Patents by Inventor Hitoshi Osaki

Hitoshi Osaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11705331
    Abstract: A composition for use in selective modification of a base material surface includes a polymer having, at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with a metal, and a solvent.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: July 18, 2023
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
  • Patent number: 11525067
    Abstract: A modification method of a surface of a substrate includes: applying a composition on a surface of a metal substrate, and heating a coating film formed by the applying, wherein the composition contains: a polymer having a first structural unit that includes an aromatic ring, and a second structural unit that includes an ethylenic double bond; a thermal acid generating agent; and a solvent, wherein the polymer has a functional group capable of bonding to a metal atom in the metal substrate.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: December 13, 2022
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Miki Tamada, Hitoshi Osaki, Tomoki Nagai
  • Patent number: 11460767
    Abstract: A composition for film formation includes a polymer and a solvent. The polymer includes a first repeating unit, a second repeating unit, a third repeating unit, and a structural unit on at least one end of a main chain of the polymer. The first repeating unit includes a crosslinkable group. The second repeating unit differs from the first repeating unit. The third repeating unit differs from the first repeating unit and has higher polarity than polarity of the second repeating unit. The structural unit includes an interacting group capable of interacting with Si—OH, Si—H or Si—N.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: October 4, 2022
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
  • Patent number: 11462405
    Abstract: A pattern-forming method includes forming a prepattern and including a first polymer is formed on a silicon-containing film on a substrate. An underlayer film including a second polymer is formed in recessed portions of the prepattern. A composition for directed self-assembled film formation including a third polymer is applied on the underlayer film and the prepattern. The first polymer includes a first structural unit. The second polymer includes: a molecular chain including the first structural unit and a second structural unit that differs from the first structural unit; and an end structure that bonds to one end of the molecular chain and includes at least one selected from the group consisting of an amino group, a hydroxy group and a carboxy group. The third polymer is a block copolymer including a block of the first structural unit and a block of the second structural unit.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: October 4, 2022
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Miki Tamada, Hitoshi Osaki, Tomoki Nagai
  • Patent number: 11426761
    Abstract: A modification method of a surface of a base includes applying a composition on a surface layer of a base to form a coating film. The surface layer contains a metal atom. The coating is heated. The composition contains a polymer and a solvent. The polymer includes at an end of a main chain or at an end of a side chain thereof, a functional group that is at least one selected from: a group represented by the following formula (1); a group containing a carbon-carbon triple bond; and a group containing an aromatic hydroxy group. In the formula (1), R1 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and n is an integer of 1 to 10, wherein in a case in which n is no less than 2, a plurality of R1s are identical or different.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: August 30, 2022
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Miki Tamada, Hitoshi Osaki, Tomoki Nagai
  • Patent number: 11370872
    Abstract: A composition for pattern formation includes a first polymer, a second polymer and a solvent. The first polymer includes: a first block including a first structural unit derived from a substituted or unsubstituted styrene; and a second block including a second structural unit other than the first structural unit. The second polymer includes: the first structural unit; and a group bonding to at least one end of a main chain thereof and including a polar group. The polar group is preferably a hydroxy group or a carboxyl group. A number average molecular weight of the second polymer is preferably no greater than 6,000. A mass ratio of the second polymer to the first polymer is preferably no less than 0.15 and no greater than 0.4. The solvent preferably comprises a compound comprising a hydroxyl group and an alkyl ester group.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: June 28, 2022
    Assignee: JSR Corporation
    Inventors: Masafumi Hori, Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Takehiko Naruoka
  • Patent number: 11211246
    Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including silicon. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the silicon. The first region preferably contains a silicon oxide, a silicon nitride, or a silicon oxynitride. The base material preferably further includes a second region that is other than the first region and that contains a metal; and the method preferably further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: December 28, 2021
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
  • Patent number: 11195714
    Abstract: A pattern-forming method includes forming a patterned coating film on a part of a surface layer of a base. The surface layer includes regions each of which includes a material that differs from each other. A part of the regions is the part of the surface layer on which the patterned coating film is formed. The patterned coating film includes a first polymer including at an end of a main chain or a side chain thereof a group including a first functional group that is capable of bonding to an atom present in the part of the region. An atom layer is directly or indirectly formed on the surface layer of the base by a vapor deposition, after the forming of the patterned coating film.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: December 7, 2021
    Assignee: JSR CORPORATION
    Inventors: Hitoshi Osaki, Jeffrey Kmiec
  • Publication number: 20210318614
    Abstract: A pattern-forming method includes: applying a radiation-sensitive composition containing a polymer and a radiation-sensitive acid generating agent on a surface of a substrate to form a coating film on the surface of the substrate; exposing the coating film; and developing the coating film exposed. The polymer has a first structural unit represented by formula (1). In the formula (1), R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group; and A represents a monovalent organic group having a nitrogen atom.
    Type: Application
    Filed: June 19, 2020
    Publication date: October 14, 2021
    Applicant: JSR CORPORATION
    Inventor: Hitoshi OSAKI
  • Publication number: 20210166935
    Abstract: A composition for use in selective modification of a base material surface includes a polymer having, at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with a metal, and a solvent.
    Type: Application
    Filed: January 14, 2021
    Publication date: June 3, 2021
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki KOMATSU, Tomohiro ODA, Hitoshi OSAKI, Masafumi HORI, Takehiko NARUOKA
  • Patent number: 10950438
    Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including a metal. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the metal. It is preferred that the base material further includes a second region comprising substantially only a non-metal, and the method further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film. The metal is preferably a constituent of a metal substance, an alloy, an oxide, an electrically conductive nitride or a silicide.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: March 16, 2021
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
  • Patent number: 10923342
    Abstract: A selective modification method of a base material surface includes subjecting at least a part of a surface of a base material to at least one surface treatment selected from the group consisting of an oxidization treatment and a hydrophilization treatment. The base material includes a surface layer and includes an oxide, a nitride or an oxynitride of silicon, or a combination thereof in a first region of the surface layer. A nonphotosensitive composition is applied directly or indirectly on the surface of the base material after the surface treatment. The nonphotosensitive composition includes: a first polymer containing a nitrogen atom; and a solvent. It is preferred that the base material contains a metal in a second region which is other than the first region of the surface layer. In the surface treatment step, an O2 plasma treatment is preferably conducted.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: February 16, 2021
    Assignee: JSR CORPORATION
    Inventors: Hitoshi Osaki, Hiroyuki Komatsu
  • Publication number: 20200402789
    Abstract: A pattern-forming method includes forming a patterned coating film on a part of a surface layer of a base. The surface layer includes regions each of which includes a material that differs from each other. A part of the regions is the part of the surface layer on which the patterned coating film is formed. The patterned coating film includes a first polymer including at an end of a main chain or a side chain thereof a group including a first functional group that is capable of bonding to an atom present in the part of the region. An atom layer is directly or indirectly formed on the surface layer of the base by a vapor deposition, after the forming of the patterned coating film.
    Type: Application
    Filed: July 7, 2020
    Publication date: December 24, 2020
    Applicant: JSR CORPORATION
    Inventors: Hitoshi OSAKI, Jeffrey KMIEC
  • Publication number: 20200384499
    Abstract: A modification method of a surface of a base includes applying a composition on a surface layer of a base to form a coating film. The surface layer contains a metal atom. The coating is heated. The composition contains a polymer and a solvent. The polymer includes at an end of a main chain or at an end of a side chain thereof, a functional group that is at least one selected from: a group represented by the following formula (1); a group containing a carbon-carbon triple bond; and a group containing an aromatic hydroxy group. In the formula (1), R1 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and n is an integer of 1 to 10, wherein in a case in which n is no less than 2, a plurality of R1s are identical or different.
    Type: Application
    Filed: August 24, 2020
    Publication date: December 10, 2020
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki KOMATSU, Miki TAMADA, Hitoshi OSAKI, Tomoki NAGAI
  • Publication number: 20200379348
    Abstract: A pattern-forming method includes: applying a radiation-sensitive composition containing a polymer and a radiation-sensitive acid generating agent on a surface of a substrate to form a coating film on the surface of the substrate; exposing the coating film; and developing the coating film exposed. The polymer has a first structural unit represented by formula (1). In the formula (1), R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group; and A represents a monovalent organic group having a nitrogen atom.
    Type: Application
    Filed: June 19, 2020
    Publication date: December 3, 2020
    Applicant: JSR CORPORATION
    Inventor: Hitoshi OSAKI
  • Patent number: 10691019
    Abstract: A pattern-forming method includes forming a base pattern having recessed portions on a front face side of a substrate directly or via other layer. The recessed portions of the base pattern are filled with a first composition to form a filler layer. Phase separation of the filler layer is allowed to form a plurality of phases of the filler layer. A part of the plurality of phases of the filler layer is removed to form a miniaturized pattern. The forming of the base pattern includes: forming a resist pattern on the front face side of the substrate; forming a layer of a second polymer on lateral faces of the resist pattern; and forming a layer of a third polymer that differs from the second polymer on a surface of the substrate or on a surface of the other layer.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: June 23, 2020
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Takehiko Naruoka, Masafumi Hori, Hitoshi Osaki, Tomohiro Oda
  • Publication number: 20200148845
    Abstract: A method for forming a cover film includes applying a composition including a first polymer and a solvent on a surface of a base material to form a coating film. The base material includes a surface layer which includes a first region and a second region having a surface condition that differs from a surface condition of the first region. The coating film is heated. A portion of the coating film is desorbed with a rinse agent after the heating. The portion is formed on the second region of the coating film. The first polymer includes a first structural unit represented by formula (1), or includes a monovalent organic group which bonds to at least one end of a main chain of the first polymer and which includes a nitrogen atom.
    Type: Application
    Filed: December 18, 2019
    Publication date: May 14, 2020
    Applicant: JSR CORPORATION
    Inventor: Hitoshi OSAKI
  • Publication number: 20200118819
    Abstract: A pattern-forming method includes forming a prepattern and including a first polymer is formed on a silicon-containing film on a substrate. An underlayer film including a second polymer is formed in recessed portions of the prepattern. A composition for directed self-assembled film formation including a third polymer is applied on the underlayer film and the prepattern. The first polymer includes a first structural unit. The second polymer includes: a molecular chain including the first structural unit and a second structural unit that differs from the first structural unit; and an end structure that bonds to one end of the molecular chain and includes at least one selected from the group consisting of an amino group, a hydroxy group and a carboxy group. The third polymer is a block copolymer including a block of the first structural unit and a block of the second structural unit.
    Type: Application
    Filed: October 10, 2019
    Publication date: April 16, 2020
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki KOMATSU, Miki TAMADA, Hitoshi OSAKI, Tomoki NAGAI
  • Publication number: 20200087530
    Abstract: A modification method of a surface of a substrate includes: applying a composition on a surface of a metal substrate, and heating a coating film formed by the applying, wherein the composition contains: a polymer having a first structural unit that includes an aromatic ring, and a second structural unit that includes an ethylenic double bond; a thermal acid generating agent; and a solvent, wherein the polymer has a functional group capable of bonding to a metal atom in the metal substrate.
    Type: Application
    Filed: July 31, 2019
    Publication date: March 19, 2020
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki KOMATSU, Miki TAMADA, Hitoshi OSAKI, Tomoki NAGAI
  • Publication number: 20200051813
    Abstract: A selective modification method of a base material surface includes subjecting at least a part of a surface of a base material to at least one surface treatment selected from the group consisting of an oxidization treatment and a hydrophilization treatment. The base material includes a surface layer and includes an oxide, a nitride or an oxynitride of silicon, or a combination thereof in a first region of the surface layer. A nonphotosensitive composition is applied directly or indirectly on the surface of the base material after the surface treatment. The nonphotosensitive composition includes: a first polymer containing a nitrogen atom; and a solvent. It is preferred that the base material contains a metal in a second region which is other than the first region of the surface layer. In the surface treatment step, an O2 plasma treatment is preferably conducted.
    Type: Application
    Filed: August 26, 2019
    Publication date: February 13, 2020
    Applicant: JSR CORPORATION
    Inventors: Hitoshi OSAKI, Hiroyuki KOMATSU