromatography (GPC).
    Type: Application
    Filed: September 15, 2009
    Publication date: September 15, 2011
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Tomomichi Kanda, Hisayuki Kuwahara, Shun Ogawa, Takahiko Sumino, Kentaro Ishii
  • Publication number: 20100189937
    Abstract: To provide a polyurethane resin composition which exhibits high gas-barrier property and excellent adhesion to various polymers, paper, metals, etc., which can prevent generation of cracks or pinholes in a gas-barrier layer through flexion treatment, and which exhibits excellent content resistance; an adhesive containing the resin composition; and a multi-layer film containing the adhesive. The invention provides a polyurethane resin composition containing an active hydrogen compound (A) formed by adding m-xylylene diisocyanate and/or hexamethylene diisocyanate to a specific compound (C) at a reaction equivalent ratio ([the number of isocyanate groups]/[the number of hydroxyl groups]) of 0.80 to 0.
    Type: Application
    Filed: July 24, 2008
    Publication date: July 29, 2010
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Shun Ogawa, Hisayuki Kuwahara, Takeshi Koyama
  • Patent number: 7598325
    Abstract: The present invention relates to a curing agent for epoxy resins comprising (A) an epoxy adduct of isophoronediamine, (B) an epoxy adduct of 1,3-bis(aminomethyl) cyclohexane, (C) isophoronediamine and (D) 1,3-bis (aminomethyl) cyclohexane wherein the weight ratio of (D) to (C) (=(D)/(C)) in said curing agent is in the range of 0.04 to 0.22, which can provide an epoxy resin composition with excellent curing performances such as curability under the condition of low temperature, excellent performances of epoxy resin cured coating films, excellent chemical resistance of epoxy resin cured coating films and excellent physical properties of epoxy resin cured products.
    Type: Grant
    Filed: January 24, 2007
    Date of Patent: October 6, 2009
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Shun Ogawa, Hisayuki Kuwahara
  • Patent number: 7572877
    Abstract: An object of the present invention is to provide a modified cyclic aliphatic polyamine having a low viscosity and a small content of unreacted polyamine which can provide, when it is used as a curing agent for epoxy resin, an epoxy resin composition having an improved workability without adding solvent or diluent and an excellent property of epoxy resin cure product. The above modified cyclic aliphatic polyamine is obtained by addition reaction of a cyclic aliphatic polyamine such as isophoronediamine and norbornanediamine and an alkenyl compound such as styrene. The modified cyclic aliphatic polyamine thus obtained is added in epoxy resin to be used as a curing agent for epoxy resin.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: August 11, 2009
    Assignee: Mitsubishi Gaschemical Company, Inc.
    Inventors: Takeshi Koyama, Tetsushi Ichikawa, Hisayuki Kuwahara, Masatoshi Echigo
  • Patent number: 7473806
    Abstract: A modified chain aliphatic polyamine obtained by addition reaction of a chain aliphatic polyamine having a specific structure and an unsaturated hydrocarbon compound has a low viscosity and it provides, when used as a curing agent for epoxy resin, an epoxy resin composition which can provide an epoxy resin cured product having an excellent property. Further, a modified chain aliphatic polyamine composition obtained by addition reaction of a chain aliphatic polyamine having a specific structure and an unsaturated hydrocarbon compound followed by the removing step of unreacted chain aliphatic polyamine to reduce its amount less than 2% by weight provides, when used as a curing agent for epoxy resin, an epoxy resin composition which can provide an epoxy resin cured product having an excellent property.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: January 6, 2009
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masatoshi Echigo, Hisayuki Kuwahara, Takeshi Koyama
  • Patent number: 7414097
    Abstract: The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl group and at least one hydroxyl group within the molecule, which can achieve a low viscosity without containing environmental harmful substances such as phenol and solvents. In addition, the epoxy resin composition using said epoxy resin curing agent shows an excellent curability at low temperature and it provides a cured coating film having excellent appearance.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: August 19, 2008
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hisayuki Kuwahara, Masatoshi Echigo, Takeshi Koyama
  • Patent number: 7396902
    Abstract: The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl group and at least one hydroxyl group within the molecule, which can achieve a low viscosity without containing environmental harmful substances such as phenol and solvents. In addition, the epoxy resin composition using said epoxy resin curing agent shows an excellent curability at low temperature and it provides a cured coating film having excellent appearance H2N—H2C-A-CH2—NH2??(1) wherein A is a phenylene group or a cyclohexylene group.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: July 8, 2008
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hisayuki Kuwahara, Masatoshi Echigo, Takeshi Koyama
  • Patent number: 7364668
    Abstract: The present invention provides a process for producing an amino composition by addition reaction between a polyamine and an unsaturated hydrocarbon compound in the presence of a strongly basic alkali metal catalyst to obtain an amino composition containing not more than 2% by weight of unreacted polyamine and preferably not more than 10 ppm of alkali metal.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: April 29, 2008
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hisayuki Kuwahara, Tsutomu Numoto, Masatoshi Echigo, Shun Ogawa
  • Publication number: 20080090990
    Abstract: An object of the present invention is to provide a modified cyclic aliphatic polyamine having a low viscosity and a small content of unreacted polyamine which can provide, when it is used as a curing agent for epoxy resin, an epoxy resin composition having an improved workability without adding solvent or diluent and an excellent property of epoxy resin cure product. The above modified cyclic aliphatic polyamine is obtained by addition reaction of a cyclic aliphatic polyamine such as isophoronediamine and norbornanediamine and an alkenyl compound such as styrene. The modified cyclic aliphatic polyamine thus obtained is added in epoxy resin to be used as a curing agent for epoxy resin.
    Type: Application
    Filed: October 22, 2007
    Publication date: April 17, 2008
    Inventors: Takeshi Koyama, Tetsushi Ichikawa, Hisayuki Kuwahara, Masatoshi Echigo
  • Patent number: 7301053
    Abstract: An object of the present invention is to provide a modified cyclic aliphatic polyamine having a low viscosity and a small content of unreacted polyamine which can provide, when it is used as a curing agent for epoxy resin, an epoxy resin composition having an improved workability without adding solvent or diluent and an excellent property of epoxy resin cure product. The above modified cyclic aliphatic polyamine is obtained by addition reaction of a cyclic aliphatic polyamine such as isophoronediamine and norbornanediamine and an alkenyl compound such as styrene. The modified cyclic aliphatic polyamine thus obtained is added in epoxy resin to be used as a curing agent for epoxy resin.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: November 27, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takeshi Koyama, Tetsushi Ichikawa, Hisayuki Kuwahara, Masatoshi Echigo
  • Publication number: 20070179258
    Abstract: The present invention relates to a curing agent for epoxy resins comprising (A) an epoxy adduct of isophoronediamine, (B) an epoxy adduct of 1,3-bis(aminomethyl) cyclohexane, (C) isophoronediamine and (D) 1,3-bis (aminomethyl) cyclohexane wherein the weight ratio of (D) to (C) (=(D)/(C)) in said curing agent is in the range of 0.04 to 0.22, which can provide an epoxy resin composition with excellent curing performances such as curability under the condition of low temperature, excellent performances of epoxy resin cured coating films, excellent chemical resistance of epoxy resin cured coating films and excellent physical properties of epoxy resin cured products.
    Type: Application
    Filed: January 24, 2007
    Publication date: August 2, 2007
    Inventors: Shun Ogawa, Hisayuki Kuwahara
  • Publication number: 20070155915
    Abstract: The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl group and at least one hydroxyl group within the molecule, which can achieve a low viscosity without containing environmental harmful substances such as phenol and solvents. In addition, the epoxy resin composition using said epoxy resin curing agent shows an excellent curability at low temperature and it provides a cured coating film having excellent appearance.
    Type: Application
    Filed: March 5, 2007
    Publication date: July 5, 2007
    Inventors: Hisayuki Kuwahara, Masatoshi Echigo, Takeshi Koyama
  • Publication number: 20070142572
    Abstract: The present invention relates to a curing agent composition for epoxy resins comprising (A) a polyamine compound which is a reaction product of a compound having at least one glycidyl group in a molecule with a diamine having a specific structure, (B) a polyether-modified polysiloxane having a surface tension in the range of 19 dyne/cm to 25 dyne/cm and (C) an amino group-modified polysiloxane having a total amine value in the range of 150 mgKOH/g to 650 mgKOH/g which can provide excellent curing performances, excellent performances of epoxy resin cured coating films and excellent physical properties of epoxy resin cured products, an epoxy resin composition comprising said curing agent composition for epoxy resins and an epoxy resin cured product obtained by curing said epoxy resin composition.
    Type: Application
    Filed: December 12, 2006
    Publication date: June 21, 2007
    Inventors: Shun Ogawa, Hisayuki Kuwahara
  • Patent number: 7157606
    Abstract: The process for producing an amino composition of the present invention by addition reaction of a polyamine with an alkenyl group-containing compound wherein said polyamine is reacted preliminarily with a strongly basic catalyst to produce a reaction mixture comprising a reaction intermediate and then an alkenyl group-containing compound is added to the reaction mixture to proceed the addition reaction provides an amino composition having stable properties.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: January 2, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masatoshi Echigo, Hisayuki Kuwahara, Takeshi Koyama
  • Patent number: 7109289
    Abstract: A modified polyoxyalkylene polyamine obtained by addition reaction of a polyoxyalkylene polyamine and an alkenyl group-containing compound has a low viscosity and it provides, when used as a curing agent for epoxy resin, an epoxy resin composition which can provide an epoxy resin cured product having excellent chemical resistance.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: September 19, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masatoshi Echigo, Hisayuki Kuwahara, Takeshi Koyama
  • Publication number: 20050137424
    Abstract: The present invention provides a process for producing an amino composition by addition reaction between a polyamine and an unsaturated hydrocarbon compound in the presence of a strongly basic alkali metal catalyst to obtain an amino composition containing not more than 2% by weight of unreacted polyamine and preferably not more than 10 ppm of alkali metal, which at least comprises the following steps: (A) a step of conducting addition reaction between a polyamine and an unsaturated hydrocarbon compound in the presence of a strongly basic alkali metal catalyst to obtain a reaction liquid containing an amino composition (addition reaction-step), (B) a step of removing unreacted polyamine from said reaction liquid containing an amino composition obtained by said addition reaction-step (A) in the form of a mixture of water and unreacted polyamine by steam stripping to obtain an amino composition wherein the content of unreacted polyamine is not more than 2% by weight (steam stripping-step), and further, if neces
    Type: Application
    Filed: December 3, 2004
    Publication date: June 23, 2005
    Inventors: Hisayuki Kuwahara, Tsutomu Numoto, Masatoshi Echigo, Shun Ogawa
  • Patent number: 6908982
    Abstract: An object of the present invention is to provide an amino composition which provides, when used as a curing agent for epoxy resin, a long pot life and an excellent appearance of a coating film to an epoxy resin composition without deteriorating the reactivity of the composition. The amino composition is obtained by addition reaction of diamine such as metaxylylenediamine and 1,3-bis(aminomethyl) cyclohexane and styrene, wherein the content of the diamine is less than 15% by weight based upon the total weight of the amino composition and the content of 1-addition product of having one phenethyl group is 50 to 100% by weight based upon the total weight of amino compound(s) obtained by the addition reaction.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: June 21, 2005
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Tetsushi Ichikawa, Hisayuki Kuwahara, Masatoshi Echigo