Patents by Inventor Hitoshi Oka

Hitoshi Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless copper plating solution
    Patent number: 4303443
    Abstract: When an amine compound having at least two polyolefin glycol chains in one molecule is used as a stabilizer, and an alkylene diamine compound, at least one hydrogen atom in the respective amino groups thereof being substituted by CH.sub.2 COOX (wherein X is H or Na) and another hydrogen atom in the respective amino group thereof being substituted by CH.sub.
    Type: Grant
    Filed: June 13, 1980
    Date of Patent: December 1, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Osamu Miyazawa, Hitoshi Oka, Isamu Tanaka, Akira Matsuo, Hitoshi Yokono, Nobuo Nakagawa, Tokio Isogai
  • Process for controlling of chemical copper plating solution
    Patent number: 4276323
    Abstract: A concentration of copper ions, a concentration of a reducing agent, a concentration of a complexing agent and a pH of a chemical copper plating solution are continuously detected all as potentials, and continuously controlled with a good accuracy.
    Type: Grant
    Filed: December 21, 1979
    Date of Patent: June 30, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Oka, Kenji Nakamura
  • Chemical copper plating solution
    Patent number: 4211564
    Abstract: An aqueous plating solution consists essentially of a copper ion-releasing compound, a copper ion-complexing agent, a copper ion-reducing agent, a hydroxide of alkali metal, 2,2'-dipyridyl, polyethyleneglycolstearylamine, and silver sulfide has a good liquid stability and a high plating speed, and a chemical copper plating film obtained from the plating solution has a high toughness (tensile strength.times.elongation).
    Type: Grant
    Filed: April 18, 1979
    Date of Patent: July 8, 1980
    Assignee: Hitachi, Ltd.
    Inventor: Hitoshi Oka