HITACHI CABLE, LTD. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: Problem There is proposed an innovative cross-sectional structure, with an idea contrary to the conventional one, utilizing the non-reactivity between Cu and Ta (or between Ag and Nb, Ta) in a high-temperature short-time heat treatment, thus achieving (1) the suppression of the low magnetic-field instability, (2) excellent wire drawability of a precursor wire, and (3) the reduction of the cost required for the incorporation of a stabilizer. Means for Resolution There is proposed a structure having an assembly of a plurality of single wires, wherein the assembly is covered with an outer cover (skin) formed from Nb or Ta, wherein each of the single wires has an Nb/Al composite filament region which is formed from a composite of Nb and Al mixed in an Nb:Al molar ratio of 3:1, and which is covered with a partition formed from Nb or Ta, and further covered with an interfilamentary barrier formed from Cu or Ag disposed around the partition.
November 15, 2012
December 3, 2015
HITACHI CABLE, LTD., NATIONAL INSTITUTE FOR MATERIALS SCIENCE, INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION
Hitachi Cable, Ltd., Inter-University Research Institute Corporation, National Institute For Materials Science
Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
Abstract: A cable holder includes a pair of holding members that are relatively moved in a predetermined sliding direction to sandwich and hold a cable therebetween. The pair of holding members each include a plurality of guide planes each parallel to the sliding direction and a plurality of sliding contact surfaces parallel to the sliding direction. One of the pair of holding members is guided in the sliding direction by sliding the sliding contact surfaces thereof on the guide planes of the other holding member. The other holding member is guided in the sliding direction by sliding the sliding contact surfaces thereof on the guide planes of the one of the holding members. The pair of holding members are fixed to each other by a frictional force between the sliding contact surfaces and the guide planes in a state of holding the cable.
Abstract: A cable with a wire disconnection detection function includes a detecting wire including a conductor formed by twisting a plurality of strands, and a detected wire including a conductor formed by twisting a plurality of the strands. A twist pitch of the conductor of the detecting wire is longer than that of the conductor of the detected wire.
Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.
Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.
Abstract: An optical module has a circuit board, a photoelectric conversion element mounted on a mount surface of the circuit board, an optical coupling member for holding an optical fiber and optically coupling the optical fiber and the photoelectric conversion element, a semiconductor circuit element mounted on the mount surface of the circuit board and electrically connected to the photoelectric conversion element, and a plate-shaped supporting substrate arranged to sandwich the optical coupling member between the supporting substrate and the circuit board. An electrically conductive metal foil which extends in a thickness direction of the supporting substrate is provided integrally with a side surface of the supporting substrate, and the metal foil is connected at one end thereof to an electrode provided on a non-mount surface of the circuit board.
Abstract: A crosslinked rubber is composed of rubber molecules, which, before crosslinking, contain hot dissociatable and cold associatable crosslinking groups to dissociate from each other in a hot state and associate together in a cold state, and silane crosslinking groups, and which, after molding, are silane-crosslinked together by a silanol condensation reaction of the silane crosslinking groups together with moisture, with the hot dissociatable and cold associatable crosslinking groups associated together.
Abstract: A photoelectric composite wiring module includes a flexible first substrate including a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof, a second substrate including a recessed portion formed thereon to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate, and an optical device mounted on the second substrate and optically coupled to the optical fiber. The recessed portion includes an opening on a mounting surface side of the second substrate to mount the optical device.
Abstract: A flat wiring material includes a plurality of conductors arranged in parallel, an insulating covering member covering collectively the plurality of conductors while allowing both end portions of the plurality of conductors to be exposed, an engaging member disposed at a position on the covering member and close to at least one of the exposed both end portions of the plurality of conductors and including an insertion portion that is formed at an end portion extending in the width direction for being inserted into and engaged with a through-hole formed on a mounting substrate, and a fixing member fixing the engaging member to the covering member. The insertion portion of the engaging member includes an opening allowing an elastic deformation thereof upon the insertion into the through-hole and a protruding portion for preventing disengagement in a direction opposite to the insertion direction after being inserted into the through-hole.
Abstract: An optical module includes a circuit board having flexibility, a photoelectric conversion element mounted on a mounting surface of the circuit board, a semiconductor circuit element mounted on the mounting surface of the circuit board and electrically connected to the photoelectric conversion element, a plate-shaped optical connection member having a groove into which an end part of an optical fiber is pushed so as to be housed and optically connecting the optical fiber and the photoelectric conversion element, and a supporting member arranged so as to sandwich the optical connection member between the circuit board. The groove is formed between the semiconductor circuit element and the supporting member so as to have an opening into which the optical fiber is pushed at the supporting member side. The semiconductor circuit element has a height from the mounting surface of the circuit board higher than the photoelectric conversion element.
Abstract: An optical module includes a circuit board including a mount surface and a non-mount surface opposite the mount surface, a photoelectric conversion element mounted on the mount surface of the circuit board, an optical coupling member for holding an optical fiber and optically coupling the optical fiber and the photoelectric conversion element, a semiconductor circuit element mounted on the mount surface of the circuit board, and electrically connected to the photoelectric conversion element, a plate-shaped supporting member arranged so as to sandwich the optical coupling member between the supporting member and the circuit board, and an electrically conductive body supported by the supporting member, extended in a thickness direction of the supporting member, and connected at one end to an electrode provided on the non-mount surface of the circuit board.
Abstract: An optical module includes a substrate, an optical device of a surface-emitting element or a surface-receiving element mounted on a surface of the substrate with a light-emitting portion or a light-receiving portion located to face the surface of the substrate, an optical fiber disposed parallel to the surface of the substrate and in a longitudinal direction of the substrate, a mirror provided to face the light-emitting portion or the light-receiving portion of the optical device and a tip of the optical fiber, and optically connect the optical device and the optical fiber, and an optical fiber receiving groove provided in the surface of the substrate to receive the optical fiber. A width of the mirror is greater than a width of the optical fiber receiving groove. Reflecting portions are provided on edges, respectively, of a mirror side end of the optical fiber receiving groove, and the reflecting portions reflect incident light from the mirror facing the edges, again back to the facing mirror.
Abstract: A piezoelectric element includes a substrate, and at least a lower electrode layer, a piezoelectric film represented by a general formula of (NaxKyLiz)NbO3 (0?x?1, 0?y?1, 0?z?0.2, x+y+z=1); and an upper electrode layer successively formed on the substrate. The piezoelectric film has a crystal structure of pseudo-cubic crystal, tetragonal crystal, orthorhombic crystal, monoclinic crystal or rhombohedral crystal, or has a state that at least two of the crystal structures coexist. The piezoelectric film is preferentially oriented to certain specific axes that are not more than two axes of crystal axes in the crystal structures. At least one of domain crystal component of a c-axis orientation domain crystal component and an a-axis orientation domain crystal component exists as the components of the crystal axes oriented.
Abstract: A nitride semiconductor epitaxial wafer includes a substrate, a GaN layer provided over the substrate, and an AlGaN layer provided over the GaN layer. The GaN layer has a wurtzite crystal structure, and a ratio c/a of a lattice constant c in a c-axis orientation of the GaN layer to a lattice constant a in an a-axis orientation of the GaN layer is not more than 1.6266.
Abstract: A composite material includes a clad material including a base material that includes an iron-chromium alloy and vibration-damping layers that are provided on both surfaces of the base material and include a metal to suppress a vibration.
Abstract: A LAN cable includes an unshielded LAN cable including one or plural pairs of pair twisted wires and a sheath formed collectively covering a periphery of the pair twisted wires. The sheath includes a resin including nickel hydroxide at a mixing mass ratio of not less than 25% and not more than 60%.
Abstract: A network system includes network relay devices including a master device for administrating the network system, and a member device to be administrated by the master device. When the master device receives an authentication request from an external terminal connected to the network system, the master device performs an authentication processing for authorizing or denying the authentication request. When the authentication request is authorized, one network relay device connected to the external terminal in the network system performs a communication-authorizing processing for authorizing a communication between the external terminal and the one network relay device, and performs a transmission processing for transmitting a communication authorization data to an other network relay device which is not connected to the external terminal in the network system.
Abstract: An optical board including a substrate including a plate-shaped resin including a first main plane and a second main plane facing each other, and a slit-shaped optical fiber receiving portion which penetrates between the first main plane and the second main plane in a thickness direction, a metal layer provided on the second main plane, and a wiring pattern consisting of metal and provided on the first main plane. An inclined plane is provided at an end of the optical fiber receiving portion in the substrate, a tilt angle of the inclined plane with respect to the first main plane is an obtuse angle, and a reflective layer is provided on the inclined plane for reflecting a light output from an optical fiber received in the optical fiber receiving portion toward the first main plane.
Abstract: An insulated wire includes a conductor, and an insulating covering layer including a first insulation layer formed around the conductor and a second insulation layer formed around the first insulation layer. An elastic modulus of the second insulation layer at 300° C. is not less than 300 MPa, and a relative permittivity of the insulating covering layer is not more than 3.0.