Patents by Inventor Ho-Ming Tong

Ho-Ming Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and heat sink assembly
    Patent number: 5057909
    Abstract: In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.
    Type: Grant
    Filed: January 28, 1991
    Date of Patent: October 15, 1991
    Assignee: International Business Machines Corporation
    Inventors: Lawrence S. Mok, Robert E. Schwall, Ho-Ming Tong
  • Apparatus for temperature control of electronic devices
    Patent number: 4970868
    Abstract: The superior thermal conductivity of immersion cooling combined with the service convenience of conduction cooling is provided through the use of unitary thermal transfer replaceable units positioned beneath a refrigeration source. Each unit contains electronic devices in a thermal transfer fluid. The unit construction permits replaceability in service without exposing a central fluid reservoir or opening a refrigerator.
    Type: Grant
    Filed: June 23, 1989
    Date of Patent: November 20, 1990
    Assignee: International Business Machines Corporation
    Inventors: Kurt R. Grebe, Robert E. Schwall, Ho-Ming Tong