Abstract: The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.

Abstract: A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.

Abstract: The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.

Abstract: A bi-directional optical module includes a substrate, at least one first light-emitting diode (LED), and at least one second LED. The first LED is disposed on a surface of the substrate. The first LED has a first reflection surface and a first light-outlet surface that are opposite to each other, and the first light-outlet surface is away from the substrate relative to the first reflection surface. The second LED is disposed on the same surface of the substrate. The second LED has a second reflection surface and a second light-outlet surface that are opposite to each other, and the second light-outlet surface is close to the substrate relative to the second reflection surface. The substrate has at least one light-transparent area that is not occupied by the first LED and the second LED.

Abstract: A fabricating method of a light-emitting apparatus including the following steps is provided. An adhesive layer having first adhesive bump groups including first adhesive bumps is provided. A transfer stamp picks up first light-emitting device groups including first light-emitting devices. The transfer stamp approaches the adhesive layer such that the first light-emitting devices of one first light-emitting device group are in contact with the first adhesive bumps of one corresponding first adhesive bump group. When the first light-emitting devices are in contact with the first adhesive bumps, the remaining first light-emitting devices on the transfer stamp are staggered with the first adhesive bumps and are not in contact with the adhesive layer. The transfer stamp is kept away from the adhesive layer such that the first light-emitting devices stay on the first adhesive bumps of the corresponding first adhesive bump group.

Abstract: An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometer or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.

Abstract: The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.

Abstract: A transparent polyester film has low visible light transmittance of 5-50% by JIS K7705 testing standard and a high infrared-blocking rate of at least 90% by JIS R3106 testing standard, which is extruded from a kind of polyester resins obtained from 5-40 wt % of nanoparticle-based thermal insulation slurry and/or 0.005-0.1 wt % of nanoparticle-based black pigment slurry by weight of and to react with the polymerization materials to completely perform an esterification and a polycondensation, wherein the thermal insulation nanoparticle has a chemical formula of CsXNYWO3-ZClC with an average particle size of 10-90 nm and the nanoparticle-based black contains carbon black particles having a particle size of 20-80 nm.

Abstract: A fabricating method of a light-emitting apparatus including the following steps is provided. An adhesive layer having first adhesive bump groups including first adhesive bumps is provided. A transfer stamp picks up first light-emitting device groups including first light-emitting devices. The transfer stamp approaches the adhesive layer such that the first light-emitting devices of one first light-emitting device group are in contact with the first adhesive bumps of one corresponding first adhesive bump group. When the first light-emitting devices are in contact with the first adhesive bumps, the remaining first light-emitting devices on the transfer stamp are staggered with the first adhesive bumps and are not in contact with the adhesive layer. The transfer stamp is kept away from the adhesive layer such that the first light-emitting devices stay on the first adhesive bumps of the corresponding first adhesive bump group.

Abstract: An article kit (100) comprising a first article part (120) and a second article part (140) is disclosed. The first article part (120) comprises a first housing portion (122) and a first fastener part (162,182) and the second article part (140) comprises a second housing portion (142) and a second fastener part (164,184). The first and second article parts (120,140) are relatively movable into a snap-fitted or latched engagement configuration by cooperative latching between the first and second fastener parts (162,182,164,184). The first fastener part (162,182) comprises a latching arrangement (1622a,1622b,1822a,1822b) and the second fastener part (164,184) comprises a latch anchoring arrangement (1644,1844) and a locking arrangement (1642,1842).

Abstract: A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the electrodes, and a plurality of micro-devices disposed on the electrodes, including a first micro-device and a second micro-device, are also provided. A voltage is applied to an electrode corresponding to the first micro-device, so that an electrostatic force generated on the first micro-device by the carrying unit is larger than a force generated on the second micro-device by the carrying unit. A transfer stamp contacts the first micro-device and the second micro-device, and moves when the transfer stamp contacts the first micro-device and the second micro-device and the electrostatic force is greater than the force generated by the carrying unit, so that the second micro-device is picked up by the transfer stamp and transferred to a receiving unit, and the first micro-device remains on the carrying unit.

Abstract: A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the electrodes, and a plurality of micro-devices disposed on the electrodes, including a first micro-device and a second micro-device, are also provided. A voltage is applied to an electrode corresponding to the first micro-device, so that an electrostatic force generated on the first micro-device by the carrying unit is larger than a force generated on the second micro-device by the carrying unit. A transfer stamp contacts the first micro-device and the second micro-device, and moves when the transfer stamp contacts the first micro-device and the second micro-device and the electrostatic force is greater than the force generated by the carrying unit, so that the second micro-device is picked up by the transfer stamp and transferred to a receiving unit, and the first micro-device remains on the carrying unit.

Abstract: A wafer boat includes a base, a plurality of support rods and a plurality of cantilever arms. The support rods are carried by the base. The support rods are disposed around a space above the base. The cantilever arms are carried by the support rods. At least two of the cantilever arms carried by at least one of the support rods are vertically spaced apart to define at least one slot for a wafer.

Abstract: A pet cage is comprised of a door frame, a lock unit, a top hoard, a bottom board, a left board, a right board, a back board and multiple fasteners. The door frame and the boards are assembled together by multiple fasteners and bolts. The lock unit is included a base on a door which is pivotally connected to the door frame, a receiving base fixed on the door frame, a bar able to resiliently lock the base and the receiving base together, two springs, two pins, and a cover. All of the parts of the pet cage are easy to be dis-assembled piece by piece so that the transportation or storage is saved. The lock unit is operated by one hand to lock or unlock the door.

Abstract: In a method for testing booting of servers, the servers are controlled to boot and perform a booting test, and are controlled to quit the booting test and a current state of the booting test is stored in a test log, if the booting of one of the servers is unsuccessful. System logs of all of the servers are saved if the booting times of all of the servers do not exceed the first predefined time. An alarm device is controlled to alarm if the booting time of one of the servers exceeds the first predefined time but does not exceed the second predefined time. And the servers are controlled to quit the booting test if the booting time of one of the servers exceeds the first predefined time and further exceeds the second predefined time.

Abstract: A high-frequency signal double-layer flat cable adapter card that is capable of eliminating transmission disorder of a double-layer cable caused by paralleling and overlap of high-frequency signals and a direct current power supply loop. The high-frequency double-layer flat cable adapter card comprises a first connecting end, a second connecting end and a flat cable group formed by at least two strips of flat cables. The first connecting end includes a first substrate and a connector. The second connecting end includes a second substrate. The flat cable group is in an upper-lower dual-layer structure and is connected between the first connecting end and the second connecting end. A conductive metal foil sheet is arranged between upper and lower dual layers of flat cables of the flat cable group.

Abstract: In a method for testing a booting of servers, the servers are controlled to boot to perform a booting test, and are controlled to quit the booting test. A current state of the booting test is stored in a test log, if the booting of one of the servers is unsuccessful. A system log of each server is saved in the storage device if a first component list of each server is identical to the second component list of the server. The servers are controlled to quit the booting test, and a current state of the booting test is recorded in the test log if the component list of one of the servers is not identical to the second component list the server.

Abstract: A method of performing real-time correction of a water stage forecast includes obtaining at least one predicted water stage of at least one time and a predicted water stage of a next time after the at least one time; obtaining at least one observed water stage of the at least one time; generating a system error of the water stage forecast according to the at least one observed water stage, the at least one predicted water stage, the predicted water stage of the next time, a Time Series method, and an Average Deviation method; utilizing a Kalman filter method to generate a random error of the water stage forecast; generating a water stage forecast correction of the next time according to the system error and the random error; and correcting a predicted water stage of the next time according to the water stage forecast correction and the predicted water stage.

Abstract: A high-frequency signal double-layer flat cable adapter card that is capable of eliminating transmission disorder of a double-layer cable caused by paralleling and overlap of high-frequency signals and a direct current power supply loop. The high-frequency double-layer flat cable adapter card comprises a first connecting end, a second connecting end and a flat cable group formed by at least two strips of flat cables. The first connecting end includes a first substrate and a connector. The second connecting end includes a second substrate. The flat cable group is in an upper-lower dual-layer structure and is connected between the first connecting end and the second connecting end. A conductive metal foil sheet is arranged between upper and lower dual layers of flat cables of the flat cable group.

Abstract: In a method for testing booting of servers, the servers are controlled to boot and perform a booting test, and are controlled to quit the booting test and a current state of the booting test is stored in a test log, if the booting of one of the servers is unsuccessful. System logs of all of the servers are saved if the booting times of all of the servers do not exceed the first predefined time. An alarm device is controlled to alarm if the booting time of one of the servers exceeds the first predefined time but does not exceed the second predefined time. And the servers are controlled to quit the booting test if the booting time of one of the servers exceeds the first predefined time and further exceeds the second predefined time.