Patents by Inventor Ho Leung

Ho Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967238
    Abstract: A vehicle detection system warns snowmobilers of other approaching vehicles with potential risk of collision. To better prevent accidents, the system calculates collision risks and warns the rider based on level of risk. When riding in groups, a member can press a stop request button to ask the group to slow down. When a member exits the group, everyone in the group will receive a message, alerts or indication with the update. The vehicle detection system utilizes Bluetooth® low energy (BLE), LoRaWAN® technologies and/or global positioning system technologies and is designed to detect other devices in the region and use acquired information to calculate proximity and risk of collision.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: April 23, 2024
    Inventors: Stephen Paul Churko, Rachel Kellie Churko, Jason Tyler Griffin, Joshua Kwan Ho Wong, Timothy Mackay, Thai Nguyen, Mingxuan Wang, Benjamin Altman, Lawrence Sze-Heen Leung
  • Patent number: 11938195
    Abstract: The present disclosure provides EBNA1 and LMP1 dual-targeting peptides and upconversion nanoparticles conjugates comprising the same useful as therapeutic and theranostic agents capable of targeting EBNA1 and LMP1 proteins present in Epstein-Barr virus infected cells, such as cancer.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: March 26, 2024
    Assignee: BP InnoMed Limited
    Inventors: Ka-Leung Wong, Hong Lok Lung, Shuai Zha, Ho-Fai Chau
  • Publication number: 20240096769
    Abstract: The disclosure provides a method for manufacturing a semiconductor package assembly, which results in a semiconductor package assembly with a more even distributed stress concentrations, reduced solder crack occurrences and limited solder filler joint connections.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Applicant: NEXPERIA B.V.
    Inventors: Haibo Fan, Zhou Zhou, Chi Ho Leung
  • Publication number: 20240084079
    Abstract: Disclosed herein are processes for producing metal-organic framework (MOF) materials (e.g., ZIF-67), as well as MOF-coated light emitted diodes (LEDs). The process for producing ZIF-67 nanoparticles includes (a) mixing a solution of cobalt(II) hexahydrate and a solution of 2-methylimiazole to give a first mixture solution; and (b) let the first mixture solution stand for a sufficient period of time to allow the growth of the ZIF-67 nanoparticles. The process for producing a ZIF-67-coated light emitted diode (LED) includes (i) dispersing the ZIF-67 nanoparticles in a poly (methyl methacrylate) (PMMA) solution to form a ZIF-67@PMMA slurry; and (ii) applying the ZIF-67@PMMA slurry onto the surface of an LED in a dropwise manner to give the ZIF-67@PMMA-coated LED.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 14, 2024
    Inventors: Thuc Hue LY, Ping MAN, Ka Ho LEUNG
  • Publication number: 20240080920
    Abstract: The present disclosure provides systems and methods which increase the throughput of a TCP-based communication between a first network node and a second network node. First, the first network node sent a first plurality of TCP segments to the second network node. Second, when the second network node receives a second plurality of TCP segments, which is all or part of the first plurality of the TCP segments, the second network node responds by sending one or more TCP acknowledgements to the first network node with the last sequence number of a last segment among all TCP segment within the second plurality of TCP segments. The present disclosure are able to increase the throughput of a TCP connection while decreasing its reliability.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Applicant: Pismo Labs Technology Limited
    Inventors: Patrick Ho Wai Sung, Kam Chiu Ng, Wan Chun Leung
  • Publication number: 20240006276
    Abstract: The present disclosure relates to manufacturing techniques for manufacturing multiple semiconductor package assemblies on a lead frame, as well as a semiconductor package assembly manufactured using this method. The method reduces the distances or intermediate spacings between singulated semiconductor packages on a lead frame to a width equal to the width of a cutting tool which width is significantly smaller than the distance required in any known modelling encapsulation technique. Therefore, the method according to the disclosure allows to position more semiconductor packages on a lead frame on one process step. Accordingly, as the number of semiconductor packages per lead frame surface is increased, more semiconductor packages can be manufactured and singulated in one process step, which reduces costs and processing time.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 4, 2024
    Applicant: NEXPERIA B.V.
    Inventors: Hiu Hay Nichole Lam, Shu-ming Yip, Chi Ho Leung, Shun Tik Yeung
  • Publication number: 20230146666
    Abstract: An electronic package and method for manufacturing is provided. The package includes an electronic component having a terminal, a solidified molding compound encapsulating the electronic component, a lead including an inner and a mounting portion. The molding compound includes a first recess at or near a perimeter of a bottom surface of the mounting portion, exposing a portion of a bottom surface of the inner portion arranged near the mounting portion, and/or a second recess at the perimeter of the bottom surface of the mounting portion, the second recess exposing a portion of a side surface of the mounting portion extending between the top and the bottom surface of the mounting portion. The package provides more exposed lead space for a larger solder covering area using the first and/or second recess. Thus, solder strain accumulation is reduced or mitigated, and reliability of the electronic package can be enhanced.
    Type: Application
    Filed: November 8, 2022
    Publication date: May 11, 2023
    Applicant: NEXPERIA B.V.
    Inventors: Zhou Zhou, Haibo Fan, Chi Ho Leung
  • Publication number: 20230134075
    Abstract: A method for producing a semiconductor package includes providing a lead frame and a bond pad with a space therebetween. The frame is provided with a die bonded thereon and a die pad. The die, the pad, a part of the frame, a part of the bond pad and the space between the frame and the bond pad are encapsulated. Part of the first encapsulation is removed to create a cavity having a bottom surface including an exposed surface of the die, an exposed surface of the pad, an exposed surface of the bond pad and a connecting region between the exposed surface of the pad and the bond pad. The cavity is partly filled with an electrically conductive paste. The electrically conductive paste is cured to obtain an interconnect between the die pad and the bond pad. The interconnect is encapsulated.
    Type: Application
    Filed: November 3, 2022
    Publication date: May 4, 2023
    Applicant: NEXPERIA B.V.
    Inventors: Chi Ho Leung, Shun Tik Yeung, King Man Tai, Ka Shing Martin Li
  • Publication number: 20230129525
    Abstract: A beverage preparation system and a method for preparing a beverage thereby, which includes at least one ingredient container for containing an ingredient; a dispenser for dispensing said ingredient from said at least one ingredient container for preparation of a beverage; a controller for controlling the operation of the dispense; and a wireless communication module associated with the controller for receiving instructions from a remote device via wireless communication to exercise control via the controller upon the dispenser for reserving a specific portion of said ingredient in the ingredient container.
    Type: Application
    Filed: October 25, 2022
    Publication date: April 27, 2023
    Inventors: Ho Leung Lee, Wai Wah Ng, Ngai Hin So, Ka Yin Ngai, Kwun To Chan, Chi Chung Chan
  • Patent number: 11438084
    Abstract: A multiple access slotted wireless communication system comprising a plurality of terminals and a multi-access receiver is described. The multi-access receiver can decode multiple transmissions in each slot of a frame from terminals in its field of view. Each terminal has an active state for transmitting and an inactive state. After receiving acknowledgement of a successful transmission by the terminal, the terminal enters the inactive state for at least a transmission delay time. This may be the remaining time that the terminal is in the field of view of the multi-access receiver. This may be achieved by the terminal using a probability of transmission to determine whether or not to transmit in the next frame. The terminal may also be configured to select the slot in a frame, and this may be based upon information such as which slots were acknowledged. The receiver may use compression to transmit acknowledgement messages.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: September 6, 2022
    Assignee: Myriota Pty Ltd
    Inventors: Alexander James Grant, David Victor Lawrie Haley, Robert George McKilliam, William George Cowley, Ho Leung Chan
  • Patent number: 11420782
    Abstract: This invention involves with a kind of coffee machine, especially involves with a kind of automatic coffee grinding capsule making machine. The machine consists of the base, automatic rotating operation platform, coffee cup unloading device, coffee bean grinding device, coffee powder temporary storage device, powder tamping and removal device, coffee cap unloading device and capping device; the said automatic rotating operation platform is provided at the said base; the said automatic rotating operation platform can rotate based on the coffee capsule making status. This invention discloses the non-industrial and automatic coffee capsule maker that integrates coffee bean grinding, powder tamping and injection for capsule and capsule capping and improves the licensed process of such maker. This invention has more compact structure, smaller volume and lower cost, and can be operated simply and conveniently.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: August 23, 2022
    Assignee: ATOM XQUARE LIMITED
    Inventor: Ho Leung Lui
  • Publication number: 20220011325
    Abstract: This disclosure relates to methods for determining pH and also calcium (Ca2+) concentration or chloride (Cl?) concentration in biological samples. More particularly, this disclosure relates to methods capable of simultaneously determining pH and Ca2+ concentration, or pH and Cl? concentration using nucleic acid complexes.
    Type: Application
    Filed: December 2, 2019
    Publication date: January 13, 2022
    Inventors: Yamuna Krishnan, Kasturi Chakraborty, Ka Ho Leung, Anand Saminathan
  • Publication number: 20200220638
    Abstract: A multiple access slotted wireless communication system comprising a plurality of terminals and a multi-access receiver is described. The multi-access receiver can decode multiple transmissions in each slot of a frame from terminals in its field of view. Each terminal has an active state for transmitting and an inactive state. After receiving acknowledgement of a successful transmission by the terminal, the terminal enters the inactive state for at least a transmission delay time. This may be the remaining time that the terminal is in the field of view of the multi-access receiver. This may be achieved by the terminal using a probability of transmission to determine whether or not to transmit in the next frame. The terminal may also be configured to select the slot in a frame, and this may be based upon information such as which slots were acknowledged. The receiver may use compression to transmit acknowledgement messages.
    Type: Application
    Filed: March 13, 2020
    Publication date: July 9, 2020
    Inventors: Alexander James Grant, David Victor Lawrie Haley, Robert George McKilliam, William George Cowley, Ho Leung Chan
  • Publication number: 20200169935
    Abstract: Planning cell site handoffs using a navigation route. The navigation route is compared to the location of cell sites to predict the arrival time of a mobile device into each cell. Cell sites are selected based on the navigation route and user activity. Handoff between cells sites are scheduled in advance based on the navigation route.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 28, 2020
    Inventors: Ho Leung Lin, Gregory J. Boss, Maharaj Mukherjee, Monimala Mukherjee
  • Patent number: 10658274
    Abstract: An electronic device including a die and at least one lead. The electronic device further includes a corresponding at least one connector, each connector for connecting the die to a corresponding lead or leads, and each connector having a first end disposed in bondable proximity to a complementary surface of the corresponding lead and a second end disposed in bondable proximity to a complementary surface of the die. An end portion of at least one of the first end and second end has a formation, the formation in combination with the complementary surface of one, or both, of the respective lead or the die defining therebetween a first region and at least a second region configured to attract by capillary action an electrically conductive bonding material to consolidate therein.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: May 19, 2020
    Assignee: Nexperia B.V.
    Inventors: Tim Boettcher, Haibo Fan, Wai Wong Chow, Pompeo V. Umali, Shun Tik Yeung, Chi Ho Leung
  • Patent number: 10660005
    Abstract: Planning cell site handoffs using a navigation route. The navigation route is compared to the location of cell sites to predict the arrival time of a mobile device into each cell. Cell sites are selected based on the navigation route and user activity. Handoff between cells sites are scheduled in advance based on the navigation route.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 19, 2020
    Assignee: International Business Machines Corporation
    Inventors: Ho Leung Lin, Gregory J. Boss, Maharaj Mukherjee, Monimala Mukherjee
  • Publication number: 20200087011
    Abstract: This invention involves with a kind of coffee machine, especially involves with a kind of automatic coffee grinding capsule making machine. The machine consists of the base, automatic rotating operation platform, coffee cup unloading device, coffee bean grinding device, coffee powder temporary storage device, powder tamping and removal device, coffee cap unloading device and capping device; the said automatic rotating operation platform is provided at the said base; the said automatic rotating operation platform can rotate based on the coffee capsule making status. This invention discloses the non-industrial and automatic coffee capsule maker that integrates coffee bean grinding, powder tamping and injection for capsule and capsule capping and improves the licensed process of such maker. This invention has more compact structure, smaller volume and lower cost, and can be operated simply and conveniently.
    Type: Application
    Filed: July 26, 2018
    Publication date: March 19, 2020
    Inventor: Ho Leung LUI
  • Patent number: 10594425
    Abstract: A multiple access slotted wireless communication system comprising a plurality of terminals and a multi-access receiver is described. The multi-access receiver can decode multiple transmissions in each slot of a frame from terminals in its field of view. Each terminal has an active state for transmitting and an inactive state. After receiving acknowledgement of a successful transmission by the terminal, the terminal enters the inactive state for at least a transmission delay time. This may be the remaining time that the terminal is in the field of view of the multi-access receiver. This may be achieved by the terminal using a probability of transmission to determine whether or not to transmit in the next frame. The terminal may also be configured to select the slot in a frame, and this may be based upon information such as which slots were acknowledged. The receiver may use compression to transmit acknowledgement messages.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: March 17, 2020
    Assignee: Myriota Pty Ltd
    Inventors: Alexander James Grant, David Victor Lawrie Haley, Robert George McKilliam, William George Cowley, Ho Leung Chan
  • Patent number: 10529644
    Abstract: A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also includes a semiconductor substrate. The device further includes a first contact located on a first surface of the substrate. The device also includes a second contact located on a second surface of the substrate. The first surface of the substrate is mounted on the first surface of the heat sink for electrical and thermal conduction between the heat sink and the substrate via the first contact. The second surface of the substrate is mountable on a surface of a carrier.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: January 7, 2020
    Assignee: Nexperia B.V.
    Inventors: Shun Tik Yeung, Pompeo Umali, Hans-Juergen Funke, Chi Ho Leung, Wolfgang Schnitt, Zhihao Pan
  • Patent number: 10410941
    Abstract: A semiconductor device includes a semiconductor die having a top surface that has one or more electrical contacts formed thereon, and an opposite bottom surface. A molding material encapsulates the top surface and at least a part of a side surface of the semiconductor die. The molding material defines a package body that has a top surface and a side surface. Openings are formed on the top surface of the package body, and the electrical contacts are partially exposed from the molding material through the openings. A metal layer is formed over and electrically connected to the electrical contacts through the openings. The metal layer extends to and at least partially covers the side surface of the package body.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: September 10, 2019
    Assignee: Nexperia B.V.
    Inventors: Chi Ho Leung, Pompeo V. Umali, Shun Tik Yeung, Kan Wae Lam