Patents by Inventor Hitoshi Sakamoto
Hitoshi Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10232248Abstract: A game machine operating device mounted on a game machine with a game board and provided on a front side of the game board includes: an operation unit which receives an operation; and a projection unit which radiates light in a direction toward the game board to project a first image on an area in a field of view of a player viewing the game board. The projection unit includes: a first light source; and a light guide into which light emitted from the first light source is guided. The light guide has a light diffusion pattern formed on one or both of a front surface and a rear surface, wherein light is emitted through the light diffusion pattern to form the first image. A part on which the light diffusion pattern is formed is disposed to be directed in the direction toward the game board.Type: GrantFiled: July 20, 2017Date of Patent: March 19, 2019Assignee: OMRON CorporationInventors: Hitoshi Sakamoto, Masaki Mizutani
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Patent number: 9968003Abstract: A cooling device 100 includes a first heat receiving unit 400, a second heat receiving unit 410, a first heat dissipating unit 700, and a second heat dissipating unit 710. The first heat dissipating unit 700 and the second heat dissipating unit 710 have a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surface 730 that is a principal surface having a flat plate shape in the first heat dissipating unit 700 and a second principal surface 740 that is a principal surface having a flat plate shape in the second heat dissipating unit 710 are arranged so as to face to each other. As a result, the size of the cooling device 100 can be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.Type: GrantFiled: January 15, 2015Date of Patent: May 8, 2018Assignee: NEC CorporationInventors: Hitoshi Sakamoto, Minoru Yoshikawa, Mahiro Hachiya
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Publication number: 20180056177Abstract: A game machine input device mounted on a game machine provided with a playfield; the game machine input device includes: an input unit provided toward the front of the playfield and configured to accept input; and a projection part configured to radiate light toward the playfield to project a first image in a region within the visual field of a player viewing the playfield.Type: ApplicationFiled: July 24, 2017Publication date: March 1, 2018Applicant: OMRON CorporationInventors: Hitoshi SAKAMOTO, Masaki MIZUTANI
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Publication number: 20180056176Abstract: A game machine operating device mounted on a game machine with a game board and provided on a front side of the game board includes: an operation unit which receives an operation; and a projection unit which radiates light in a direction toward the game board to project a first image on an area in a field of view of a player viewing the game board. The projection unit includes: a first light source; and a light guide into which light emitted from the first light source is guided. The light guide has a light diffusion pattern formed on one or both of a front surface and a rear surface, wherein light is emitted through the light diffusion pattern to form the first image. A part on which the light diffusion pattern is formed is disposed to be directed in the direction toward the game board.Type: ApplicationFiled: July 20, 2017Publication date: March 1, 2018Applicant: OMRON CorporationInventors: Hitoshi SAKAMOTO, Masaki MIZUTANI
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Patent number: 9868323Abstract: A vehicle approach alert device includes: a microcomputer having a memory that stores approach alert sound data, and a signal generator that generates an approach alert sound voltage waveform signal based on the approach alert sound data. The vehicle approach alert device alerts approach of a vehicle by outputting a vehicle approach alert sound from a sound outputting body according to the approach alert sound voltage waveform signal. The microcomputer further includes: an obtaining device that obtains a sound outputting body temperature; and a sound pressure correcting device that corrects a voltage level of the approach alert sound voltage waveform signal to be larger as the sound outputting body temperature increases.Type: GrantFiled: May 16, 2013Date of Patent: January 16, 2018Assignee: ANDEN CO., LTD.Inventors: Haruyuki Tsuzuki, Tsutomu Suzuki, Hitoshi Sakamoto
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Publication number: 20170350010Abstract: [Object] To provide a resin container having a dense and. thin coating with good gas barrier properties and a resin-container coating apparatus. [Solution] A metal oxide film 102 is formed on at least one of inner and outer surfaces of a resin container 101. The metal oxide film 102 includes a stack of layers of a metal forming the metal oxide film that are deposited on an atomic level and has a thickness of 5 to 100 nm.Type: ApplicationFiled: October 30, 2015Publication date: December 7, 2017Applicants: TAKEMOTO YOHKI CO., LTD.Inventors: Fumihiko Hirose, Etsuko Takemoto, Hiroshi Fujimori, Tsuyoshi Mashima, Hitoshi Sakamoto, Kenichi Ishibashi
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Patent number: 9820407Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510.Type: GrantFiled: February 19, 2014Date of Patent: November 14, 2017Assignee: NEC CorporationInventors: Hitoshi Sakamoto, Minoru Yoshikawa, Akira Shoujiguchi, Masaki Chiba, Kenichi Inaba, Arihiro Matsunaga
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Patent number: 9783107Abstract: A vehicle approach alert device that outputs an approach report sound from a sounding body includes: a memory part in which data of the approach report sound is memorized; a signal generator that generates a voltage waveform signal of the approach report sound based on the data of the approach report sound; a calculator that calculates a temperature of the sounding body; and a correct part that corrects the approach report sound based on the temperature of the sounding body. The calculator acquires information about a temperature detected by a temperature sensor located at a position different from the sounding body in the vehicle, and estimates the temperature of the sounding body based on the temperature detected by the temperature sensor.Type: GrantFiled: October 20, 2016Date of Patent: October 10, 2017Assignees: Anden Co., Ltd., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hitoshi Sakamoto, Hironari Tajimi, Chikara Yamamoto, Tomonori Suzuki, Tadashi Matsui
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Patent number: 9696068Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.Type: GrantFiled: July 19, 2013Date of Patent: July 4, 2017Assignee: NEC CorporationInventors: Arihiro Matsunaga, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Masaki Chiba, Kenichi Inaba
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Patent number: 9693485Abstract: A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.Type: GrantFiled: December 3, 2013Date of Patent: June 27, 2017Assignee: NEC CorporationInventors: Kenichi Inaba, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Arihiro Matsunaga, Masaki Chiba
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Publication number: 20170151907Abstract: A vehicle approach alert device that outputs an approach report sound from a sounding body includes: a memory part in which data of the approach report sound is memorized; a signal generator that generates a voltage waveform signal of the approach report sound based on the data of the approach report sound; a calculator that calculates a temperature of the sounding body; and a correct part that corrects the approach report sound based on the temperature of the sounding body. The calculator acquires information about a temperature detected by a temperature sensor located at a position different from the sounding body in the vehicle, and estimates the temperature of the sounding body based on the temperature detected by the temperature sensor.Type: ApplicationFiled: October 20, 2016Publication date: June 1, 2017Inventors: Hitoshi SAKAMOTO, Hironari TAJIMI, Chikara YAMAMOTO, Tomonori SUZUKI, Tadashi MATSUI
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Publication number: 20170125323Abstract: A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.Type: ApplicationFiled: March 20, 2015Publication date: May 4, 2017Applicant: NEC CorporationInventors: Hitoshi SAKAMOTO, Minoru YOSHIKAWA, Mahiro HACHIYA
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Patent number: 9605907Abstract: A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.Type: GrantFiled: March 15, 2011Date of Patent: March 28, 2017Assignee: NEC CORPORATIONInventors: Hitoshi Sakamoto, Minoru Yoshikawa, Kenichi Inaba, Takeya Hashiguchi
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Patent number: 9604979Abstract: The present invention relates to a compound represented by the formula (A) or (B), or a salt thereof capable of improving a red color of pyrroloquinoline quinone (PQQ) and obtaining functions of original PQQ, and to a method of efficiently manufacturing the compound. wherein R is an alkyl group, a hydroxyalkyl group, a dihydroxyalkyl group, or an alkoxyalkyl group.Type: GrantFiled: September 24, 2012Date of Patent: March 28, 2017Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kazuto Ikemoto, Hitoshi Sakamoto
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Patent number: 9557117Abstract: A cooling structure is provided which includes: an evaporation chamber defined by a base plate having a boiling surface, a ceiling plate and a side wall; a plurality of plate-shaped fins arranged in parallel on the boiling surface, defining a plurality of coolant passages in the evaporation chamber, a liquid phase coolant flows through the coolant passages in one direction from one end portion thereof toward another end portion; a liquid return port formed in the side wall facing the one end portion of coolant passages; and a vapor port formed in the ceiling plate facing the other end portion of coolant passages, wherein space is formed between the ceiling plate and an upper end portion of the plurality of plate-shaped fins, the space expanding gradually from a liquid return port side of the side wall toward the vapor port.Type: GrantFiled: October 7, 2009Date of Patent: January 31, 2017Assignee: NEC CORPORATIONInventors: Minoru Yoshikawa, Hitoshi Sakamoto, Takeya Hashiguchi
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Publication number: 20160338226Abstract: A cooling device 100 includes a first heat receiving unit 400, a second heat receiving unit 410, a first heat dissipating unit 700, and a second heat dissipating unit 710. The first heat dissipating unit 700 and the second heat dissipating unit 710 have a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surface 730 that is a principal surface having a flat plate shape in the first heat dissipating unit 700 and a second principal surface 740 that is a principal surface having a flat plate shape in the second heat dissipating unit 710 are arranged so as to face to each other. As a result, the size of the cooling device 100 can be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.Type: ApplicationFiled: January 15, 2015Publication date: November 17, 2016Applicant: NEC CorporationInventors: Hitoshi SAKAMOTO, Minoru YOSHIKAWA, Mahiro HACHIYA
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Patent number: 9459031Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.Type: GrantFiled: February 13, 2013Date of Patent: October 4, 2016Assignee: NEC CorporationInventors: Kenichi Inaba, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Masaki Chiba, Arihiro Matsunaga
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Patent number: 9456528Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.Type: GrantFiled: May 10, 2013Date of Patent: September 27, 2016Assignee: NEC CorporationInventors: Arihiro Matsunaga, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Masaki Chiba, Kenichi Inaba
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Patent number: 9433129Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.Type: GrantFiled: May 10, 2013Date of Patent: August 30, 2016Assignee: NEC CorporationInventors: Arihiro Matsunaga, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Masaki Chiba, Kenichi Inaba
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Publication number: 20160209120Abstract: A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.Type: ApplicationFiled: March 28, 2016Publication date: July 21, 2016Applicant: NEC CorporationInventors: Hitoshi SAKAMOTO, Minoru YOSHIKAWA, Takeya HASHIGUCHI