Abstract: A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.

Abstract: A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.

Abstract: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.

Abstract: A coil component 1 is provided with coil conductors 10a and 10b and a magnetic metal powder containing resin 22 (22a and 22b) covering the coil conductors 10a and 10b. The magnetic metal powder containing resin 22 includes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 ?m or more and 100 ?m or less. The third average grain diameter is 2 ?m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.

Abstract: A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.

Abstract: In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 ?m) smaller than that (32 ?m) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.

Abstract: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.

Abstract: A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.

Abstract: A coil component which can secure the insulation and strength of a ferrite core and reserve a winding region sufficiently is provided. By coating a surface of an Mn—Zn-based ferrite core with a glass film, this coil component can secure the insulation between the ferrite core and a terminal electrode. Coating with the glass film also ensures the strength of the ferrite core, thereby inhibiting cracks from occurring in boundary parts between a winding core part and flanges. In the coil component, at least one of the thickness of the glass film covering the surface of the winding core part and the thickness of the glass film covering the inner side face of the flange is smaller than the thickness of the glass film in the remaining part. Thus suppressing the thickness of the glass film on the surface of the winding core part and on the inner side face of the flange can sufficiently secure a winding region M.

Abstract: A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.

Abstract: A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.

Abstract: A coil component which can secure the insulation and strength of a ferrite core and reserve a winding region sufficiently is provided. By coating a surface of an Mn—Zn-based ferrite core with a glass film, this coil component can secure the insulation between the ferrite core and a terminal electrode. Coating with the glass film also ensures the strength of the ferrite core, thereby inhibiting cracks from occurring in boundary parts between a winding core part and flanges. In the coil component, at least one of the thickness of the glass film covering the surface of the winding core part and the thickness of the glass film covering the inner side face of the flange is smaller than the thickness of the glass film in the remaining part. Thus suppressing the thickness of the glass film on the surface of the winding core part and on the inner side face of the flange can sufficiently secure a winding region M.

Abstract: A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.

Abstract: A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.

Abstract: Conductor layers 2A and insulating layers 4A are alternately stacked so as to prepare a base material 17. A plurality of grooves 18 having a predetermined width are formed in a surface of the base material 17 in such a manner that these plural grooves 18 are located parallel to each other along a stacking layer direction in order to form a coil inner peripheral portion. Embedding materials 5 are filled into the grooves 18. Surfaces 16 of the base material into which the embedding materials 5 have been filled are flattened by polishing. The conductor layers 2A located adjacent to each other are connected to each other, so that helical coils which constitute inductive elements are constructed. Then, both the front plane and the rear plane of the resultant base material are covered by an insulating layer, which is cut so as to obtain respective chips.

Abstract: Conductor layers 2A and insulating layers 4A are alternately stacked so as to prepare a base material 17. A plurality of grooves 18 having a predetermined width are formed in a surface of the base material 17 in such a manner that these plural grooves 18 are located parallel to each other along a stacking layer direction in order to form a coil inner peripheral portion. Embedding materials 5 are filled into the grooves 18. Surfaces 16 of the base material into which the embedding materials 5 have been filled are flattened by polishing. The conductor layers 2A located adjacent to each other are connected to each other, so that helical coils which constitute inductive elements are constructed. Then, both the front plane and the rear plane of the resultant base material are covered by an insulating layer, which is cut so as to obtain respective chips.

Abstract: A key switch includes a base, a key top arranged above the base, a pair of link members interlocked to each other to support the key top above the base and direct the key top in a vertical direction, and a switching mechanism capable of opening and closing an electric circuit in connection with a vertical movement of the key top. Each of the link members includes an engagable end region engaged with the key top. The base includes an inner peripheral surface defining an opening capable of receiving the link members. The base is provided on the inner peripheral surface with protruding wall parts located at positions respectively facing oppositely to the engagable end regions of the link members. Each protruding wall part serves to locally reduce a clearance defined between the inner peripheral surface and the engagable region of each link member when the link member is received in the opening.

Abstract: A key switch includes a base, a key top arranged above the base, a pair of link members interlocked to each other to support the key top above the base and direct the key top in a vertical direction, and a switching mechanism capable of opening and closing an electric circuit in connection with a vertical movement of the key top. Each of the link members includes an engagable end region engaged with the key top. The base includes an inner peripheral surface defining an opening capable of receiving the link members. The base is provided on the inner peripheral surface with protruding wall parts located at positions respectively facing oppositely to the engagable end regions of the link members. Each protruding wall part serves to locally reduce a clearance defined between the inner peripheral surface and the engagable region of each link member when the link member is received in the opening.

Abstract: An apparatus is provided to facilitate connection inspections for a high tension cord 1. The apparatus includes a contact element that can be brought into contact with a distributor terminal T2. The contact element includes elastic elements 31b to 34b that are constructed to be displaceable between an enclosed state where they enclose the distributor terminal T2 to establish an electrical connection therewith and an open state where a high tension cord 1 can be mounted and detached. Since the distributor terminal T2 can be connected electrically without precisely positioning it, connection inspections for the high tension cord 1 can be made easier and, consequently, automation and labor-saving can be made possible.

Abstract: The single-use camera has a main body in which is housed the film cartridge and around which a cover member is formed. On the main body of the camera is a closure and a spring which are used to close the light-shield cover in the film gate of the cartridge when the cover is opened to remove the film cartridge.