Patents by Inventor Hitoshi Murata

Hitoshi Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200173024
    Abstract: Described herein is a technique capable of reducing the time necessary for stabilizing the inner temperature of the processing furnace. A substrate processing apparatus may include: a wafer retainer configured to support a plurality of wafers; a upright cylindrical process vessel; a seal cap configured to cover an opening at a lower end of the process vessel; a first heater configured to heat an inside of the process vessel from a lateral side thereof; an insulating unit disposed between the seal cap and the wafer retainer; and a second heater facing at least one of the plurality of wafers and configured to heat the at least one of the plurality of wafers, the second heater including: a pillar penetrating centers of the seal cap and the insulating unit; an annular member connected to and concentric with the pillar; a pair of connecting parts connecting end portions of the annular member to the pillar; and an heating element disposed inside the annular member.
    Type: Application
    Filed: February 11, 2020
    Publication date: June 4, 2020
    Inventors: Hitoshi MURATA, Takashi YAHATA, Yuichi WADA, Takatomo YAMAGUCHI, Shuhei SAIDO
  • Patent number: 10597780
    Abstract: Described herein is a technique capable of reducing the time necessary for stabilizing the inner temperature of the processing furnace. A substrate processing apparatus may include: a wafer retainer configured to support a plurality of wafers; an upright cylindrical process vessel; a seal cap configured to cover an opening at a lower end of the process vessel; a first heater configured to heat an inside of the process vessel from a lateral side thereof; an insulating unit disposed between the seal cap and the wafer retainer; and a second heater facing at least one of the plurality of wafers and configured to heat the at least one of the plurality of wafers, the second heater including: a pillar penetrating centers of the seal cap and the insulating unit; an annular member connected to and concentric with the pillar; a pair of connecting parts connecting end portions of the annular member to the pillar; and a heating element disposed inside the annular member.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: March 24, 2020
    Assignee: Kokusai Electric Corporation
    Inventors: Hitoshi Murata, Takashi Yahata, Yuichi Wada, Takatomo Yamaguchi, Shuhei Saido
  • Publication number: 20190284696
    Abstract: According to the technique of the present disclosure, there is provided a substrate processing apparatus including: a reaction tube accommodating therein a plurality of substrates vertically arranged; and a first heater configured to heat an inside of the reaction tube from an upper portion of the reaction tube, wherein a heat generating amount of the first heater in a region corresponding to a low temperature portion of an upper substrate among the plurality of the substrates accommodated in the reaction tube is greater than a heat generating amount of the first heater in a region corresponding to a high temperature portion of the upper substrate.
    Type: Application
    Filed: May 31, 2019
    Publication date: September 19, 2019
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuya KOSUGI, Hitoshi MURATA, Shuhei SAIDO
  • Patent number: 10340151
    Abstract: A ceiling heat insulator installed above a side wall heat insulator of a heating apparatus for a substrate processing apparatus for processing a substrate is provided. The ceiling heat insulator includes a gas-flow path installed therein to allow a cooling gas to pass therethrough so that the ceiling heat insulator has a solid cross-sectional area in an outer edge side of the ceiling heat insulator that is smaller than that in a center side of the ceiling heat insulator.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: July 2, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuya Kosugi, Motoya Takewaki, Masaaki Ueno, Hitoshi Murata
  • Publication number: 20190080941
    Abstract: There is provided a cooling unit, comprising: an intake pipe provided for each of a plurality of zones and configured to supply a gas for cooling a reaction tube; a control valve provided in the intake pipe and configured to adjust a flow rate of the gas; a buffer part configured to temporarily store the gas supplied from the intake pipe; and openings provided so as to blow the gas stored in the buffer part toward the reaction tube, wherein the flow rate of the gas introduced into the intake pipe is set according to vertical length ratios of the zones such that the flow rate and a flow velocity of the gas injected from the openings toward the reaction tube are adjusted by opening and closing the control valve.
    Type: Application
    Filed: September 11, 2018
    Publication date: March 14, 2019
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuya KOSUGI, Hitoshi MURATA, Masaaki UENO
  • Publication number: 20190024232
    Abstract: To reduce a temperature deviation on a surface of a substrate and shorten a temperature recovery time on the surface of the substrate, a substrate processing apparatus is provided. The substrate processing apparatus includes a substrate retainer configured to accommodate a plurality of substrates and heat insulating plates; a reaction tube within the substrate retainer; and a heating mechanism configured to heat the plurality of substrates, wherein the substrate retainer includes a substrate processing region where the plurality of substrates are accommodated and a heat insulating plate region where the heat insulating plates are accommodated. A reflectivity of each of the first heat insulating plates is accommodated in an upper layer portion of the heat insulating plate region and is higher than a reflectivity of each of the second heat insulating plates accommodated in a region other than the upper layer portion of the heat insulating plate region.
    Type: Application
    Filed: July 13, 2018
    Publication date: January 24, 2019
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tetsuya KOSUGI, Hitoshi MURATA, Shingo NOHARA, Atsushi HIRANO
  • Publication number: 20180265894
    Abstract: Provided is a gene expression cassette for stably and highly producing a protein of interest. The gene expression cassette has a structure in which a DNA construct (X) containing a gene of interest and a poly A addition sequence is sandwiched between a promoter (P) and an enhancer (P?), the gene expression cassette further including transposon sequences (T) upstream of the promoter (P) and downstream of the enhancer (P?). Further, in the gene expression cassette, when a nuclear matrix binding sequence (M) is appropriately arranged upstream of a replication initiation sequence (S) in combination with the transposon sequence (T), the protein of interest can be more effectively produced stably and in a large amount. For example, HRG, PD-1, EMMPRIN, NPTN?, EMB, RAGE, MCAM, ALCAM, ErbB2, and an antibody can each be produced stably and in a large amount.
    Type: Application
    Filed: October 3, 2016
    Publication date: September 20, 2018
    Inventors: Masakiyo Sakaguchi, Masahiro Nishibori, Hiromi Kumon, Hitoshi Murata, Kenichi Yamamoto, Rie Kinoshita
  • Patent number: 9957616
    Abstract: The present invention is directed providing a technique capable of reducing a time for stabilizing a temperature in a processing chamber. The technique includes: a substrate support configured to support a substrate; a thermal insulation unit disposed below the substrate support; a processing chamber configured to accommodate the substrate support and where the substrate is processed; a first heating unit disposed around the processing chamber and configured to heat an inside of the processing chamber from a lateral side thereof; and a second heating unit disposed between the substrate support and the thermal insulation unit inside the processing chamber, the second heating unit including a heater having a substantially annular shape and a suspending member extending downward from the heater, wherein a diameter of the heater is smaller than that of the substrate.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: May 1, 2018
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hitoshi Murata, Yuichi Wada, Takashi Yahata, Hidenari Yoshida, Shuhei Saido
  • Publication number: 20170335458
    Abstract: Described herein is a technique capable of reducing the time necessary for stabilizing the inner temperature of the processing furnace. A substrate processing apparatus may include: a wafer retainer configured to support a plurality of wafers; an upright cylindrical process vessel; a seal cap configured to cover an opening at a lower end of the process vessel; a first heater configured to heat an inside of the process vessel from a lateral side thereof; an insulating unit disposed between the seal cap and the wafer retainer; and a second heater facing at least one of the plurality of wafers and configured to heat the at least one of the plurality of wafers, the second heater including: a pillar penetrating centers of the seal cap and the insulating unit; an annular member connected to and concentric with the pillar; a pair of connecting parts connecting end portions of the annular member to the pillar; and a heating element disposed inside the annular member.
    Type: Application
    Filed: August 9, 2017
    Publication date: November 23, 2017
    Inventors: Hitoshi MURATA, Takashi YAHATA, Yuichi WADA, Takatomo YAMAGUCHI, Shuhei SAIDO
  • Patent number: 9779970
    Abstract: A heater supporting device for use in a semiconductor manufacturing apparatus is provided so as to improve the uniformity of a temperature property and the expected lifespan by preventing support pieces from being damaged and separated from piece holders, and preventing deterioration in adiabatic efficiency in the vicinity of a ceiling of a vertical type furnace. A heating element of a coil shape is disposed around an object. The support pieces are vertically connected in multiple. Hollows of an elliptical shape are formed between the respective support pieces. Concave insertions are formed on one of upper and lower surfaces of the respective support pieces, and convex insertions are formed on the other one of the upper and lower surfaces of the respective support pieces. The convex insertions are insert-fitted with the concave insertions. The support pieces are vertically connected in multiple by insert-fitting the concave insertions to the convex insertions.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: October 3, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tetsuya Kosugi, Hitoshi Murata, Shinobu Sugiura, Masaaki Ueno
  • Patent number: 9695511
    Abstract: A substrate processing apparatus including a vertical reaction container; an insulating wall formed of an insulating material and including a reaction container accommodation chamber for accommodating the reaction container therein; a heater installed in an inner wall of the reception container reception chamber on the insulating wall; an air circulation channel installed vertically in a sidewall of the insulating wall; a blower for distributing air upward or downward in the air circulation channel; intake valves for communicating the air circulation channel with the air; and exhaust valves for communicating the air circulation channel with an equipment exhaust system. In a temperature elevating process and a temperature lowering process, the intake valves and the exhaust valves are switched.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: July 4, 2017
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Hitoshi Murata, Tetsuya Kosugi, Masaaki Ueno, Masashi Sugishita
  • Patent number: 9587884
    Abstract: A heat insulation structure, which has a cylindrical side wall part formed in a multilayer structure, includes: a cooling gas supply port provided in an upper portion of a side wall outer layer disposed in an outer side of the side wall part; a cooling gas passage provided between a side wall inner layer disposed in an inner side of the side wall part and the side wall outer layer; a space provided in an inner side of the side wall inner layer; a plurality of blowout holes provided in the side wall inner layer for distributing cooling gas from the cooling gas passage to the space; a buffer area continuously provided in the cooling gas supply port and the cooling gas passage; and a throttle part configured to reduce a cross-sectional area of a boundary surface between the buffer area and the cooling gas passage.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: March 7, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tetsuya Kosugi, Motoya Takewaki, Hitoshi Murata, Masaaki Ueno
  • Patent number: 9460946
    Abstract: A substrate processing apparatus includes a heating part including a cylindrical-shaped heat insulator and a heating wire arranged on the inner circumferential surface of the heat insulator, a heat-insulating part configured to define a cylindrical space between the heating part and the heat insulating part, a cooling gas introduction portion coupled to the cylindrical space and provided above the heat-insulating part to surround the heating part, and a cooling gas discharge portion provided at an approximately same height as that of the cooling gas introduction portion in the diameter direction extending from approximately the center of the cooling gas introduction portion.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: October 4, 2016
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hitoshi Murata, Tetsuya Kosugi
  • Patent number: D793974
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: August 8, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hitoshi Murata, Takatomo Yamaguchi
  • Patent number: D793975
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: August 8, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hitoshi Murata, Yuichi Wada, Takashi Yahata, Hidenari Yoshida, Shuhei Saido
  • Patent number: D795209
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: August 22, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hitoshi Murata, Yuichi Wada, Takashi Yahata, Takatomo Yamaguchi, Shuhei Saido
  • Patent number: D818850
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: May 29, 2018
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tokunobu Akao, Atushi Umekawa, Masaaki Ueno, Tetsuya Kosugi, Hitoshi Murata, Masashi Sugishita, Kenji Shinozaki
  • Patent number: D819463
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: June 5, 2018
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tokunobu Akao, Atushi Umekawa, Masaaki Ueno, Tetsuya Kosugi, Hitoshi Murata, Masashi Sugishita, Kenji Shinozaki
  • Patent number: D860419
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: September 17, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuya Kosugi, Hitoshi Murata, Masaaki Ueno
  • Patent number: D860420
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: September 17, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuya Kosugi, Hitoshi Murata, Masaaki Ueno