Abstract: A semiconductor substrate including a carrier, a first conductive layer and a second conductive layer is disclosed. The carrier has a first surface, a second surface, and a concave portion used for receiving a semiconductor element. The first conductive layer is embedded in the first surface and forms a plurality of electric-isolated package traces. The second conductive layer is embedded in the second surface and electrically connected to the first conductive layer. The semiconductor substrate can be applied to a semiconductor package for carrying a semiconductor chip, and combined with a filling structure for fixing the chip. Furthermore, a plurality of the semiconductor substrates can be stacked and connected via adhesive layers, so as to form a semiconductor device with a complicated structure.

Abstract: The subject disclosure relates to solar energy collection and use in communications systems and to enhancements thereof. In an aspect, dual function antennas are disclosed that can simultaneously function as an antenna and as a solar energy collection system. In further aspects, disclosed embodiments can focus incident solar radiation to increase output voltage of conventional solar cells. Measured and simulated results demonstrate various aspects of the subject disclosure.

Abstract: Provided is a circuit for an electronic device having a non-planar transparent resonator. The transparent resonator is mounted on said circuit so as to at least partially occupy a footprint of another component of the circuit. The transparent resonator forms part of a light pathway on said circuit for transmitting light to or from said another component. Also provided is a transparent dielectric resonator antenna (DRA) for optical applications. Since the DRA is transparent, it can let light pass through itself and, thus, the light can be utilized by an optical part of a system or device. The transparent DRA can be placed on top of a solar cell. Since the DRA does not block the light, the light can reach the solar cell panel and power can be generated for the system or device. The system or device so obtained is very compact because no extra footprint is needed within the system or device for the DRA. It finds application in compact wireless applications that need a self-sustaining power device.

Abstract: Provided is a circuit for an electronic device having a non-planar transparent resonator. The transparent resonator is mounted on said circuit so as to at least partially occupy a footprint of another component of the circuit. The transparent resonator forms part of a light pathway on said circuit for transmitting light to or from said another component. Also provided is a transparent dielectric resonator antenna (DRA) for optical applications. Since the DRA is transparent, it can let light pass through itself and, thus, the light can be utilized by an optical part of a system or device. The transparent DRA can be placed on top of a solar cell. Since the DRA does not block the light, the light can reach the solar cell panel and power can be generated for the system or device. The system or device so obtained is very compact because no extra footprint is needed within the system or device for the DRA. It finds application in compact wireless applications that need a self-sustaining power device.

Abstract: An aesthetic dielectric antenna (e.g., a dielectric resonator antenna) includes an aesthetically shaped decoration having at least one dielectric with a dielectric constant of more than one. A waveguide, feedline, probe or other means of excitation is electronically coupled to the dielectric to emit a radiation pattern for carrying analog or digital information.

Abstract: A trocar sleeve for minimally invasive surgery, having a first sleeve part, which has essentially the shape of a straight tubular piece with a longitudinal axis, and having a second sleeve part, which at least partly surrounds the first sleeve part in close contiguity and is movable during use with respect to the first sleeve part. The mobility of the second sleeve part in relation to the first sleeve part consists essentially only in rotatability of the second sleeve part around the first sleeve part, and in addition the first sleeve part and the second sleeve part each comprise on their distal axial ends a flange part that extends radially outward at an angle of less than 180 degrees from the respective sleeve part.

Abstract: A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a carrier. The carrier has a first surface and a second surface opposite to the first surface. The carrier includes an inner core layer and an exterior clad layer, and the inner core layer is covered by the exterior clad layer.

Abstract: A conductive carrier having a first surface and a second surface is provided. The conductive trace layer is formed on the second surface of the conductive carrier. A conductive stud layer is formed on the conductive trace layer. A dielectric layer is formed on the conductive layer to encapsulate the conductive trace layer and the conductive stud layer. The conductive stud layer is exposed. A plating conductive layer is formed to envelop the conductive carrier, the dielectric layer and the exposed end of the conductive stud layer. A cavity is formed on the conductive carrier, wherein the conductive trace layer and the dielectric layer are exposed in the cavity. A surface finishing is formed on at least an exposed portion of the conductive stud layer. The plating conductive layer is removed.

Abstract: A method for allowing short-ranged communication devices to communicate with each other using the Internet. Cell servers are provided in first and second zones linked to the Internet and adapted for transmitting voice and other digital data over the Internet such as using VoIP. The method includes registering users of short-range enabled devices, such as Bluetooth cell phones, with a communication system and storing a device identifier along with a user ID and password. A contact list is stored for each registered user. The method includes a registered user entering a cell serviced by a server, the server discovering the user's device, logging the user into the system based on the device identifier and an entered user ID and password, receiving a communication request to chat with one of the listed contacts, and establishing a communication session using time previously awarded to the user for receiving marketing content.

Abstract: A method for fabricating a flip-chip semiconductor package. The method comprises processing a semiconductor device, for example a semiconductor chip and processing a device carrier, for example a substrate. The semiconductor device comprises bump structures formed on a surface thereof. The substrate comprises bond pads formed on a surface thereof. Processing of the semiconductor chip results in heating of the semiconductor chip to a chip process temperature. The chip process temperature melts solder portions on the bump structures Processing of the substrate results in heating of the substrate to a substrate process temperature. The method comprises spatially aligning the semiconductor chip in relation to the substrate to correspondingly align the bump structures in relation to the bump pads. The semiconductor chip is then displaced towards the substrate for abutting the bump structures of the semiconductor chip with the bond pads of the substrate to thereby form bonds therebetween.

Abstract: A method for allowing short-ranged communication devices to communicate with each other using the Internet. Cell servers are provided in first and second zones linked to the Internet and adapted for transmitting voice and other digital data over the Internet such as using VoIP. The method includes registering users of short-range enabled devices, such as Bluetooth cell phones, with a communication system and storing a device identifier along with a user ID and password. A contact list is stored for each registered user. The method includes a registered user entering a cell serviced by a server, the server discovering the user's device, logging the user into the system based on the device identifier and an entered user ID and password, receiving a communication request to chat with one of the listed contacts, and establishing a communication session using time previously awarded to the user for receiving marketing content.

Abstract: A semiconductor package, a substrate and a manufacturing method thereof are provided. The substrate comprises a conductive carrier, a first metal layer and a second metal layer. The first metal layer is formed on the conductive carrier and comprises an lead pad having an upper surface. The second metal layer is formed on the first metal layer and comprises a bond pad. The bond pad overlaps and is in contact with the upper surface of the first metal layer. The upper surface of the lead pad is partially exposed. A part of the bond pad overhang outward from the edge of the lead pad.

Abstract: The subject disclosure relates to solar energy collection and use in communications systems and to enhancements thereof. In an aspect, dual function antennas are disclosed that can simultaneously function as an antenna and as a solar energy collection system. In further aspects, disclosed embodiments can focus incident solar radiation to increase output voltage of conventional solar cells. Measured and simulated results demonstrate various aspects of the subject disclosure.

Abstract: The subject disclosure relates to solar energy collection and use in communications systems and to enhancements thereof. In an aspect, dual function antennas are disclosed that can simultaneously function as an antenna and as a solar energy collection system. In further aspects, disclosed embodiments can focus incident solar radiation to increase output voltage of conventional solar cells. Measured and simulated results demonstrate various aspects of the subject disclosure.

Abstract: A semiconductor package, a method for manufacturing the semiconductor package, a trace substrate and a method for manufacturing the trace substrate are provided. The semiconductor package includes a trace substrate, a chip and a plurality of wires. The trace substrate includes a plurality of trace, a plurality of conductive studs, a plurality of traces pads and a trace modling compound. The conductive studs are formed on the lower surfaces of the traces. The trace modling compound encapsulates the conductive studs and the trace, and exposes the lower surfaces of the conductive studs and the upper surfaces of the traces. The chip is disposed on the trace substrate, and the wires electrically connect the chip and the trace pads. The trace pads are not overlapping to the conductive studs.

Abstract: A semiconductor package and a manufacturing method thereof are disclosed. The semiconductor package includes a device carrier and a stiffener structure. The device carrier includes at least one insulating layer and at least conductive layer defining at least one trace layout unit. The stiffener structure is disposed on the device carrier, surrounding the periphery of the at least one trace layout unit. The stiffener structure is disposed away from the periphery of the at least one trace layout unit, forming a cavity with the device carrier. The shape and disposition of the stiffener structure enhance the strength of the semiconductor package, impeding flexure to the semiconductor package.

Abstract: A semiconductor substrate including a carrier, a first conductive layer and a second conductive layer is disclosed. The carrier has a first surface, a second surface, and a concave portion used for receiving a semiconductor element. The first conductive layer is embedded in the first surface and forms a plurality of electric-isolated package traces. The second conductive layer is embedded in the second surface and electrically connected to the first conductive layer. The semiconductor substrate can be applied to a semiconductor package for carrying a semiconductor chip, and combined with a filling structure for fixing the chip' Furthermore, a plurality of the semiconductor substrates can be stacked and connected via adhesive layers, so as to form a semiconductor device with a complicated structure.

Abstract: A method for allowing short-ranged communication devices to communicate with each other using the Internet. Cell servers are provided in a first and second zones linked to the Internet and adapted for transmitting voice and other digital data over the Internet such as using VoIP. The method includes registering users of short-range enabled devices, such as Bluetooth cell phones, with a communication system and storing a device identifier along with a user ID and password. A contact list is stored for each registered user. The method includes a registered user entering a cell serviced by a server, the server discovering the user's device, logging the user into the system based on the device identifier and an entered user ID and password, receiving a communication request to chat with one of the listed contacts, and establishing a communication session using time previously awarded to the user for receiving marketing content.

Abstract: Provided is a circuit for an electronic device having a non-planar transparent resonator. The transparent resonator is mounted on said circuit so as to at least partially occupy a footprint of another component of the circuit. The transparent resonator forms part of a light pathway on said circuit for transmitting light to or from said another component. Also provided is a transparent dielectric resonator antenna (DRA) for optical applications. Since the DRA is transparent, it can let light pass through itself and, thus, the light can be utilized by an optical part of a system or device. The transparent DRA can be placed on top of a solar cell. Since the DRA does not block the light, the light can reach the solar cell panel and power can be generated for the system or device. The system or device so obtained is very compact because no extra footprint is needed within the system or device for the DRA. It finds application in compact wireless applications that need a self-sustaining power device.

Abstract: A method for allowing short-ranged communication devices to communicate with each other using the Internet. Cell servers are provided in a first and second zones linked to the Internet and adapted for transmitting voice and other digital data over the Internet such as using VoIP. The method includes registering users of short-range enabled devices, such as Bluetooth cell phones, with a communication system and storing a device identifier along with a user ID and password. A contact list is stored for each registered user. The method includes a registered user entering a cell serviced by a server, the server discovering the user's device, logging the user into the system based on the device identifier and an entered user ID and password, receiving a communication request to chat with one of the listed contacts, and establishing a communication session using time previously awarded to the user for receiving marketing content.