Abstract: A semiconductor device comprises a substrate that including a frontside comprising an active region and a backside opposite to the frontside, an electronic element on the active region, a frontside wiring structure electrically connected to the electronic element on the frontside of the substrate, and a backside wiring structure electrically connected to the electronic element on the backside of the substrate. The backside wiring structure includes a plurality of backside wiring patterns sequentially stacked on the backside of the substrate, and a super via pattern that intersects and extends through at least one layer of the plurality of backside wiring patterns.

Abstract: A low-loss spiral coil includes a conducting wire wound N turns of which a width of each of wires corresponding to each of sections of the conducting wire is determined by setting an entire width of the conducting wire to be a width of M sections of the conducting wire, and then determining the width of each of the wires such that a resistance of the spiral coil formed based on the width of the M sections is minimized.

Abstract: A semiconductor package includes a first chip and a second chip disposed thereon. The first chip includes a first semiconductor substrate including first and second surfaces, a first circuit layer disposed on the first surface, a first interconnection layer disposed on the first circuit layer, the first interconnection layer including a landing pad, a second interconnection layer disposed on the second surface, and a first penetration via protruding from the second interconnection layer and penetrating the first semiconductor substrate. The second chip includes a second semiconductor substrate including third and fourth surfaces, the fourth surface being closer to the first chip than the third surface, a third interconnection layer disposed on the fourth surface, a second circuit layer disposed between the third interconnection layer and the fourth surface, and a second penetration via penetrating the second semiconductor substrate and connected to the landing pad.

Abstract: A residual voltage controller and an electric compressor including the same, which aim to prevent an electric shock or an accident caused by detachment of a high voltage connector through safe interruption of a residual voltage using a plurality of switching elements. The residual voltage controller includes a high voltage connector having an interlock, an inverter part configured to receive power from the high voltage connector, a motor part electrically connected to the inverter part to be controlled, and voltage controllers connected between the high voltage connector and the inverter part in each different direction to interrupt a residual voltage of the motor part when detachment of the high voltage connector is performed before a normal stop signal.

Abstract: A watch phone and a method for handling an incoming call using the watch phone are provided. In the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. A single mode selection key selects one of the watch mode and the idle mode. A controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to.

Abstract: The present disclosure provides a semiconductor device manufacturing method that includes forming a lower chip and an upper chip, and bonding the lower chip and the upper chip to each other. The forming of the lower chip includes providing a lower substrate, sequentially forming a lower interlayer insulating film and a pre-lower adhesive film, etching portions of the pre-lower adhesive film and the lower interlayer insulating film to form a lower trench, forming, using a sputtering process, a first lower seed film and a second lower seed film. The forming of the upper chip includes providing an upper substrate, sequentially forming an upper interlayer insulating film and a pre-upper adhesive film, etching portions of the pre-upper adhesive film and the upper interlayer insulating film to form an upper trench, forming, using the sputtering process, a first upper seed film and a second upper seed film.

Abstract: A semiconductor device comprises a substrate including a first surface and a second surface opposite to each other in a first direction, an active pattern on the first surface of the substrate and extending in a second direction, a field insulating film on the first surface of the substrate and covering sidewalls of the active pattern, a power rail on the second surface of the substrate and extending in the second direction, a via trench on one side of the active pattern and penetrating through the field insulating film, and a power rail via filling the via trench and connected to the power rail, in which the power rail via includes a first sub-film formed as a single film, and a second sub-film on the first sub-film and including barrier films extending along inner sidewalls of the via trench and a filling film between the barrier films.

Abstract: A pulse measurement system of a vehicle includes at least one vehicle device and a pulse measurement apparatus. The vehicle device is configured to recognize a user who rides in the vehicle and to provide information of the user. The pulse measurement apparatus is configured to recognize the user based on the information of the user received from the at least one vehicle device, to set a frequency band of a filter to a first frequency band or a second frequency band based on information of the recognized user, and to detect pulse information of the user based on a signal extracted from the signal reflected from the user by the filter when measuring a pulse of the user.

Abstract: A watch phone and a method for handling an incoming call using the watch phone are provided. In the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. A single mode selection key selects one of the watch mode and the idle mode. A controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to.

Abstract: A semiconductor device includes: a substrate including a first face, on which an active area is formed, and a second face opposite to the first face; an electronic element formed on the active area; a front wiring structure disposed on the first face of the substrate and connected to the electronic element; a trench capacitor filling at least a portion of a back trench extending into the substrate from the second face of the substrate; a back wiring structure disposed on the second face of the substrate and connected to the trench capacitor; and a through-via extending through the substrate to electrically connect the electronic element and the back wiring structure to each other.

Abstract: A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.

Abstract: An apparatus and method for transmitting and receiving magnetic field signals in a magnetic field communication system are provided. The apparatus includes a controller configured to generate a communication signal, matching units that are configured to receive the communication signal and that respectively correspond to different matching frequencies, and loop antennas that are connected to the matching units, respectively, and that are configured to convert communication signals according to the different matching frequencies into magnetic transmission signals in the form of magnetic field energy and to transmit the magnetic transmission signals.

Abstract: A semiconductor device may include a lower structure including a first substrate, a first pad on the first substrate, and a first insulating layer enclosing the first pad, and an upper structure including a second substrate, a second pad on the second substrate, and a second insulating layer enclosing the second pad. Each of the first and second pads may include a first portion and a second portion on the first portion. The second portion may include the same metallic material as the first portion. The second portion of the first pad may be in contact with the second portion of the second pad, and the first insulating layer may be in contact with the second insulating layer.

Abstract: The present invention relates to: amphipathic compounds derived from 1,3-acetonedicarboxylate; a preparation method therefor; and a method for extracting, solubilizing, stabilizing, crystallizing or analyzing membrane proteins by using the same. In addition, the compound enables membrane proteins, which have various structures and characteristics, to be efficiently extracted from cell membranes and stably stored in an aqueous solution for a long time, compared to a conventional compound, thereby being usable in functional and structural analysis thereof. Analyzing the structure and function of membrane proteins is closely related to the development of a novel drug, and thus is one of the greatest interests in the biology and chemistry fields.

Abstract: A semiconductor device including a substrate, a wiring pattern in the substrate, a passivation layer on the substrate, the passivation layer and the substrate including a first recess penetrating a part of each of the passivation layer and the substrate and extending toward the wiring pattern, a post connected to the wiring pattern and including a first portion within the first recess and a second portion on the first portion and protruding from a top surface of the passivation layer, a signal bump including a seed layer on the post, a lower bump on the seed layer, and an upper bump on the lower bump, and a heat transfer bump apart from the signal bump, electrically insulated from the wiring pattern, and including another seed layer on the passivation layer, another lower bump on the another seed layer, and another upper bump on the another lower bump may be provided.

Abstract: A battery management apparatus can include a measuring unit configured to measure a voltage and a current of a battery cell, a calculating unit configured to determine an operating period of the battery cell based on the current of the battery cell, and calculate a comparison value for the battery cell by normalizing the voltage of the battery cell, and a diagnosing unit configured to diagnose a state of the battery cell by comparing a comparison value of the battery cell with a reference value.

Abstract: A measurement apparatus for measuring a coating amount of a slurry according to the present disclosure includes a light emitter configured to irradiate terahertz wave onto a release paper coated with the slurry, a light receiver configured to receive the terahertz wave, which is irradiated from the light emitter and passes through the release paper coated with the slurry, to obtain a power of the terahertz wave, and a calculating part configured to calculate a thickness of an electrode, formed from the slurry applied to the release paper, based on the power of the terahertz wave received by the light receiver.

Abstract: A semiconductor chip includes a semiconductor substrate including a bump region and a non-bump region, a bump on the bump region, and a passivation layer on the bump region and the non-bump region of the semiconductor substrate. No bump is on the non-bump region. A thickness of the passivation layer in the bump region is thicker than a thickness of the passivation layer in the non-bump region. The passivation layer includes a step between the bump region and the non-bump region.

Abstract: A bevel etching apparatus includes a chuck plate that is configured to receive a substrate, a lower ring surrounding a circumference of the chuck plate, a cover plate on the chuck plate, and an upper ring surrounding a circumference of the cover plate. The lower ring includes a ring base and a protrusion that extends upwardly from an edge of the ring base and surrounds a lower portion of a sidewall of the substrate.

Abstract: A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.