Abstract: An insulated wire includes a conductor, and an insulating covering layer including a first insulation layer formed around the conductor and a second insulation layer formed around the first insulation layer. An elastic modulus of the second insulation layer at 300° C. is not less than 300 MPa, and a relative permittivity of the insulating covering layer is not more than 3.0.

Abstract: A connection structure for connecting an outer conductor of a differential signal transmission cable to a substrate includes a connecting member including a main body portion and a protruding portion protruding from the main body portion. The outer conductor is connected via the connecting member to the substrate. The connecting member is solder-connected to the outer conductor via the main body portion and is solder-connected to the substrate via the protruding portion.

Abstract: An antenna apparatus includes a horizontal polarization antenna element, and the horizontal polarization antenna element includes a radiation conductor that includes two conductor plates subjected to bending work and arranged to be opposite to each other with a specific interval therebetween and has a tube shape extending in a vertical direction in whole, a ground conductor that is arranged in an inner space surrounded by the two conductor plates of the radiation conductor and is electrically grounded, and a feeding element that is arranged in the inner space, is arranged along inner walls of the conductor plates in a top view, operates as a reverse L antenna when electrical power is fed between one end thereof and the ground conductor, and feeds power to the radiation conductor by electromagnetic coupling.

Abstract: An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.

Abstract: A nitride semiconductor template includes a substrate, and a group III nitride semiconductor layer formed on the substrate and including a Si-doped layer doped with Si as an uppermost layer thereof. The group III nitride semiconductor layer has a total thickness of not less than 4 ?m and not more than 10 ?m. The Si-doped layer includes a Si concentration gradient layer having a carrier concentration that gradually decreases toward an outermost surface thereof so as to be not less than 1×1017 cm?3 and not more than 5×1017 cm?3 at the outermost surface of the group III nitride semiconductor layer.

Abstract: A vehicle battery charger for charging a vehicle that is operable to detect a disengagement of a connecter or a preparing operation of the disengagement of the connector by a change in an electric current value of an electric current output from a terminal of the connecter and to stop charging a storage battery of the vehicle upon the detection includes a charging device configured to charge the vehicle, and a simulation operation device configured to change the electric current value by switching a pathway of the electric current output from the terminal of the connecter in a state that the connecter is in engagement and the preparing operation of the disengagement of the connecter is not carried out so as to cause the vehicle to stop charging the storage battery.

Abstract: There is provided a silicon device structure, comprising: a P-doped n+ type amorphous silicon film formed on a silicon semiconductor, and a wiring formed on the P doped n+ type amorphous silicon film, wherein the wiring is formed of a silicon oxide film which is formed on a surface of the P doped n+ type amorphous silicon film and is also formed of a copper alloy film, and the copper alloy film is a film obtained by forming a copper alloy containing Mn of 1 atom % or more and 5 atom % or less and P of 0.05 atom % or more and 1.0 atom % or less by sputtering.

Abstract: There is provided an insulated wire including a wire conductor and at least one extruded insulation layer formed on the wire conductor. The at least one extruded insulation layer is made of a phase separated resin composition including: a resin (A) including polyether ether ketone as a continuous phase; and a resin (B) with a relative dielectric constant of 2.6 or less as a dispersed phase.

Abstract: An optical module includes a housing, an optical adapter attached to an end portion of the housing, and an optical transmitter assembly mounted in the housing. The optical transmitter assembly includes a TOSA including a plurality of light-emitting elements for outputting optical signals, and a circuit board electrically connected to the TOSA. The TOSA further includes a TOSA base having opposing side surfaces on which the plurality of light-emitting elements are oppositely arranged so as to form at least one pair. The TOSA base includes a light outputting surface having an optical component mounting portion formed thereon, and the optical component mounting portion mounts an optical multiplexer including a plurality of filters.

Abstract: An optical module includes a housing, an optical adapter attached to an end portion of the housing, and an optical transmitter and receiver assembly mounted in the housing. The optical transmitter and receiver assembly includes a TOSA including a plurality of light-emitting elements, a ROSA including a light-receiving element, and a circuit board electrically connected to the TOSA and the ROSA. The TOSA further includes a TOSA base having an opposing side surface on which the plurality of light-emitting elements are oppositely arranged so as to form at least one pair. The circuit board includes a first flexible substrate mounting the TOSA and a first rigid substrate connected to the first flexible substrate. The first flexible substrate includes a TOSA base facing-portion facing the TOSA base, and a connection portion extending from both end portions of the TOSA base-facing portion and connected to the plurality of light-emitting elements.

Abstract: An optical module includes a photoelectric conversion element optically connected to an optical fiber, a plate-shaped substrate mounting the photoelectric conversion element, coupling members fixed to both end portions of the substrate so as to sandwich the photoelectric conversion element, and a cover member coupled to the substrate by the coupling members so as to cover at least a portion of the substrate.

Abstract: A heating element mounting substrate includes a substrate including a first surface and a second surface, a plurality of wiring patterns formed on the first surface of the substrate, and a plurality of filled portions including a conductive material filled in a plurality of through-holes, the plurality of through-holes penetrating through the substrate in a thickness direction. At least one of the plurality of wiring patterns has an area of not less than 30% of an area of the first surface of the substrate. The plurality of filled portions includes non-overlapping portions that extend from the plurality of wiring patterns as viewed from the first surface side of the substrate, areas of the plurality of filled portions overlapped with the plurality of wiring patterns are not less than 50% of respective areas of the corresponding wiring patterns as viewed from the second surface side of the substrate.

Abstract: A heating element mounting substrate includes a substrate including a first surface and a second surface, a plurality of wiring patterns formed on the first surface of the substrate, and a plurality of filled portions including a conductive material filled in a plurality of through-holes, the plurality of through-holes penetrating through the substrate in a thickness direction. At least one of the plurality of wiring patterns has an area of not less than 30% of an area of the first surface of the substrate. Areas of the plurality of filled portions overlapped with the plurality of wiring patterns are not less than 50% of respective areas of the corresponding wiring patterns as viewed from the second surface side of the substrate.

Abstract: To provide metal microparticles, with less content of alkali metal, halogen, sulfur, and phosphorus as impurities, wherein surfaces thereof are coated with a protective agent, and the protective agent is selected from at least one type of an amine compound and a calboxylic acid compound, and a total content of the alkali metal, halogen, sulfur, and phosphorus contained in the metal microparticles is less than 0.1 mass % relative to a mass of the metal microparticles.