Patents by Inventor Hitoshi Nakayama

Hitoshi Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951749
    Abstract: There are provided a head chip, a liquid jet head, and a liquid jet recording device each capable of ensuring an electrical reliability, and enhancing the durability. The head chip according to an aspect of the present disclosure includes an actuator plate having ejection channels and non-ejection channels extending in a Z direction and arranged alternately in an X direction, and a nozzle plate which has nozzle holes respectively communicated with the ejection channels, and faces the actuator plate. The non-ejection channels are terminated at positions separated from a lower end surface of the actuator plate. The ejection channels open on a lower end surface of the actuator plate.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: April 9, 2024
    Assignee: SII PRINTEK INC.
    Inventor: Hitoshi Nakayama
  • Patent number: 11919306
    Abstract: The trouble of removing a protective film such as a poly-paraxylene film from the part not requiring the protective film is reduced. A method of manufacturing a head chip according to an aspect of the present disclosure includes a substrate preparation step of preparing an actuator plate substrate having a jet channel communicated with a nozzle hole configured to jet ink, and a non-jet channel which does not jet the ink, and a protective film formation step of forming a protective film configured to protect a common electrode formed on an inner surface of the jet channel from the ink in a state in which the jet channel is exposed and the non-jet channel is covered after the substrate preparation step.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: March 5, 2024
    Assignee: SII PRINTEK INC.
    Inventor: Hitoshi Nakayama
  • Patent number: 11894397
    Abstract: A semiconductor device including: a first insulator in which an opening is formed; a first conductor positioned in the opening; a first oxide over the first insulator; a second oxide over the first oxide; a third oxide and a fourth oxide over the second oxide; a second conductor over the third oxide and the first conductor; a third conductor over the fourth oxide; a fifth oxide over the second oxide; a second insulator over the fifth oxide; and a fourth conductor positioned over the second insulator and overlapping with the fifth oxide. The fifth oxide is in contact with each of a side surface of the third oxide and a side surface of the fourth oxide. The conductivity of the third oxide is higher than the conductivity of the second oxide. The second conductor is in contact with the top surface of the first conductor.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: February 6, 2024
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Yuichi Sato, Hitoshi Nakayama
  • Publication number: 20230191781
    Abstract: A head chip, a liquid jet head, and a liquid jet recording device each capable of increasing pressure generated while achieving power saving are provided. The head chip according to an aspect of the present disclosure includes a flow channel member having a pressure chamber containing liquid, an actuator plate which is stacked on the flow channel member in a state of being opposed to the pressure chamber in a first direction, a drive electrode which is formed on a surface facing to the first direction in the actuator plate, and which is configured to deform the actuator plate in the first direction to change a volume of the pressure chamber, and a non-drive member which is stacked at an opposite side to the flow channel member across the actuator plate in the first direction, and which is configured to limit a displacement of the actuator plate toward an opposite side to the flow channel member in the first direction.
    Type: Application
    Filed: December 15, 2022
    Publication date: June 22, 2023
    Inventor: Hitoshi NAKAYAMA
  • Publication number: 20230191783
    Abstract: A head chip, a liquid jet head, and a liquid jet recording device each capable of increasing pressure generated while achieving power saving are provided. The head chip according to an aspect of the present disclosure includes a flow channel member, an actuator plate, and drive electrodes. The drive electrodes include a first electrode disposed on a first surface of the actuator plate so as to overlap one of a pressure chamber and a partition wall when viewed from a first direction, a second electrode which is disposed on the first surface of the actuator plate so as to be adjacent to the first electrode, and which generates a potential difference from the first electrode, and a first opposed electrode which is individually disposed on a second surface of the actuator plate at a position opposed to the first electrode, and which generates a potential difference from the first electrode.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 22, 2023
    Inventor: Hitoshi NAKAYAMA
  • Publication number: 20230191784
    Abstract: A head chip, a liquid jet head, and a liquid jet recording device each capable of achieving a reduction in size and an increase in nozzle density are provided.
    Type: Application
    Filed: December 15, 2022
    Publication date: June 22, 2023
    Inventor: Hitoshi NAKAYAMA
  • Publication number: 20230191782
    Abstract: A head chip, a liquid jet head, and a liquid jet recording device each capable of inhibiting mechanical crosstalk, and exerting a desired jet performance are provided. The head chip according to an aspect of the present disclosure includes a flow channel member having a plurality of pressure chambers containing liquid, an actuator plate which is stacked on the flow channel member in a state of being opposed in a first direction to the pressure chambers, and a drive electrode which is formed on a surface of the actuator plate, the surface facing to the first direction, and which is configured to deform the actuator plate in the first direction to change a volume of at least one of the pressure chambers. A dividing groove which is configured to zone the actuator plate between the pressure chambers adjacent to each other is formed in a portion of the actuator plate, the portion being located between the pressure chambers adjacent to each other when viewed from the first direction.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 22, 2023
    Inventor: Hitoshi NAKAYAMA
  • Patent number: 11563340
    Abstract: A power supply device which is used as a backup power supply, including a power supply side acquisition unit that acquires information related to a position of the power supply device.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: January 24, 2023
    Assignee: GS YUASA INTERNATIONAL LTD.
    Inventors: Tsukasa Nishimura, Hitoshi Nakayama
  • Publication number: 20220262828
    Abstract: A semiconductor device including: a first insulator in which an opening is formed; a first conductor positioned in the opening; a first oxide over the first insulator; a second oxide over the first oxide; a third oxide and a fourth oxide over the second oxide; a second conductor over the third oxide and the first conductor; a third conductor over the fourth oxide; a fifth oxide over the second oxide; a second insulator over the fifth oxide; and a fourth conductor positioned over the second insulator and overlapping with the fifth oxide. The fifth oxide is in contact with each of a side surface of the third oxide and a side surface of the fourth oxide. The conductivity of the third oxide is higher than the conductivity of the second oxide. The second conductor is in contact with the top surface of the first conductor.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 18, 2022
    Inventors: Shunpei YAMAZAKI, Yuichi SATO, Hitoshi NAKAYAMA
  • Publication number: 20220194092
    Abstract: There are provided a head chip, a liquid jet head, and a liquid jet recording device each capable of ensuring an electrical reliability, and enhancing the durability. The head chip according to an aspect of the present disclosure includes an actuator plate having ejection channels and non-ejection channels extending in a Z direction and arranged alternately in an X direction, and a nozzle plate which has nozzle holes respectively communicated with the ejection channels, and faces the actuator plate. The non-ejection channels are terminated at positions separated from a lower end surface of the actuator plate. The ejection channels open on a lower end surface of the actuator plate.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 23, 2022
    Inventor: Hitoshi NAKAYAMA
  • Publication number: 20220176698
    Abstract: The trouble of removing a protective film such as a poly-paraxylene film from the part not requiring the protective film is reduced. A method of manufacturing a head chip according to an aspect of the present disclosure includes a substrate preparation step of preparing an actuator plate substrate having a jet channel communicated with a nozzle hole configured to jet ink, and a non-jet channel which does not jet the ink, and a protective film formation step of forming a protective film configured to protect a common electrode formed on an inner surface of the jet channel from the ink in a state in which the jet channel is exposed and the non-jet channel is covered after the substrate preparation step.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 9, 2022
    Inventor: Hitoshi NAKAYAMA
  • Patent number: 11355530
    Abstract: A semiconductor device including: a first insulator in which an opening is formed; a first conductor positioned in the opening; a first oxide over the first insulator; a second oxide over the first oxide; a third oxide and a fourth oxide over the second oxide; a second conductor over the third oxide and the first conductor; a third conductor over the fourth oxide; a fifth oxide over the second oxide; a second insulator over the fifth oxide; and a fourth conductor positioned over the second insulator and overlapping with the fifth oxide. The fifth oxide is in contact with each of a side surface of the third oxide and a side surface of the fourth oxide. The conductivity of the third oxide is higher than the conductivity of the second oxide. The second conductor is in contact with the top surface of the first conductor.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: June 7, 2022
    Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Shunpei Yamazaki, Yuichi Sato, Hitoshi Nakayama
  • Patent number: 11257960
    Abstract: A semiconductor device having high on-state current and favorable reliability is provided. The semiconductor device includes a first insulator; a first oxide over the first insulator; a second oxide over the first oxide; a third oxide and a fourth oxide over the second oxide; a first conductor over the third oxide; a second conductor over the fourth oxide; a fifth oxide over the second oxide; a second insulator over the fifth oxide; and a third conductor positioned over the second insulator and overlapping with the second oxide. The fifth oxide is in contact with each of a side surface of the third oxide and a side surface of the fourth oxide. The conductivity of the third oxide is higher than the conductivity of the second oxide, and the conductivity of the fourth oxide is higher than the conductivity of the second oxide.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: February 22, 2022
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Yuichi Sato, Hitoshi Nakayama
  • Patent number: 11072176
    Abstract: A liquid jet head chip capable of exerting a stable ejection performance is provided. The liquid jet head chip is provided with an actuator plate and an electrode. The actuator plate has an obverse surface, a reverse surface, and two or more ejection channels which penetrate the actuator plate in a thickness direction from the obverse surface toward the reverse surface, which are disposed so as to be adjacent to each other at intervals in a first direction perpendicular to the thickness direction, and which are disposed so as to extend in a second direction perpendicular to both of the thickness direction and the first direction.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: July 27, 2021
    Assignee: SII PRINTEK INC.
    Inventors: Hitoshi Nakayama, Yuji Nakamura, Yuki Yamamura, Mizuki Kudo
  • Publication number: 20210119054
    Abstract: A semiconductor device having high on-state current and favorable reliability is provided. The semiconductor device includes a first insulator; a first oxide over the first insulator; a second oxide over the first oxide; a third oxide and a fourth oxide over the second oxide; a first conductor over the third oxide; a second conductor over the fourth oxide; a fifth oxide over the second oxide; a second insulator over the fifth oxide; and a third conductor positioned over the second insulator and overlapping with the second oxide. The fifth oxide is in contact with each of a side surface of the third oxide and a side surface of the fourth oxide. The conductivity of the third oxide is higher than the conductivity of the second oxide, and the conductivity of the fourth oxide is higher than the conductivity of the second oxide.
    Type: Application
    Filed: March 21, 2019
    Publication date: April 22, 2021
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei YAMAZAKI, Yuichi SATO, Hitoshi NAKAYAMA
  • Publication number: 20210103004
    Abstract: A power supply device which is used as a backup power supply, including a power supply side acquisition unit that acquires information related to a position of the power supply device.
    Type: Application
    Filed: March 29, 2018
    Publication date: April 8, 2021
    Inventors: Tsukasa NISHIMURA, Hitoshi NAKAYAMA
  • Patent number: 10967636
    Abstract: A head chip capable of suppressing the degradation of the reliability, and a liquid jet head and a liquid jet recording device using the head chip are provided. The head chip includes an actuator plate having a plurality of ejection channels respectively communicated with nozzle holes and electrodes disposed on inner walls of the respective ejection channels, a bonded plate to be bonded to the actuator plate, and having a liquid contact surface which liquid entered the ejection channels has contact with, an adhesive layer disposed between the bonded plate and the actuator plate, and adapted to bond the bonded plate and the actuator plate to each other, and a protective film adapted to cover continuously from inner walls of the respective ejection channels to at least a part of the liquid contact surface via an end surface of the adhesive layer exposed on the ejection channel side.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: April 6, 2021
    Assignee: SII PRINTEK INC.
    Inventor: Hitoshi Nakayama
  • Publication number: 20210020667
    Abstract: A semiconductor device including: a first insulator in which an opening is formed; a first conductor positioned in the opening; a first oxide over the first insulator; a second oxide over the first oxide; a third oxide and a fourth oxide over the second oxide; a second conductor over the third oxide and the first conductor; a third conductor over the fourth oxide; a fifth oxide over the second oxide; a second insulator over the fifth oxide; and a fourth conductor positioned over the second insulator and overlapping with the fifth oxide. The fifth oxide is in contact with each of a side surface of the third oxide and a side surface of the fourth oxide. The conductivity of the third oxide is higher than the conductivity of the second oxide. The second conductor is in contact with the top surface of the first conductor.
    Type: Application
    Filed: April 4, 2019
    Publication date: January 21, 2021
    Inventors: Shunpei YAMAZAKI, Yuichi SATO, Hitoshi NAKAYAMA
  • Patent number: 10807364
    Abstract: There are provided a head chip, a liquid jet head, and a liquid jet recording device capable of enhancing the reliability. The head chip according to an embodiment of the disclosure is a head chip adapted to jet liquid including an actuator plate having a plurality of ejection grooves arranged side by side along a first direction, and extending in a second direction crossing the first direction, a plurality of common electrodes formed on respective inner surfaces of the plurality of ejection grooves, and a commonalization interconnection adapted to electrically connect the plurality of common electrodes to each other, and a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: October 20, 2020
    Assignee: SII PRINTEK INC.
    Inventors: Daichi Nishikawa, Misaki Kobayashi, Tomoki Kameyama, Hitoshi Nakayama
  • Publication number: 20200180311
    Abstract: A head chip capable of suppressing the degradation of the reliability, and a liquid jet head and a liquid jet recording device using the head chip are provided. The head chip includes an actuator plate having a plurality of ejection channels respectively communicated with nozzle holes and electrodes disposed on inner walls of the respective ejection channels, a bonded plate to be bonded to the actuator plate, and having a liquid contact surface which liquid entered the ejection channels has contact with, an adhesive layer disposed between the bonded plate and the actuator plate, and adapted to bond the bonded plate and the actuator plate to each other, and a protective film adapted to cover continuously from inner walls of the respective ejection channels to at least a part of the liquid contact surface via an end surface of the adhesive layer exposed on the ejection channel side.
    Type: Application
    Filed: November 27, 2019
    Publication date: June 11, 2020
    Inventor: Hitoshi NAKAYAMA