Patents by Inventor Ho Leung
Ho Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967238Abstract: A vehicle detection system warns snowmobilers of other approaching vehicles with potential risk of collision. To better prevent accidents, the system calculates collision risks and warns the rider based on level of risk. When riding in groups, a member can press a stop request button to ask the group to slow down. When a member exits the group, everyone in the group will receive a message, alerts or indication with the update. The vehicle detection system utilizes Bluetooth® low energy (BLE), LoRaWAN® technologies and/or global positioning system technologies and is designed to detect other devices in the region and use acquired information to calculate proximity and risk of collision.Type: GrantFiled: May 13, 2022Date of Patent: April 23, 2024Inventors: Stephen Paul Churko, Rachel Kellie Churko, Jason Tyler Griffin, Joshua Kwan Ho Wong, Timothy Mackay, Thai Nguyen, Mingxuan Wang, Benjamin Altman, Lawrence Sze-Heen Leung
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Patent number: 11938195Abstract: The present disclosure provides EBNA1 and LMP1 dual-targeting peptides and upconversion nanoparticles conjugates comprising the same useful as therapeutic and theranostic agents capable of targeting EBNA1 and LMP1 proteins present in Epstein-Barr virus infected cells, such as cancer.Type: GrantFiled: June 11, 2021Date of Patent: March 26, 2024Assignee: BP InnoMed LimitedInventors: Ka-Leung Wong, Hong Lok Lung, Shuai Zha, Ho-Fai Chau
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Publication number: 20240096769Abstract: The disclosure provides a method for manufacturing a semiconductor package assembly, which results in a semiconductor package assembly with a more even distributed stress concentrations, reduced solder crack occurrences and limited solder filler joint connections.Type: ApplicationFiled: September 15, 2023Publication date: March 21, 2024Applicant: NEXPERIA B.V.Inventors: Haibo Fan, Zhou Zhou, Chi Ho Leung
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Publication number: 20240084079Abstract: Disclosed herein are processes for producing metal-organic framework (MOF) materials (e.g., ZIF-67), as well as MOF-coated light emitted diodes (LEDs). The process for producing ZIF-67 nanoparticles includes (a) mixing a solution of cobalt(II) hexahydrate and a solution of 2-methylimiazole to give a first mixture solution; and (b) let the first mixture solution stand for a sufficient period of time to allow the growth of the ZIF-67 nanoparticles. The process for producing a ZIF-67-coated light emitted diode (LED) includes (i) dispersing the ZIF-67 nanoparticles in a poly (methyl methacrylate) (PMMA) solution to form a ZIF-67@PMMA slurry; and (ii) applying the ZIF-67@PMMA slurry onto the surface of an LED in a dropwise manner to give the ZIF-67@PMMA-coated LED.Type: ApplicationFiled: September 8, 2022Publication date: March 14, 2024Inventors: Thuc Hue LY, Ping MAN, Ka Ho LEUNG
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Publication number: 20240080920Abstract: The present disclosure provides systems and methods which increase the throughput of a TCP-based communication between a first network node and a second network node. First, the first network node sent a first plurality of TCP segments to the second network node. Second, when the second network node receives a second plurality of TCP segments, which is all or part of the first plurality of the TCP segments, the second network node responds by sending one or more TCP acknowledgements to the first network node with the last sequence number of a last segment among all TCP segment within the second plurality of TCP segments. The present disclosure are able to increase the throughput of a TCP connection while decreasing its reliability.Type: ApplicationFiled: November 13, 2023Publication date: March 7, 2024Applicant: Pismo Labs Technology LimitedInventors: Patrick Ho Wai Sung, Kam Chiu Ng, Wan Chun Leung
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Publication number: 20240006276Abstract: The present disclosure relates to manufacturing techniques for manufacturing multiple semiconductor package assemblies on a lead frame, as well as a semiconductor package assembly manufactured using this method. The method reduces the distances or intermediate spacings between singulated semiconductor packages on a lead frame to a width equal to the width of a cutting tool which width is significantly smaller than the distance required in any known modelling encapsulation technique. Therefore, the method according to the disclosure allows to position more semiconductor packages on a lead frame on one process step. Accordingly, as the number of semiconductor packages per lead frame surface is increased, more semiconductor packages can be manufactured and singulated in one process step, which reduces costs and processing time.Type: ApplicationFiled: June 29, 2023Publication date: January 4, 2024Applicant: NEXPERIA B.V.Inventors: Hiu Hay Nichole Lam, Shu-ming Yip, Chi Ho Leung, Shun Tik Yeung
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Publication number: 20230146666Abstract: An electronic package and method for manufacturing is provided. The package includes an electronic component having a terminal, a solidified molding compound encapsulating the electronic component, a lead including an inner and a mounting portion. The molding compound includes a first recess at or near a perimeter of a bottom surface of the mounting portion, exposing a portion of a bottom surface of the inner portion arranged near the mounting portion, and/or a second recess at the perimeter of the bottom surface of the mounting portion, the second recess exposing a portion of a side surface of the mounting portion extending between the top and the bottom surface of the mounting portion. The package provides more exposed lead space for a larger solder covering area using the first and/or second recess. Thus, solder strain accumulation is reduced or mitigated, and reliability of the electronic package can be enhanced.Type: ApplicationFiled: November 8, 2022Publication date: May 11, 2023Applicant: NEXPERIA B.V.Inventors: Zhou Zhou, Haibo Fan, Chi Ho Leung
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Publication number: 20230134075Abstract: A method for producing a semiconductor package includes providing a lead frame and a bond pad with a space therebetween. The frame is provided with a die bonded thereon and a die pad. The die, the pad, a part of the frame, a part of the bond pad and the space between the frame and the bond pad are encapsulated. Part of the first encapsulation is removed to create a cavity having a bottom surface including an exposed surface of the die, an exposed surface of the pad, an exposed surface of the bond pad and a connecting region between the exposed surface of the pad and the bond pad. The cavity is partly filled with an electrically conductive paste. The electrically conductive paste is cured to obtain an interconnect between the die pad and the bond pad. The interconnect is encapsulated.Type: ApplicationFiled: November 3, 2022Publication date: May 4, 2023Applicant: NEXPERIA B.V.Inventors: Chi Ho Leung, Shun Tik Yeung, King Man Tai, Ka Shing Martin Li
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Publication number: 20230129525Abstract: A beverage preparation system and a method for preparing a beverage thereby, which includes at least one ingredient container for containing an ingredient; a dispenser for dispensing said ingredient from said at least one ingredient container for preparation of a beverage; a controller for controlling the operation of the dispense; and a wireless communication module associated with the controller for receiving instructions from a remote device via wireless communication to exercise control via the controller upon the dispenser for reserving a specific portion of said ingredient in the ingredient container.Type: ApplicationFiled: October 25, 2022Publication date: April 27, 2023Inventors: Ho Leung Lee, Wai Wah Ng, Ngai Hin So, Ka Yin Ngai, Kwun To Chan, Chi Chung Chan
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Patent number: 11438084Abstract: A multiple access slotted wireless communication system comprising a plurality of terminals and a multi-access receiver is described. The multi-access receiver can decode multiple transmissions in each slot of a frame from terminals in its field of view. Each terminal has an active state for transmitting and an inactive state. After receiving acknowledgement of a successful transmission by the terminal, the terminal enters the inactive state for at least a transmission delay time. This may be the remaining time that the terminal is in the field of view of the multi-access receiver. This may be achieved by the terminal using a probability of transmission to determine whether or not to transmit in the next frame. The terminal may also be configured to select the slot in a frame, and this may be based upon information such as which slots were acknowledged. The receiver may use compression to transmit acknowledgement messages.Type: GrantFiled: March 13, 2020Date of Patent: September 6, 2022Assignee: Myriota Pty LtdInventors: Alexander James Grant, David Victor Lawrie Haley, Robert George McKilliam, William George Cowley, Ho Leung Chan
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Patent number: 11420782Abstract: This invention involves with a kind of coffee machine, especially involves with a kind of automatic coffee grinding capsule making machine. The machine consists of the base, automatic rotating operation platform, coffee cup unloading device, coffee bean grinding device, coffee powder temporary storage device, powder tamping and removal device, coffee cap unloading device and capping device; the said automatic rotating operation platform is provided at the said base; the said automatic rotating operation platform can rotate based on the coffee capsule making status. This invention discloses the non-industrial and automatic coffee capsule maker that integrates coffee bean grinding, powder tamping and injection for capsule and capsule capping and improves the licensed process of such maker. This invention has more compact structure, smaller volume and lower cost, and can be operated simply and conveniently.Type: GrantFiled: July 26, 2018Date of Patent: August 23, 2022Assignee: ATOM XQUARE LIMITEDInventor: Ho Leung Lui
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Publication number: 20220011325Abstract: This disclosure relates to methods for determining pH and also calcium (Ca2+) concentration or chloride (Cl?) concentration in biological samples. More particularly, this disclosure relates to methods capable of simultaneously determining pH and Ca2+ concentration, or pH and Cl? concentration using nucleic acid complexes.Type: ApplicationFiled: December 2, 2019Publication date: January 13, 2022Inventors: Yamuna Krishnan, Kasturi Chakraborty, Ka Ho Leung, Anand Saminathan
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Publication number: 20200220638Abstract: A multiple access slotted wireless communication system comprising a plurality of terminals and a multi-access receiver is described. The multi-access receiver can decode multiple transmissions in each slot of a frame from terminals in its field of view. Each terminal has an active state for transmitting and an inactive state. After receiving acknowledgement of a successful transmission by the terminal, the terminal enters the inactive state for at least a transmission delay time. This may be the remaining time that the terminal is in the field of view of the multi-access receiver. This may be achieved by the terminal using a probability of transmission to determine whether or not to transmit in the next frame. The terminal may also be configured to select the slot in a frame, and this may be based upon information such as which slots were acknowledged. The receiver may use compression to transmit acknowledgement messages.Type: ApplicationFiled: March 13, 2020Publication date: July 9, 2020Inventors: Alexander James Grant, David Victor Lawrie Haley, Robert George McKilliam, William George Cowley, Ho Leung Chan
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Publication number: 20200169935Abstract: Planning cell site handoffs using a navigation route. The navigation route is compared to the location of cell sites to predict the arrival time of a mobile device into each cell. Cell sites are selected based on the navigation route and user activity. Handoff between cells sites are scheduled in advance based on the navigation route.Type: ApplicationFiled: November 28, 2018Publication date: May 28, 2020Inventors: Ho Leung Lin, Gregory J. Boss, Maharaj Mukherjee, Monimala Mukherjee
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Patent number: 10658274Abstract: An electronic device including a die and at least one lead. The electronic device further includes a corresponding at least one connector, each connector for connecting the die to a corresponding lead or leads, and each connector having a first end disposed in bondable proximity to a complementary surface of the corresponding lead and a second end disposed in bondable proximity to a complementary surface of the die. An end portion of at least one of the first end and second end has a formation, the formation in combination with the complementary surface of one, or both, of the respective lead or the die defining therebetween a first region and at least a second region configured to attract by capillary action an electrically conductive bonding material to consolidate therein.Type: GrantFiled: December 17, 2018Date of Patent: May 19, 2020Assignee: Nexperia B.V.Inventors: Tim Boettcher, Haibo Fan, Wai Wong Chow, Pompeo V. Umali, Shun Tik Yeung, Chi Ho Leung
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Patent number: 10660005Abstract: Planning cell site handoffs using a navigation route. The navigation route is compared to the location of cell sites to predict the arrival time of a mobile device into each cell. Cell sites are selected based on the navigation route and user activity. Handoff between cells sites are scheduled in advance based on the navigation route.Type: GrantFiled: November 28, 2018Date of Patent: May 19, 2020Assignee: International Business Machines CorporationInventors: Ho Leung Lin, Gregory J. Boss, Maharaj Mukherjee, Monimala Mukherjee
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Publication number: 20200087011Abstract: This invention involves with a kind of coffee machine, especially involves with a kind of automatic coffee grinding capsule making machine. The machine consists of the base, automatic rotating operation platform, coffee cup unloading device, coffee bean grinding device, coffee powder temporary storage device, powder tamping and removal device, coffee cap unloading device and capping device; the said automatic rotating operation platform is provided at the said base; the said automatic rotating operation platform can rotate based on the coffee capsule making status. This invention discloses the non-industrial and automatic coffee capsule maker that integrates coffee bean grinding, powder tamping and injection for capsule and capsule capping and improves the licensed process of such maker. This invention has more compact structure, smaller volume and lower cost, and can be operated simply and conveniently.Type: ApplicationFiled: July 26, 2018Publication date: March 19, 2020Inventor: Ho Leung LUI
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Patent number: 10594425Abstract: A multiple access slotted wireless communication system comprising a plurality of terminals and a multi-access receiver is described. The multi-access receiver can decode multiple transmissions in each slot of a frame from terminals in its field of view. Each terminal has an active state for transmitting and an inactive state. After receiving acknowledgement of a successful transmission by the terminal, the terminal enters the inactive state for at least a transmission delay time. This may be the remaining time that the terminal is in the field of view of the multi-access receiver. This may be achieved by the terminal using a probability of transmission to determine whether or not to transmit in the next frame. The terminal may also be configured to select the slot in a frame, and this may be based upon information such as which slots were acknowledged. The receiver may use compression to transmit acknowledgement messages.Type: GrantFiled: April 25, 2017Date of Patent: March 17, 2020Assignee: Myriota Pty LtdInventors: Alexander James Grant, David Victor Lawrie Haley, Robert George McKilliam, William George Cowley, Ho Leung Chan
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Patent number: 10529644Abstract: A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also includes a semiconductor substrate. The device further includes a first contact located on a first surface of the substrate. The device also includes a second contact located on a second surface of the substrate. The first surface of the substrate is mounted on the first surface of the heat sink for electrical and thermal conduction between the heat sink and the substrate via the first contact. The second surface of the substrate is mountable on a surface of a carrier.Type: GrantFiled: February 22, 2016Date of Patent: January 7, 2020Assignee: Nexperia B.V.Inventors: Shun Tik Yeung, Pompeo Umali, Hans-Juergen Funke, Chi Ho Leung, Wolfgang Schnitt, Zhihao Pan
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Patent number: 10410941Abstract: A semiconductor device includes a semiconductor die having a top surface that has one or more electrical contacts formed thereon, and an opposite bottom surface. A molding material encapsulates the top surface and at least a part of a side surface of the semiconductor die. The molding material defines a package body that has a top surface and a side surface. Openings are formed on the top surface of the package body, and the electrical contacts are partially exposed from the molding material through the openings. A metal layer is formed over and electrically connected to the electrical contacts through the openings. The metal layer extends to and at least partially covers the side surface of the package body.Type: GrantFiled: September 8, 2016Date of Patent: September 10, 2019Assignee: Nexperia B.V.Inventors: Chi Ho Leung, Pompeo V. Umali, Shun Tik Yeung, Kan Wae Lam