Abstract: The present disclosure provides an electronic toll collection system (ETCS)-supporting integrated digital rear mirror device and an operating method thereof. According to an example embodiment, the digital rear mirror device may include a digital rear mirror module configured to provide a rear view of a vehicle within a single housing and an ETCS module for electronic toll collection for the vehicle. A substrate of the digital rear mirror module and a substrate of the ETCS module may be separately arranged rather than being stacked within the digital rear mirror device. According to another example embodiment, the ETCS module may transmit information received from an external device to the digital rear mirror module, and the digital rear mirror module may display the information while providing the rear view. Here, the information may include at least one of billing information, event information, traffic information, environmental information, and disaster situation information.

Abstract: A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.

Abstract: Provided are an ultra-high strength cold-rolled steel sheet whose microstructure has been controlled to have high strength and elongation, and a manufacturing method thereof. In accordance with an embodiment of the present disclosure, the ultra-high strength cold-rolled steel sheet includes: carbon (C): 0.28% to 0.45%; silicon (Si): 1.0% to 2.5%; manganese (Mn): 1.5% to 3.0%; aluminum (Al): 0.01% to 0.05%; chromium (Cr): greater than 0% and 1.0% or less; molybdenum (Mo): greater than 0% and 0.5% or less; a total of niobium (Nb), titanium (Ti) and vanadium (V): greater than 0% and 0.1% or less; phosphorus (P): greater than 0% and 0.03% or less; sulfur (S): greater than 0% and 0.03% or less; and nitrogen (N): greater than 0% and 0.

Abstract: The present invention relates to a sagger for firing a precursor material, and more specifically, to a sagger having a space internally provided to load a precursor material. When used to fire a precursor material, the sagger is capable of not only suppressing the generation of by-products but also enhancing the durability of the main body.

Abstract: A substrate supporting assembly includes a susceptor plate including at least one substrate seat, and a plurality of gas flow lines for supplying a lifting gas, an acceleration gas, and a deceleration gas to the substrate seat, and at least one satellite on the at least one substrate seat and including an upper surface, and a lower surface where a rotation pattern for receiving a rotational force and a braking force from the acceleration gas and the deceleration gas is provided. The at least one satellite is lifted from the at least one substrate seat by the lifting gas supplied from the at least one substrate seat, is rotated relative to the susceptor plate by the acceleration gas supplied in a forward direction of rotation, to rotate the substrate, and is decelerated or stopped by the deceleration gas supplied in a reverse direction of rotation.

Abstract: A semiconductor device comprises a substrate that including a frontside comprising an active region and a backside opposite to the frontside, an electronic element on the active region, a frontside wiring structure electrically connected to the electronic element on the frontside of the substrate, and a backside wiring structure electrically connected to the electronic element on the backside of the substrate. The backside wiring structure includes a plurality of backside wiring patterns sequentially stacked on the backside of the substrate, and a super via pattern that intersects and extends through at least one layer of the plurality of backside wiring patterns.

Abstract: Provided is a control device and a substrate processing apparatus including the same. The substrate processing apparatus includes a support unit configured to support and rotate a first substrate, the support unit including a spin chuck, a spray unit configured to spray a processing fluid on the first substrate, a correction unit on a swing arm and configured to irradiate a beam onto the first substrate when the processing fluid is provided on the first substrate, wherein the swing arm is adjacent to the spin chuck and is configured to move the correction unit to a target point on the first substrate, and a controller configured to control the spin chuck and the swing arm, and correct a position error of the swing arm using a second substrate, wherein a plurality of anchor patterns are on the second substrate.

Abstract: The present invention relates to an apparatus and method for interfacing an equipment behavior catalogue (EBC) framework with a machine learning (ML) framework, and the apparatus includes an EBC framework including an EBC storage and a set of equipment instance models, and an ML framework interfaced with the EBC framework and including a collection of tools and libraries that support development and learning of ML models.

Abstract: A suspension insulator includes a bracket section configured to be coupled to a vehicle body, an inner core positioned inside the bracket section, a bushing module surrounding the inner core and having a passage part which contains a fluid, an outer pipe surrounding the bushing module, and an upper section coupled to the bracket section and configured to cover the bushing module.

Abstract: An antenna package according to an exemplary embodiment includes an antenna unit, a printed circuit board including an antenna connection wiring electrically connected to the antenna unit, an antenna driving integrated circuit (IC) chip mounted on the printed circuit board and connected to the antenna connection wiring, and a touch sensor driving IC chip and a display driving IC chip mounted on the printed circuit board together with the antenna driving IC chip. The driving IC chips are integrated in a single printed circuit board to improve spatial and process efficiency.

Abstract: A control device and a substrate processing apparatus including the same are provided. The substrate processing apparatus includes: a support unit including a spin head and configured to support and to rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a correction unit in a swing arm, the correction unit configured to move to a target point on the substrate and to irradiate a beam when the processing liquid is sprayed onto the substrate; and a control unit configured to calculate the target point, wherein the control unit is configured to convert image coordinates associated with a first coordinate system and then to calculate the target point by converting the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and the second coordinate system is based on rotation angles of the spin head and the swing arm.

Abstract: An encoding apparatus and a decoding apparatus in a transform between a Modified Discrete Cosine Transform (MDCT)-based coder and a different coder are provided. The encoding apparatus may encode additional information to restore an input signal encoded according to the MIDCT-based coding scheme, when switching occurs between the MDCT-based coder and the different coder. Accordingly, an unnecessary bitstream may be prevented from being generated, and minimum additional information may be encoded.

Abstract: The present application relates to an antiviral composition comprising nucleoside analogues derived from a nucleotide, and a composition, a feed or a feed additive for enhancing immunity.

Abstract: Example embodiments include a battery insulation sheet having a structure in which a first substrate, an aerogel layer, and a second substrate are laminated, wherein opposite surfaces of the aerogel layer is in contact with the first substrate or the second substrate adjacent thereto. Example embodiments also include a method of manufacturing a battery insulation sheet, and a battery module including the battery insulation sheet.

Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion contains fluorine (F), and A1 and A2 satisfy A2>A1, where A1 is an average size of a dielectric grain included in the cover portion, and A2 is an average size of a dielectric grain included in the dielectric layer.

Abstract: A low-loss spiral coil includes a conducting wire wound N turns of which a width of each of wires corresponding to each of sections of the conducting wire is determined by setting an entire width of the conducting wire to be a width of M sections of the conducting wire, and then determining the width of each of the wires such that a resistance of the spiral coil formed based on the width of the M sections is minimized.

Abstract: A semiconductor package includes a first chip and a second chip disposed thereon. The first chip includes a first semiconductor substrate including first and second surfaces, a first circuit layer disposed on the first surface, a first interconnection layer disposed on the first circuit layer, the first interconnection layer including a landing pad, a second interconnection layer disposed on the second surface, and a first penetration via protruding from the second interconnection layer and penetrating the first semiconductor substrate. The second chip includes a second semiconductor substrate including third and fourth surfaces, the fourth surface being closer to the first chip than the third surface, a third interconnection layer disposed on the fourth surface, a second circuit layer disposed between the third interconnection layer and the fourth surface, and a second penetration via penetrating the second semiconductor substrate and connected to the landing pad.

Abstract: A method of processing an immersive video includes classifying view images into a basic image and an additional image, performing pruning with respect to view images by referring to a result of classification, generating atlases based on a result of pruning, generating a merged atlas by merging the atlases into one atlas, and generating configuration information of the merged atlas.

Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein the cover portion includes polydopamine.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber in which a process with respect to a substrate is performed, a susceptor which is installed in the chamber and on which the substrate is placed, a plurality of lift pins passing through the susceptor to support the substrate, and a plurality of protection plugs protruding from a bottom surface of the susceptor to surround a portion of each of the lift pins protruding from the bottom surface of the susceptor.