Patents by Inventor Hitoshi Iwatsuki

Hitoshi Iwatsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926931
    Abstract: A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 ?m, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: March 12, 2024
    Assignee: Ricoh Company, Ltd.
    Inventors: Akira Saito, Shigenori Yaguchi, Yasuyuki Yamashita, Kiichi Kamoda, Yasuo Suzuki, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida
  • Patent number: 11590685
    Abstract: A fiber aggregation contains fiber containing a thermoplastic resin, each of the fiber being mutually joined and aligned.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: February 28, 2023
    Assignee: RICOH COMPANY, LTD.
    Inventors: Sohichiroh Iida, Hitoshi Iwatsuki, Mitsuru Naruse, Satoshi Ogawa, Yunsheng Sun
  • Patent number: 11504883
    Abstract: Provided is a resin particle producing method including: a fiber aggregate producing step of directly joining fibers containing a thermoplastic resin with each other to obtain a fiber aggregate; and a particle forming step of forming the fiber aggregate into particles to obtain resin particles.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: November 22, 2022
    Assignee: Ricoh Company, Ltd.
    Inventors: Nozomu Tamoto, Hitoshi Iwatsuki, Yasuo Suzuki, Yasuyuki Yamashita, Sohichiroh Iida, Shinzo Higuchi, Akira Saito, Kiichi Kamoda, Yoshihiko Furugohri, Shinsuke Nagai
  • Patent number: 11491713
    Abstract: A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 ?m and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1?Tmf2)?3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1?Cd2)?3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C×1>C×2 and (C×1?C×2)?3 percent.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: November 8, 2022
    Assignee: Ricoh Company, Ltd.
    Inventors: Akira Saito, Yasuyuki Yamashita, Kiichi Kamoda, Shigenori Yaguchi, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida, Yasuo Suzuki
  • Patent number: 11472958
    Abstract: A powder for solid freeform fabrication includes a first resin particle and a second resin particle, wherein MFR2 is greater than MFR1 and a ratio of MFR2 to MFR1 is from 2 to 5, where MFR1 represents a melt mass-flow rate (MFR) of the first resin particle and MFR2 represents a melt mass-flow rate of the second resin particle.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: October 18, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Mitsuru Naruse, Akira Saito, Hitoshi Iwatsuki, Yasuyuki Yamashita, Toshiyuki Mutoh, Yasutomo Aman, Kiichi Kamoda, Sohichiroh Iida, Shinzo Higuchi, Toshiyuki Iseki
  • Patent number: 11458676
    Abstract: A resin powder contains a resin contains columnar particles, wherein the proportion of the columnar particles having a ratio (L/W) of less than 1 is 50 percent by volume or more in the total volume of the resin powder, where W represents the width in the radial direction of the columnar particles and L represents the length in the axis direction of the columnar particles.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: October 4, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Kiichi Kamoda, Akira Saito, Yasutomo Aman, Hitoshi Iwatsuki
  • Publication number: 20220176625
    Abstract: A method of manufacturing a solid freeform fabrication object includes forming a layer of resin powder for solid freeform fabrication including particles having a pillar-like form and solidifying a particular area of the layer with irradiation of laser beams, wherein the laser beams have an energy intensity distribution having a top hat-like form.
    Type: Application
    Filed: February 23, 2022
    Publication date: June 9, 2022
    Applicant: Ricoh Company, Ltd.
    Inventors: Kiichi Kamoda, Yasuyuki Yamashita, Akira Saito, Sohichiroh Iida, Shinzo Higuchi, Hitoshi Iwatsuki, Nozomu Tamoto, Yasuo Suzuki
  • Publication number: 20220048245
    Abstract: A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 ?m and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1?Tmf2)?3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1?Cd2)?3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): Cx1>Cx2 and (Cx1?Cx2)?3 percent.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Inventors: Akira Saito, Yasuyuki Yamashita, Kiichi Kamoda, Shigenori Yaguchi, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida, Yasuo Suzuki
  • Patent number: 11241825
    Abstract: A resin powder contains a resin, wherein the proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: February 8, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Yunsheng Sun, Toshiyuki Mutoh, Hitoshi Iwatsuki, Shigenori Yaguchi, Mitsuru Naruse, Sohichiroh Iida
  • Publication number: 20210402680
    Abstract: A resin powder for solid freeform fabrication contains pillar-like form particles having an average circularity of 0.83 or greater in a particle diameter range of from 0.5 to 200 ?m.
    Type: Application
    Filed: September 13, 2021
    Publication date: December 30, 2021
    Inventors: Nozomu Tamoto, Sohichiroh Iida, Akira Saito, Yasuyuki Yamashita, Hitoshi Iwatsuki, Shinzo Higuchi, Kiichi Kamoda
  • Publication number: 20210317601
    Abstract: A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 ?m, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
    Type: Application
    Filed: June 14, 2021
    Publication date: October 14, 2021
    Inventors: Akira Saito, Shigenori Yaguchi, Yasuyuki Yamashita, Kiichi Kamoda, Yasuo Suzuki, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida
  • Publication number: 20210291438
    Abstract: Provided is a resin powder, wherein when the resin powder is subjected to heating at a rate of 10 degrees C./min to a temperature higher by 30 degrees C. than a melting point (Tm) of the resin powder measured during this heating, and subjected to cooling at a rate of 1 degree C./min from the temperature higher by 30 degrees C. than the melting point (Tm) until the resin powder reaches the melting point (Tm) in differential scanning calorimetry (DSC) according to ISO 3146 (Testing Methods for Transition Temperatures of Plastics, JIS K7121), the resin powder has a loss tangent (tan ?) of 18.0 or greater.
    Type: Application
    Filed: March 2, 2021
    Publication date: September 23, 2021
    Applicant: Ricoh Company, Ltd.
    Inventor: Hitoshi IWATSUKI
  • Publication number: 20210283895
    Abstract: A resin powder for solid freeform fabrication, having a ratio (Mv/Mn) of 2.00 or less, where Mv represents a volume average particle diameter and Mn represents a number average particle diameter and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.
    Type: Application
    Filed: June 1, 2021
    Publication date: September 16, 2021
    Inventors: Akira SAITO, Shigenori YAGUCHI, Yasuo SUZUKI, Nozomu TAMOTO, Shinzo HIGUCHI, Hitoshi IWATSUKI
  • Patent number: 11066758
    Abstract: A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 ?m, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: July 20, 2021
    Assignee: Ricoh Company, Ltd.
    Inventors: Akira Saito, Shigenori Yaguchi, Yasuyuki Yamashita, Kiichi Kamoda, Yasuo Suzuki, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida
  • Patent number: 11052649
    Abstract: A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: July 6, 2021
    Assignee: Ricoh Company, Ltd.
    Inventors: Akira Saito, Shigenori Yaguchi, Yasuo Suzuki, Nozomu Tamoto, Shinzo Higuchi, Hitoshi Iwatsuki
  • Patent number: 11045978
    Abstract: A particle for solid freeform fabrication having a columnar form has end surfaces and a side surface, wherein one of the end surfaces partially covers the side surface.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: June 29, 2021
    Assignee: Ricoh Company, Ltd.
    Inventors: Hitoshi Iwatsuki, Yasuyuki Yamashita, Kiichi Kamoda, Toshiyuki Mutoh, Yasutomo Aman, Toshiyuki Iseki, Mitsuru Naruse, Akira Saito, Shinzo Higuchi, Sohichiroh Iida
  • Publication number: 20210023778
    Abstract: A resin powder for solid freeform fabrication is provided which maintains the degree of smoothness of a thin layer formed with the resin powder for solid freeform fabrication even when the speed of supplying the resin powder for solid freeform fabrication using a recoater is increased and reduce lowering of the degree of smoothness of the thin layer caused by the resin powder for solid freeform fabrication that has scattered and accumulated on the recoater and others.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 28, 2021
    Inventors: Sohichiroh Iida, Hitoshi Iwatsuki, Satoshi Ogawa, Yunsheng Sun
  • Publication number: 20200398458
    Abstract: Provided is a resin particle producing method including: a fiber aggregate producing step of directly joining fibers containing a thermoplastic resin with each other to obtain a fiber aggregate; and a particle forming step of forming the fiber aggregate into particles to obtain resin particles.
    Type: Application
    Filed: November 9, 2018
    Publication date: December 24, 2020
    Inventors: Nozomu TAMOTO, Hitoshi IWATSUKI, Yasuo SUZUKI, Yasuyuki YAMASHITA, Sohichiroh IIDA, Shinzo HIGUCHI, Akira SAITO, Kiichi KAMODA, Yoshihiko FURUGOHRI, Shinsuke NAGAI
  • Patent number: 10800096
    Abstract: A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: October 13, 2020
    Assignee: Ricoh Company, Ltd.
    Inventors: Sohichiroh Iida, Shigenori Yaguchi, Hitoshi Iwatsuki, Yasuo Suzuki, Nozomu Tamoto, Shinzo Higuchi, Akira Saito, Yasuyuki Yamashita, Kiichi Kamoda
  • Patent number: 10682808
    Abstract: A fabrication method includes laminating a fabrication material to form an object, and applying a release material on a surface of the object to form a release layer on the surface of the object. A surface free energy of the release material is equal to or smaller than 25 mN/m.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: June 16, 2020
    Assignee: RICOH COMPANY, LTD.
    Inventors: Takashi Fujita, Akira Saito, Kiichi Kamoda, Yasutada Shitara, Kazuhiko Watanabe, Hitoshi Iwatsuki, Yuuya Endoh, Kazufumi Kimura, Yasuyuki Yamashita, Shinnosuke Koshizuka, Yuuki Kamon, Nozomu Tamoto