Patents by Inventor Hitoshi Nakatsuka

Hitoshi Nakatsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6537660
    Abstract: The present invention relates to a fiber, which includes: 2 to 95% by weight, based on the total weight of the fiber, of at least one block copolymer, which includes: at least one polymer block (A) that includes 50 to 100% by weight of olefinic monomer units, based on the total weight of the block copolymer; and at least one polymer block (B) that includes 0.1 to 100% by weight of (meth)acrylic monomer units, based on the total weight of the block copolymer. Other embodiments of the invention include fibrous structures, non-woven fabrics, leather-like sheet materials, and dyed articles, which include the above-described fiber, and processes of making the above-described fiber. The present invention also relates to a composite fiber, and fibrous structures, non-woven fabrics, leather-like sheet materials, and dyed articles, which includes the above-described composite fiber, as well as processes for producing the above-described composite fiber.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: March 25, 2003
    Assignee: Kuraray Co., Ltd.
    Inventors: Takashi Katayama, Kazuhiko Maekawa, Hitoshi Nakatsuka, Ichirou Inoue, Shuhei Yorimitsu
  • Publication number: 20020150756
    Abstract: The present invention provides a hollow fiber, which includes:
    Type: Application
    Filed: March 13, 2002
    Publication date: October 17, 2002
    Applicant: KURARAY CO. LTD.
    Inventors: Kazuhiko Tanaka, Hitoshi Nakatsuka, Nobuhiro Koga, Masao Kawamoto, Akihiro Hokimoto, Tateki Yamakawa, Ichirou Inoue, Kiyoshi Hirakawa
  • Patent number: 6455156
    Abstract: The present invention provides a hollow fiber, which includes: at least one thermoplastic polymer with an equilibrium water content of 2% or less; wherein the number of hollow portions (&agr;1) and a hollow ratio (&agr;2) in said fiber satisfy the following equations: &agr;1≧7 2≦&agr;2≦65 0.14≦(&agr;1×&agr;2)/100≦250.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: September 24, 2002
    Assignee: Kuraray Co., Ltd.
    Inventors: Kazuhiko Tanaka, Hitoshi Nakatsuka, Nobuhiro Koga, Masao Kawamoto, Akihiro Hokimoto, Tateki Yamakawa, Ichirou Inoue, Kiyoshi Hirakawa
  • Publication number: 20020009938
    Abstract: The present invention relates to a fiber, which includes:
    Type: Application
    Filed: March 14, 2001
    Publication date: January 24, 2002
    Applicant: Kuraray Co., Ltd.
    Inventors: Takashi Katayama, Kazuhiko Maekawa, Hitoshi Nakatsuka, Ichirou Inoue, Shuhei Yorimitsu
  • Publication number: 20010053646
    Abstract: The present invention provides a hollow fiber, which includes:
    Type: Application
    Filed: March 16, 2001
    Publication date: December 20, 2001
    Applicant: Kuraray Co., Ltd.
    Inventors: Kazuhiko Tanaka, Hitoshi Nakatsuka, Nobuhiro Koga, Masao Kawamoto, Akihiro Hokimoto, Tateki Yamakawa, Ichirou Inoue, Kiyoshi Hirakawa
  • Patent number: 5955530
    Abstract: Finely divided hydrophobic silica powder having a number average particle size from 3 to 10 nm and a BET surface area from 195 to 290 m.sup.2 /g is dry blended with particles of a thermosetting resin composition having a volumetric average particle size from 5 to 20 .mu.m in a proportion from 0.05 to 2.0 parts per 100 parts of the resin particles on weight basis. Sieving efficiency of the powder coating composition thus processed is remarkably improved.
    Type: Grant
    Filed: March 25, 1997
    Date of Patent: September 21, 1999
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Koichi Inoue, Yasuhiko Nakae, Hitoshi Nakatsuka
  • Patent number: 5719212
    Abstract: Disclosed is an acid-epoxy curing type powder coating composition which forms a coated film having excellent yellow resistance and appearance. The powder coating composition comprises:(A) an epoxy group-containing acrylic resin prepared by polymerizing the monomer mixture which comprises,(a) 35 to 65% by weight of an epoxy group-containing ethylenically unsaturated monomer, and(b) remainder amount of an ethylenically unsaturated monomer which is different from the epoxy group-containing ethylenically unsaturated monomer;(B) a polycarboxylic acid; and(C) an antioxidant having a melting point of from 50.degree. to 140.degree. C.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: February 17, 1998
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Yasuhiko Nakae, Hitoshi Nakatsuka, Koichi Inoue