Abstract: A semiconductor package for a PCB includes: a die paddle; a die; a plurality of terminals, and an encapsulant. The die is coupled to the die paddle. The plurality of terminals are electrically connected to the die. The plurality of terminals include a first array of terminals, disposed along a first side of the semiconductor package, and a second array of terminals, disposed along a second side of the semiconductor package. The second side is opposite to the first side. Each of the plurality of terminals comprises a pad with a flank. The encapsulant at least partly surrounds the die. The recess is defined between each terminal of each of the first and second arrays of terminals.

Abstract: There is provided a method of manufacturing a semiconductor die package. The method includes providing a leadframe having a sub-structure and at least one tie bar, the sub-structure includes a terminal-forming portion in electrical communication with the at least one tie bar. The method includes bonding a die to the sub-structure. The method includes encapsulating the sub-structure and the die within an encapsulation layer. The method includes performing a first cut through the terminal-forming portion and the encapsulation layer so as to form a side terminal, while leaving all tie bars substantially intact. The method includes electroplating the side terminal. The method includes performing a second cut through the tie bar and the encapsulation layer to singulate a semiconductor die package from the leadframe.

Abstract: A method of manufacturing semiconductor assemblies is provided, the method includes forming an array of semiconductor assemblies, the semiconductor assemblies including encapsulant having frangible connections between adjacent semiconductor assemblies; and applying force to the semiconductor assemblies to break the frangible connections and thereby singulate the semiconductor assemblies.

Abstract: A method for recognizing a participating activity and computing an attention level of a subject from multi-model signals, comprising receiving the multi-model signals comprising an electroencephalogram (EEG) signal, a photoplethysmography (PPG) signal, an image/video signal, an audio signal, and an inertial measurement signal. The method further comprises executing an activity recognition to predict an activity type of a participating activity being performed by the subject using one or more of the multi-model signals; and executing an attention level computation to predict the subject's attention level in performing the participating activity using one or more of the multi-model signals.

Abstract: Techniques for monitoring the health of services of a system are disclosed. A system determines that a detected alarm is associated with a service feature, and the service feature is associated with a service of a cloud environment. The system computes a health metric for the service based at least on the detected alarm that is associated with the service feature. Additionally, the system generates a visual representation that includes the health metric for display on a service health interface.

Abstract: Techniques for monitoring the health of services of a system are disclosed. A system determines a health metric for a service in a cloud environment. Additionally, the system determines a first service feature of the service and a plurality of downstream service features that depend on the first service feature. The system determines an impact weight for the first service based on the plurality of downstream service features. Additionally, the system computes a weighted health metric for the service at least by applying the impact weight to the health metric. The system generates a visual representation that includes the weighted health metric for display on a service health interface.

Abstract: Disclosed herein is a method of producing a substrate having a single-layer transition metal selenide (TMS) nanoflakes deposited thereon. The method is characterized in not using hydrogen as a reducing agent during the deposition of monolayer TMS nanoflakes on the substrate. Such substrates may serve as an optic, an electronic device, a mechanic, a sensor etc.

Abstract: The disclosure provides a method for manufacturing a semiconductor package assembly, which results in a semiconductor package assembly with a more even distributed stress concentrations, reduced solder crack occurrences and limited solder filler joint connections.

Abstract: Disclosed herein are processes for producing metal-organic framework (MOF) materials (e.g., ZIF-67), as well as MOF-coated light emitted diodes (LEDs). The process for producing ZIF-67 nanoparticles includes (a) mixing a solution of cobalt(II) hexahydrate and a solution of 2-methylimiazole to give a first mixture solution; and (b) let the first mixture solution stand for a sufficient period of time to allow the growth of the ZIF-67 nanoparticles. The process for producing a ZIF-67-coated light emitted diode (LED) includes (i) dispersing the ZIF-67 nanoparticles in a poly (methyl methacrylate) (PMMA) solution to form a ZIF-67@PMMA slurry; and (ii) applying the ZIF-67@PMMA slurry onto the surface of an LED in a dropwise manner to give the ZIF-67@PMMA-coated LED.

Abstract: The present disclosure relates to manufacturing techniques for manufacturing multiple semiconductor package assemblies on a lead frame, as well as a semiconductor package assembly manufactured using this method. The method reduces the distances or intermediate spacings between singulated semiconductor packages on a lead frame to a width equal to the width of a cutting tool which width is significantly smaller than the distance required in any known modelling encapsulation technique. Therefore, the method according to the disclosure allows to position more semiconductor packages on a lead frame on one process step. Accordingly, as the number of semiconductor packages per lead frame surface is increased, more semiconductor packages can be manufactured and singulated in one process step, which reduces costs and processing time.

Abstract: An electronic package and method for manufacturing is provided. The package includes an electronic component having a terminal, a solidified molding compound encapsulating the electronic component, a lead including an inner and a mounting portion. The molding compound includes a first recess at or near a perimeter of a bottom surface of the mounting portion, exposing a portion of a bottom surface of the inner portion arranged near the mounting portion, and/or a second recess at the perimeter of the bottom surface of the mounting portion, the second recess exposing a portion of a side surface of the mounting portion extending between the top and the bottom surface of the mounting portion. The package provides more exposed lead space for a larger solder covering area using the first and/or second recess. Thus, solder strain accumulation is reduced or mitigated, and reliability of the electronic package can be enhanced.

Abstract: A method for producing a semiconductor package includes providing a lead frame and a bond pad with a space therebetween. The frame is provided with a die bonded thereon and a die pad. The die, the pad, a part of the frame, a part of the bond pad and the space between the frame and the bond pad are encapsulated. Part of the first encapsulation is removed to create a cavity having a bottom surface including an exposed surface of the die, an exposed surface of the pad, an exposed surface of the bond pad and a connecting region between the exposed surface of the pad and the bond pad. The cavity is partly filled with an electrically conductive paste. The electrically conductive paste is cured to obtain an interconnect between the die pad and the bond pad. The interconnect is encapsulated.

Abstract: A beverage preparation system and a method for preparing a beverage thereby, which includes at least one ingredient container for containing an ingredient; a dispenser for dispensing said ingredient from said at least one ingredient container for preparation of a beverage; a controller for controlling the operation of the dispense; and a wireless communication module associated with the controller for receiving instructions from a remote device via wireless communication to exercise control via the controller upon the dispenser for reserving a specific portion of said ingredient in the ingredient container.

Abstract: A multiple access slotted wireless communication system comprising a plurality of terminals and a multi-access receiver is described. The multi-access receiver can decode multiple transmissions in each slot of a frame from terminals in its field of view. Each terminal has an active state for transmitting and an inactive state. After receiving acknowledgement of a successful transmission by the terminal, the terminal enters the inactive state for at least a transmission delay time. This may be the remaining time that the terminal is in the field of view of the multi-access receiver. This may be achieved by the terminal using a probability of transmission to determine whether or not to transmit in the next frame. The terminal may also be configured to select the slot in a frame, and this may be based upon information such as which slots were acknowledged. The receiver may use compression to transmit acknowledgement messages.

Abstract: This invention involves with a kind of coffee machine, especially involves with a kind of automatic coffee grinding capsule making machine. The machine consists of the base, automatic rotating operation platform, coffee cup unloading device, coffee bean grinding device, coffee powder temporary storage device, powder tamping and removal device, coffee cap unloading device and capping device; the said automatic rotating operation platform is provided at the said base; the said automatic rotating operation platform can rotate based on the coffee capsule making status. This invention discloses the non-industrial and automatic coffee capsule maker that integrates coffee bean grinding, powder tamping and injection for capsule and capsule capping and improves the licensed process of such maker. This invention has more compact structure, smaller volume and lower cost, and can be operated simply and conveniently.

Abstract: This disclosure relates to methods for determining pH and also calcium (Ca2+) concentration or chloride (Cl?) concentration in biological samples. More particularly, this disclosure relates to methods capable of simultaneously determining pH and Ca2+ concentration, or pH and Cl? concentration using nucleic acid complexes.

Abstract: A multiple access slotted wireless communication system comprising a plurality of terminals and a multi-access receiver is described. The multi-access receiver can decode multiple transmissions in each slot of a frame from terminals in its field of view. Each terminal has an active state for transmitting and an inactive state. After receiving acknowledgement of a successful transmission by the terminal, the terminal enters the inactive state for at least a transmission delay time. This may be the remaining time that the terminal is in the field of view of the multi-access receiver. This may be achieved by the terminal using a probability of transmission to determine whether or not to transmit in the next frame. The terminal may also be configured to select the slot in a frame, and this may be based upon information such as which slots were acknowledged. The receiver may use compression to transmit acknowledgement messages.

Abstract: Planning cell site handoffs using a navigation route. The navigation route is compared to the location of cell sites to predict the arrival time of a mobile device into each cell. Cell sites are selected based on the navigation route and user activity. Handoff between cells sites are scheduled in advance based on the navigation route.

Abstract: Planning cell site handoffs using a navigation route. The navigation route is compared to the location of cell sites to predict the arrival time of a mobile device into each cell. Cell sites are selected based on the navigation route and user activity. Handoff between cells sites are scheduled in advance based on the navigation route.

Abstract: An electronic device including a die and at least one lead. The electronic device further includes a corresponding at least one connector, each connector for connecting the die to a corresponding lead or leads, and each connector having a first end disposed in bondable proximity to a complementary surface of the corresponding lead and a second end disposed in bondable proximity to a complementary surface of the die. An end portion of at least one of the first end and second end has a formation, the formation in combination with the complementary surface of one, or both, of the respective lead or the die defining therebetween a first region and at least a second region configured to attract by capillary action an electrically conductive bonding material to consolidate therein.