Patents by Inventor Ho-Sup Kim
Ho-Sup Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220246329Abstract: Proposed is a high temperature superconducting wire manufacturing method and a high temperature superconducting wire having multiple superconducting layers formed by applying the method. The method includes a stacking process in which a pair of protective layers of superconducting wires including a substrate, a superconducting layer, and the protective layer are stacked such that the protective layers face each other, a joining process in which the protective layers facing each other are diffusion joining together by thermal treatment and become a joining protective layer, an exfoliating process in which a layered structure of an upper portion of the corresponding superconducting layer is removed such that one side of the superconducting layer is exposed to the outside, and an outermost protective layer forming process in which an outer protective layer formed of the same material as the joining protective layer is formed on the upper portion of the exposed superconducting layer.Type: ApplicationFiled: March 23, 2022Publication date: August 4, 2022Inventors: Hong Soo HA, Gwan Tae KIM, Hyun Woo NOH, Ho Sup KIM, Sang Soo OH
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Publication number: 20210265554Abstract: Proposed are a thin film having single crystallinity and an excellent crystal orientation property, a method of manufacturing the same, and a semiconductor device, a battery device, a superconducting wire, and a superconducting article including the thin film having single crystallinity. The technical gist of the present disclosure includes a thin film having single crystallinity, which is formed by depositing a polycrystalline second material on an upper portion of a substrate including a polycrystalline first material and which has a crystal orientation property satisfying the following Relational Expression 1 at a grain boundary, a method of manufacturing the same, and a semiconductor device, a battery device, a superconducting wire, and a superconducting article including the thin film having single crystallinity. 0°<FWHM2?3°??[Relational Expression 1] (FWHM2 is a full width at half maximum of a distribution curve of a misorientation angle at the grain boundary of the thin film).Type: ApplicationFiled: April 30, 2021Publication date: August 26, 2021Inventors: Ho Sup KIM, Sang Soo OH, Hong Soo HA, Jeong Hyeon JO, Gwan Tae KIM, Hyun Woo NOH
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Patent number: 8900365Abstract: Disclosed is a deposition apparatus for depositing a specific substance on an elongate substrate such as an elongate strip of tape or film. The apparatus includes a vacuum chamber, supply reel and the for reel for supplying elongate substrate in rolled form, a drum, disposed in the vacuum chamber, the drum having a helically-shaped guide groove formed along an outer surface of the drum for receiving the elongate substrate supplied from the supply reel to be wound in the guide groove and to subsequently feed the elongate substrate to a retreat reel to wind thereon upon rotation of the drum, and a deposition source material for depositing a material onto a surface of the elongate substrate which is wound on the drum.Type: GrantFiled: August 6, 2007Date of Patent: December 2, 2014Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Sup Kim
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Patent number: 8633137Abstract: Disclosed herein is a high-temperature superconducting tape, including: a substrate; a buffer layer formed on the substrate; and a high-temperature superconducting layer formed on the buffer layer, wherein the substrate is made of SUS310s or stainless steel containing 0.01-1% of silicon (Si) and 1-5% of molybdenum (Mo) and has an average metal crystal grain size of 12 ?m or less, and the high-temperature superconducting layer is made of a ReBCO (ReBa2Cu3O7, Re=Nd, Sm, Eu, Gd, Dy, Ho, Y)-based superconductive material. The high-temperature superconducting tape is advantageous with the result that a high-grade superconducting layer can be deposited on the thin buffer layer and thus the critical current density of the high-temperature superconducting tape can be improved, thereby remarkably improving the characteristics of the high-temperature superconducting tape.Type: GrantFiled: September 7, 2011Date of Patent: January 21, 2014Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Ho Sup Kim
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Publication number: 20130159172Abstract: The present invention relates to a recognition means for a targeted recipient who will receive payments, and to an online remittance system and method that perform micro-payment by scanning or directly entering the recognition means, so that a predetermined amount of money can be automatically remitted to a targeted tip recipient or a targeted support recipient. In a method of providing a tipping service in a remittance management server, a tipping payment request signal including at least one of information about a targeted tip recipient and information about recognition means is received. A payment account of the targeted tip recipient is checked using the targeted tip recipient information or the recognition means information. An amount of money corresponding to amount information included in the tipping payment request signal is paid to the payment account of the targeted tip recipient using payment means selected by a customer.Type: ApplicationFiled: December 11, 2012Publication date: June 20, 2013Inventor: Ho Sup Kim
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Patent number: 8367585Abstract: Disclosed herein is a superconducting strip having a metal coating layer and a method of manufacturing the superconducting strip.Type: GrantFiled: July 22, 2008Date of Patent: February 5, 2013Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Sup Kim
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Patent number: 8353257Abstract: Disclosed herein is a deposition apparatus with a guide roller for a long superconducting tape. The deposition apparatus has a supply reel which is provided in a vacuum chamber and rotated to supply the tape, a feed and deposition unit which is spaced apart from the supply reel and vacuum deposits a superconducting layer on the tape while feeding the tape, and a collection reel which is spaced apart from the feed and deposition unit and is rotated to collect the vacuum-deposited tape.Type: GrantFiled: July 22, 2008Date of Patent: January 15, 2013Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Sup Kim
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Publication number: 20120283105Abstract: A rolled superconducting article includes: a cylindrical bobbin having a post in a cylindrical shape; a superconducting strip wound on the cylindrical bobbin in a rolled shape with a predetermined tension applied, wherein the superconducting strip is formed of a superconducting thin film, which is coated with a metal coating layer on a facing surface of the superconducting thin film, and a stabilizing substrate wound on the superconducting strip, wherein the stabilizing substrate is coated with a metal coating layer on a facing surface of the stabilizing substrate; an anti-bonding substrate wound on an outer surface of the stabilizing substrate with a predetermined tension applied; wherein the superconducting thin film is thermally adhered to the stabilizing substrate by heat-treating the rolled superconducting strip with the anti-bonding substrate wound therearound.Type: ApplicationFiled: May 31, 2012Publication date: November 8, 2012Applicant: Korea Electrotechnology Research InstituteInventors: Hong Soo HA, Sang Soo OH, Dong Woo HA, Kyu Jung SONG, Rock Kil KO, Ho Sup KIM
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Publication number: 20120252680Abstract: Disclosed herein is a high-temperature superconducting tape, including: a substrate; a buffer layer formed on the substrate; and a high-temperature superconducting layer formed on the buffer layer, wherein the substrate is made of SUS310s or stainless steel containing 0.01-1% of silicon (Si) and 1-5% of molybdenum (Mo) and has an average metal crystal grain size of 12 ?m or less, and the high-temperature superconducting layer is made of a ReBCO (ReBa2Cu3O7, Re=Nd, Sm, Eu, Gd, Dy, Ho, Y)-based superconductive material. The high-temperature superconducting tape is advantageous with the result that a high-grade superconducting layer can be deposited on the thin buffer layer and thus the critical current density of the high-temperature superconducting tape can be improved, thereby remarkably improving the characteristics of the high-temperature superconducting tape.Type: ApplicationFiled: September 7, 2011Publication date: October 4, 2012Applicant: Korea Electrotechnology Research InstituteInventors: Hong Soo HA, Sang Soo Oh, Ho Sup Kim
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Patent number: 8043716Abstract: Disclosed herein is a gradient thin film, formed on a substrate by simultaneously depositing different materials on the substrate using a plurality of thin film deposition apparatuses provided in a vacuum chamber, wherein the gradient thin film is formed such that the composition thereof is continuously changed depending on the thickness thereof by deposition control plates provided in the path through which the different materials move to the substrate. The gradient thin film is advantageous in that the thin film is formed by simultaneously depositing different materials using various deposition apparatuses, so that the composition thereof is continuously changed depending on the thickness thereof, with the result that the physical properties of a thin film are easily controlled and the number of deposition processes is decreased, and thus processing time and manufacturing costs are decreased, thereby improving economic efficiency.Type: GrantFiled: July 22, 2008Date of Patent: October 25, 2011Assignee: Korea Electrotechnology Research InstituteInventors: Ho Sup Kim, Sang Soo Oh, Tae Hyung Kim, Dong Woo Ha, Kyu Jung Song, Hong Soo Ha, Rock Kil Ko, Nam Jin Lee
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Patent number: 8034746Abstract: Disclosed herein is a method of manufacturing round wire using superconducting tape, including the steps of: slitting superconducting tape into superconducting tape strips; silver-coating the slit superconducting tape strips; laminating the silver-coated superconducting tape strips to form a superconducting tape laminate having a square cross-section; holding the superconducting tape laminate; heat-treating the fixed superconducting tape laminate to cause diffusion junction between silver; and copper-plating the heat-treated superconducting tape laminate to have a circular section.Type: GrantFiled: June 30, 2009Date of Patent: October 11, 2011Assignee: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Rock Kil Ko, Ho Sup Kim
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Patent number: 7845548Abstract: The present invention is directed to a lamination method. The lamination method includes making the interior of a process chamber a vacuum, the process chamber including a first and a second metal sheet, supplying the first and the second metal sheets, injecting a bonding material between the first and the second metal sheets supplied, bonding the first and the second metal sheets with each other, and heating the bonded metal sheets. The first metal sheet is a superconductive tape, and the second metal sheet is stabilization metal tape.Type: GrantFiled: October 6, 2009Date of Patent: December 7, 2010Inventors: Ho-Sup Kim, Sang-Soo Oh, Tae-Hyung Kim, Kyu-Jeong Song, Hong-Soo Ha, Rock-Kil Ko
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Publication number: 20100137142Abstract: Disclosed herein is a method of manufacturing round wire using superconducting tape, including the steps of: slitting superconducting tape into superconducting tape strips; silver-coating the slit superconducting tape strips; laminating the silver-coated superconducting tape strips to form a superconducting tape laminate having a square cross-section; holding the superconducting tape laminate; heat-treating the fixed superconducting tape laminate to cause diffusion junction between silver; and copper-plating the heat-treated superconducting tape laminate to have a circular section.Type: ApplicationFiled: June 30, 2009Publication date: June 3, 2010Applicant: Korea Electrtechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Rock Kil Ko, Ho Sup Kim
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Publication number: 20100022398Abstract: The present invention is directed to a lamination method. The lamination method includes making the interior of a process chamber a vacuum, the process chamber including a first and a second metal sheet, supplying the first and the second metal sheets, injecting a bonding material between the first and the second metal sheets supplied, bonding the first and the second metal sheets with each other, and heating the bonded metal sheets. The first metal sheet is a superconductive tape, and the second metal sheet is stabilization metal tape.Type: ApplicationFiled: October 6, 2009Publication date: January 28, 2010Inventors: HO-SUP KIM, Sang-Soo Oh, Tae-Hyung Kim, Kyu-Jeong Song, Hong-Soo Ha, Rock-Kil Ko
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Publication number: 20090110952Abstract: Disclosed herein is a gradient thin film, formed on a substrate by simultaneously depositing different materials on the substrate using a plurality of thin film deposition apparatuses provided in a vacuum chamber, wherein the gradient thin film is formed such that the composition thereof is continuously changed depending on the thickness thereof by deposition control plates provided in the path through which the different materials move to the substrate. The gradient thin film is advantageous in that the thin film is formed by simultaneously depositing different materials using various deposition apparatuses, so that the composition thereof is continuously changed depending on the thickness thereof, with the result that the physical properties of a thin film are easily controlled and the number of deposition processes is decreased, and thus processing time and manufacturing costs are decreased, thereby improving economic efficiency.Type: ApplicationFiled: July 22, 2008Publication date: April 30, 2009Applicant: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTEInventors: Ho Sup KIM, Sang Soo OH, Tae Hyung KIM, Dong Woo HA, Kyu Jung SONG, Hong Soo HA, Rock Kil KO, Nam Jin LEE
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Publication number: 20090107395Abstract: Disclosed herein is a deposition apparatus with a guide roller for a long superconducting tape. The deposition apparatus has a supply reel which is provided in a vacuum chamber and rotated to supply the tape, a feed and deposition unit which is spaced apart from the supply reel and vacuum deposits a superconducting layer on the tape while feeding the tape, and a collection reel which is spaced apart from the feed and deposition unit and is rotated to collect the vacuum-deposited tape.Type: ApplicationFiled: July 22, 2008Publication date: April 30, 2009Applicant: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Sup Kim
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Publication number: 20090111700Abstract: Disclosed herein is a superconducting strip having a metal coating layer and a method of manufacturing the superconducting strip.Type: ApplicationFiled: July 22, 2008Publication date: April 30, 2009Applicant: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Sup Kim
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Publication number: 20080220976Abstract: A method and apparatus for manufacturing superconducting tape through an integrated process, including the steps of: heat-treating a substrate wound on a drum in a reaction chamber; continuously depositing components, constituting a buffer layer, a superconducting layer, a contact resistance layer, and a protective layer of the superconducting tape, which are supplied from a deposition chamber, on the substrate; and heat-treating the substrate deposited with the components.Type: ApplicationFiled: September 28, 2007Publication date: September 11, 2008Applicant: Korea Electrotechnology Research InstituteInventors: Ho Sup Kim, Sang Soo Oh, Hong Soo Ha, Kyu Jung Song, Dong Woo Ha, Rock Kil Ko
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Publication number: 20080067273Abstract: Disclosed is a long-tape deposition apparatus for depositing specific substance on superconductive tape. The apparatus includes a drum having a helically-shaped guide groove formed on the outer surface thereof and a strip of tape wound along the guide groove and disposed in a vacuum chamber, a deposition source disposed to be distanced from the drum, a supply reel and a retreat reel disposed at respective sides of a shaft of the drum for supply and retreat of the tape, respectively, in which when the drum rotates, specific substance from the deposition source is deposited on the surface of the tape and at the same time the tape is continuously supplied and retreated by the supply reel and the retreat reel, and a slip-roller installed to extend along longitudinal direction of the drum, to be near the circumferential surface of the drum and to protrude from the outer surface of the drum, the slip-roller which rotates along moving direction of the tape enabling the tape to slip over the guide groove of the drum.Type: ApplicationFiled: August 6, 2007Publication date: March 20, 2008Applicant: Korea Electrotechnology Research InstituteInventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Kyu Jung Song, Rock Kil Ko, Ho Sup Kim
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Publication number: 20070057017Abstract: The present invention is directed to a lamination apparatus and a lamination method using the same. The lamination apparatus includes a process chamber and a pump connected with one side of the process chamber for making the interior of the process chamber a vacuum. Inside the process chamber, a first and a second supply unit, an injection unit, and a bonding unit are provided. The first and the second supply units supply a first and a second metal sheet, respectively. The injection unit injects a bonding material between the first and the second metal sheets supplied, and the bonding unit bonds the first and the second metal sheets with each other. According to the present invention, a bonding force of the bonding material may be enhanced and various kinds of bonding materials may be used.Type: ApplicationFiled: March 22, 2006Publication date: March 15, 2007Inventors: Ho-Sup Kim, Sang-Soo Oh, Tae-Hyung Kim, Kyu-Jeong Song, Hong-Soo Ha, Rock-Kil Ko