Abstract: A system for software download compatibility.

Abstract: A lockset assembly includes a first knob assembly having a projection with an enlarged head. A second knob assembly is configured to couple to the first knob assembly along a first axis. The second knob assembly including a rose liner with an opening is configured to receive the enlarged head of the projection in a bayonet connection. A retainer is coupled to the rose liner. The retainer defines a pocket shaped and sized to at least partially receive the projection, and the pocket is axially aligned with the opening. As the enlarged head is received within the opening, the retainer resiliently deflects to capture the projection within the pocket restricting disengagement of the enlarged head from the opening.

Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: The present invention provides a seal ring structure, which comprises a seal ring member. The seal ring member includes a first ring opening on one side and a second ring opening on the other. A periphery of the first ring opening includes a plurality of leak grooves. When the seal ring member and the valve ball squeeze each other, the plurality of leak grooves can reduce the torque required to rotate the valve ball. A leak-groove length of the plurality of leak grooves is smaller than a seal-ring-member length of the seal ring member. The plurality of leak grooves do not penetrate the seal ring member for avoiding leakage of fluid.

Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: The present invention provides a seal ring structure, which comprises a seal ring member. The seal ring member includes a first ring opening on one side and a second ring opening on the other. A periphery of the first ring opening includes a plurality of leak grooves. When the seal ring member and the valve ball squeeze each other, the plurality of leak grooves can reduce the torque required to rotate the valve ball. A leak-groove length of the plurality of leak grooves is smaller than a seal-ring-member length of the seal ring member. The plurality of leak grooves do not penetrate the seal ring member for avoiding leakage of fluid.

Abstract: A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.

Abstract: Examples of computing devices and methods for changing firmware settings of a computing device are described herein. In an example, a request for change in a firmware setting is received. In response to the request, the firmware setting is changed in real-time.

Abstract: A bi-directional optical module includes a substrate, at least one first light-emitting diode (LED), and at least one second LED. The first LED is disposed on a surface of the substrate. The first LED has a first reflection surface and a first light-outlet surface that are opposite to each other, and the first light-outlet surface is away from the substrate relative to the first reflection surface. The second LED is disposed on the same surface of the substrate. The second LED has a second reflection surface and a second light-outlet surface that are opposite to each other, and the second light-outlet surface is close to the substrate relative to the second reflection surface. The substrate has at least one light-transparent area that is not occupied by the first LED and the second LED.

Abstract: The present invention provides a measurement device for grinding wheel. One or more thickness measurement device is disposed slidably on a platform. A spinning device is disposed on the platform. A grinding wheel is fixed on the spinning device. The spinning shaft spins the grinding wheel. The one or more thickness measurement device measures the flatness condition of the grinding wheel. Furthermore, according to the present invention, a diameter measurement device is disposed inside the platform and measures the roundness of the outer periphery of the grinding wheel. Since the structure can be disassembled easily, the whole measurement device for grinding wheel can be carried conveniently. In addition, measurements can be performed by users on the site where the grinding wheel is located for real-timely understanding the real size and wear condition of grinding wheel.

Abstract: A power supply device disposed on an aircraft to provide a power to the aircraft is provided. The aircraft has an average required power value. The power supply device includes a secondary battery, a transformer and a fuel cell. The transformer is coupled between the secondary battery and the aircraft. The fuel cell is coupled to the aircraft and is adapted to provide a first output current to the aircraft. The transformer has an output voltage set value. When the first output end voltage of the fuel cell is lower than the output voltage set value, the transformer provides a second output current of the secondary battery to the aircraft. The output voltage set value is in a voltage range with a fuel cell output power between the maximum power value of characteristic curve of the fuel cell and the average required power value of the aircraft.

Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: The present invention provides a measurement device for grinding wheel. One or more thickness measurement device is disposed slidably on a platform. A spinning device is disposed on the platform. A grinding wheel is fixed on the spinning device. The spinning shaft spins the grinding wheel. The one or more thickness measurement device measures the flatness condition of the grinding wheel. Furthermore, according to the present invention, a diameter measurement device is disposed inside the platform and measures the roundness of the outer periphery of the grinding wheel. Since the structure can be disassembled easily, the whole measurement device for grinding wheel can be carried conveniently. In addition, measurements can be performed by users on the site where the grinding wheel is located for real-timely understanding the real size and wear condition of grinding wheel.

Abstract: An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometers or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.