Abstract: Consistent with an example embodiment, a semiconductor device comprises a device die having bond pads providing connection to device die circuitry. The semiconductor device includes a built-up substrate lead frame having, a sub-structure of I/O terminals and a die attach area, the I/O terminals and die attach area enveloped in a molding compound, the die attach area having exposed areas to facilitate device die attachment thereon and the terminal I/O terminals providing connection to the device die bond pads; connection traces electrically couple the I/O terminals with one another, said connection traces having facilitated electroplating of exposed vertical surfaces of the I/O terminals during assembly, said connection traces being severed after assembly. An envelope of molding compound encapsulates the device die onto the built-up substrate lead frame.

Abstract: The present invention relates to a wireless communication system and a method thereof. The wireless communication system comprises a signal encoding module for encoding a preset high-frequency audio signal frequency according to a preset encoding rule, and creating an encoding library for storing the code; a signal sampling module for sampling a high-frequency audio signal produced by a high-frequency audio signal generating device; a signal transformation module for performing Fourier transformation on the sampled audio signal firstly to transform the audio signal into frequencies, acquiring a main frequency from the transformed frequencies, and storing the acquired main frequency; a signal decoding module for decoding the main frequency into a preset code according to the code in the library; and an output module for outputting the decoded code. The wireless communication system and the method of the present invention do not need hardware supports, thereby reducing the cost.

Abstract: An electronic device has a first surface, a second surface opposite to the first surface, and sidewalls located between and adjoining the first and second surfaces. The electronic device includes contact pads on the first surface. The contact pads extend from the first surface to adjoining sidewalls, and abut the sidewalls.

Abstract: Consistent with an example embodiment, a semiconductor device comprises a device die having bond pads providing connection to device die circuitry. The semiconductor device includes a built-up substrate lead frame having, a sub-structure of I/O terminals and a die attach area, the I/O terminals and die attach area enveloped in a molding compound, the die attach area having exposed areas to facilitate device die attachment thereon and the terminal I/O terminals providing connection to the device die bond pads; connection traces electrically couple the I/O terminals with one another, said connection traces having facilitated electroplating of exposed vertical surfaces of the I/O terminals during assembly, said connection traces being severed after assembly. An envelope of molding compound encapsulates the device die onto the built-up substrate lead frame.

Abstract: A tamper resistant lock. A lock has a lock housing with housing indentation. A cylinder is rotatably housed within the housing. A locking pin is connected to the cylinder and is inserted into the housing indentation when the lock is in a locked position and the locking pin is clear of the housing indentation when the lock is in an unlocked position. An anti-tampering mechanism is positioned between the housing and the cylinder. The anti-tampering mechanism receives a user's key and also includes a relative motion hole. A key extension portion is rotatably inserted inside the anti-tampering mechanism body and includes a relative motion indentation. The key extension portion is keyed to the cylinder. A lock ball is inserted into the relative motion hole and the relative motion indention, thereby preventing relative motion between the anti-tampering mechanism body and the key extension portion.

Abstract: An electrical mechanical locking device. A lock has an outer shell with an indentation. An inner body is rotatably housed within the outer shell. A contact pin is connected to the inner body. A printed circuit board frame is rigidly connected to the inner body. A printed circuit board is attached to the printed circuit board frame. A driver arm support bracket is rigidly connected to the printed circuit board frame. A lock microprocessor is connected to the printed circuit board and electrically connected to the contact pin. The lock microprocessor is connected to a key identification code verification database. An electrical actuator is electrically connected to the lock microprocessor. A driver arm is pivotally connected to the driver arm support bracket. The electrical actuator is connected to the driver arm. A jam plate is connected to the driver arm. A jam plate return spring is connected to the jam plate and the printed circuit board frame.

Abstract: A method of forming semiconductor devices on a leadframe structure. The leadframe structure comprising an array of leadframe sub-structures each having a semiconductor die arranged thereon. The method comprises; providing electrical connections between terminals of said lead frame sub-structures and said leadframe structure; encapsulating said leadframe structure, said electrical connections and said terminals in an encapsulation layer; performing a first series of parallel cuts extending through the leadframe structure and the encapsulation layer to expose a side portion of said terminals; electro-plating said terminals to form metal side pads; and performing a second series of parallel cuts angled with respect to the first series of parallel cuts, the second series of cuts extending through the lead frame structure and the encapsulation layer to singulate a semiconductor device from the leadframe structure.

Abstract: A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also includes a semiconductor substrate. The device further includes a first contact located on a first surface of the substrate. The device also includes a second contact located on a second surface of the substrate. The first surface of the substrate is mounted on the first surface of the heat sink for electrical and thermal conduction between the heat sink and the substrate via the first contact. The second surface of the substrate is mountable on a surface of a carrier.

Abstract: Consistent with an example embodiment, there is leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon. There are at least five I/O terminals wherein each of said terminals comprise a respective metal side pad wherein the respective metal side pad is disposed in a recess. A feature of this embodiment is that the each of the side pads is electroplated. The electroplated side pads accept solder and the solder menisci are contained by the recesses.

Abstract: A safe. A safe lid is connected to a safe box via a hinge attachment. The safe is locked shut by utilization of a latch assembly. A Nitinol wire is connected to a latch assembly opening device. The latch assembly opening device is connected to the latch assembly. A user can open the safe by inputting the correct pass code into a keypad. An electrical signal is then transferred to the Nitinol wire causing the Nitinol wire to shorten. The shortening of the Nitinol wire causes the latch assembly opening device to open the latch assembly. In a preferred embodiment a key lock is also configured to control the latch assembly opening device and the key lock may be used as another method to open the safe.

Abstract: Consistent with an example embodiment, a semiconductor device comprises a device die having bond pads providing connection to device die circuitry. The semiconductor device includes a QFN package (quad-flat-pack no-leads) built-up substrate lead frame having, a sub-structure of I/O terminals and a die attach area, the I/O terminals and die attach area enveloped in a molding compound; the die attach area has exposed areas to facilitate device die attachment thereon and the terminal I/O terminals provide connection to the device die bond pads. I/O terminals are electrically coupled with one another and to the die attach area with connection traces. The coupled I/O terminals and connection traces facilitate electroplating of exposed vertical surfaces of the I/O terminals during assembly, said connection traces being severed after assembly. Molding compound encapsulates the device die on the built-up substrate lead frame.

Abstract: Consistent with an example embodiment, there is a leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon. At least five I/O terminals each of said terminals comprise a respective metal side pad; and the respective metal side pad has a step profile. A feature of this embodiment is that these metal side pads, having a step profile, are electroplated to enhance their solderability.

Abstract: Consistent with an example embodiment, there is leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon. There are at least five I/O terminals wherein each of said terminals comprise a respective metal side pad wherein the respective metal side pad is disposed in a recess. A feature of this embodiment is that the each of the side pads is electroplated. The electroplated side pads accept solder and the solder menisci are contained by the recesses.

Abstract: A method of forming semiconductor devices on a leadframe structure. The leadframe structure comprising an array of leadframe sub-structures each having a semiconductor die arranged thereon. The method comprises; providing electrical connections between terminals of said lead frame sub-structures and said leadframe structure; encapsulating said leadframe structure, said electrical connections and said terminals in an encapsulation layer; performing a first series of parallel cuts extending through the leadframe structure and the encapsulation layer to expose a side portion of said terminals; electro-plating said terminals to form metal side pads; and performing a second series of parallel cuts angled with respect to the first series of parallel cuts, the second series of cuts extending through the lead frame structure and the encapsulation layer to singulate a semiconductor device from the leadframe structure.

Abstract: A safe. A safe lid is connected to a safe box via a hinge. A fascia assembly is connected to the safe lid and a latch assembly is connected to the safe box. The fascia assembly includes a keypad and a fascia assembly locking groove. The latch assembly includes a latch having a fascia assembly locking tab and a lock latch locking tab. The latch assembly also has a lock lever pivotally connected to the latch and the latch assembly. A motor in the latch assembly receives electrical inputs from the keypad. The latch assembly also has a key lock. A lock latch is connected to and controlled by the motor and the key lock. A lock latch reset spring is connected to the lock latch. The safe is locked when the fascia assembly locking tab is inserted into the fascia assembly locking groove and also when the lock latch locking tab is secured behind the lock latch. The safe is unlocked by entering a pass code into the key pad. This caused an electrical signal to be transmitted to the motor.

Abstract: A safe. A safe lid is connected to a safe box via a hinge attachment. The safe is locked shut by utilization of a latch assembly. A Nitinol wire is connected to a latch assembly opening device. The latch assembly opening device is connected to the latch assembly. A user can open the safe by inputting the correct pass code into a keypad. An electrical signal is then transferred to the Nitinol wire causing the Nitinol wire to shorten. The shortening of the Nitinol wire causes the latch assembly opening device to open the latch assembly. In a preferred embodiment a key lock is also configured to control the latch assembly opening device and the key lock may be used as another method to open the safe.

Abstract: A multiple access slotted wireless communication system comprising a plurality of terminals and a multi-access receiver is described. The multi-access receiver can decode multiple transmissions in each slot of a frame from terminals in its field of view. Each terminal has an active state for transmitting and an inactive state. After receiving acknowledgement of a successful transmission by the terminal, the terminal enters the inactive state for at least a transmission delay time. This may be the remaining time that the terminal is in the field of view of the multi-access receiver. This may be achieved by the terminal using a probability of transmission to determine whether or not to transmit in the next frame. The terminal may also be configured to select the slot in a frame, and this may be based upon information such as which slots were acknowledged. The receiver may use compression to transmit acknowledgement messages.

Abstract: The present invention relates to a wireless communication system and a method thereof. The wireless communication system comprises a signal encoding module for encoding a preset high-frequency audio signal frequency according to a preset encoding rule, and creating an encoding library for storing the code; a signal sampling module for sampling a high-frequency audio signal produced by a high-frequency audio signal generating device; a signal transformation module for performing Fourier transformation on the sampled audio signal firstly to transform the audio signal into frequencies, acquiring a main frequency from the transformed frequencies, and storing the acquired main frequency; a signal decoding module for decoding the main frequency into a preset code according to the code in the library; and an output module for outputting the decoded code. The wireless communication system and the method of the present invention do not need hardware supports, thereby reducing the cost.

Abstract: A shopping guide method includes steps: transmitting a shopping guide information to a portable device in response to a request from the portable device produced by scanning an application scan code which includes an identification code (ID) of a salesperson; and associating a current purchase record of the consumer with the ID of the salesperson when the consumer makes an online purchase via the shopping guide information.

Abstract: A piece of clothing capable of advertising includes a front side and a rear side. The front side and the rear side includes a scan code component displaying a scan code which can be scanned by an electronic device.