Abstract: There is provided a method for fabricating a substrate structure capable of enhancing process reproducibility and process stability by trimming a bevel region of a substrate using a wafer level process. The method includes providing a first substrate including first and second surfaces opposite each other and a first device region formed at the first surface, providing a second substrate including third and fourth surfaces opposite each other and a second device region at the third surface, bonding the first substrate and the second substrate to electrically connect the first device region and the second device region, and forming a trimmed substrate. The forming the trimmed substrate includes etching an edge region of the second substrate bonded to the first substrate.

Abstract: A method and a system for recognizing an input by using an index of a variable grid are disclosed. An input recognition method carried out by an electronic device implemented by a computer comprises the steps of: generating a virtual grid of which the distance between lines is variable, in correspondence with at least a partial region of a display included in or connected to the electronic device; and recognizing, by using an index of the virtual grid, a position selected by a user of the electronic device in the region of the display corresponding to the virtual grid.

Abstract: A wireless power receiving apparatus, according to an example embodiment, may include a receiving coil in which a first wire including a copper core and a second wire not including a copper core are wound around a same axis. The second wire may be located at a pitch of the first wire, and a diameter of the second wire may correspond to the pitch of the first wire.

Abstract: Provided are a polygon mirror assembly and a scan device. A polygon mirror assembly includes: a polygon mirror including a plurality of reflection surfaces spaced apart from a rotation axis by a predetermined distance; a first motor for rotating the polygon mirror around the rotation axis; a second motor for moving the polygon mirror in a first axial direction such that the rotation axis is tilted while the first motor rotates the polygon mirror; and a clock signal extraction surface for extracting a clock signal for detecting a change in a rotational speed of the first motor.

Abstract: Disclosed are a deep body spread microwave hyperthermia device for personal uses and an operation method thereof. The operating method may include generating a control signal to control patches attached to the skin of a user, dividing the control signal into a first signal and a second signal having a phase different from a phase of the first signal, transmitting the first signal and the second signal to patches attached to different positions, among the patches, and producing hyperthermia in a body of the user by radiating radio waves based on the first signal or the second signal received by each of the patches.

Abstract: Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.

Abstract: A semiconductor device and a method of manufacturing the same, the device including a through-hole electrode structure extending through a substrate; a redistribution layer on the through-hole electrode structure; and a conductive pad, the conductive pad including a penetrating portion extending through the redistribution layer; and a protrusion portion on the penetrating portion, the protrusion portion protruding from an upper surface of the redistribution layer, wherein a central region of an upper surface of the protrusion portion is flat and not closer to the substrate than an edge region of the upper surface of the protrusion portion.

Abstract: Disclosed are a robot cleaner, a refrigerator, a container transfer system, and a method of transferring and retrieving a container using the robot cleaner. The method of transferring a container include returning a robot cleaner to a position guide device installed at a refrigerator, mounting the robot cleaner on the position guide device, transferring, by the refrigerator, a container built in the refrigerator to mount the container on the robot cleaner, and moving the robot cleaner on which the container is mounted to a target position.

Abstract: A semiconductor chip includes a semiconductor substrate including a bump region and a non-bump region, a bump on the bump region, and a passivation layer on the bump region and the non-bump region of the semiconductor substrate. No bump is on the non-bump region. A thickness of the passivation layer in the bump region is thicker than a thickness of the passivation layer in the non-bump region. The passivation layer includes a step between the bump region and the non-bump region.

Abstract: An EV charging control apparatus may include a controller receiving a charging approval message for an EV from a charging management server, starting a charging to the EV in response to the charging approval message, measuring and accumulating an amount of energy charged to the EV, recognizing a charging termination operation from a user of the EV or the EV, and deriving charging information based on the amount of energy charged in response to the charging termination operation, and a short-range wireless communication module establishing a connection with a short-range wireless communication module mounted on the EV, and transmitting the charging information to the EV.

Abstract: A semiconductor device includes a first conductive pattern at an upper portion of a first insulating interlayer on a first substrate, a first plurality of conductive nanotubes (CNTs) extending vertically, a second conductive pattern at a lower portion of a second insulating interlayer beneath a second substrate, and a second plurality of CNTs extending vertically. A lower surface of the second insulating interlayer contacts an upper surface of the first insulating interlayer. At least a portion of a sidewall of each of the first plurality of CNTs is covered by the first conductive pattern, and at least a portion of a sidewall of each of the second plurality of CNTs is covered by the second conductive pattern. The first and second conductive patterns vertically face each other, and at least one of the first plurality of CNTs and at least one of the second plurality of CNTs contact each other.

Abstract: A semiconductor chip includes a semiconductor substrate including a bump region and a non-bump region, a bump on the bump region, and a passivation layer on the bump region and the non-bump region of the semiconductor substrate. No bump is on the non-bump region. A thickness of the passivation layer in the bump region is thicker than a thickness of the passivation layer in the non-bump region. The passivation layer includes a step between the bump region and the non-bump region.

Abstract: A method of manufacturing a substrate structure includes providing a first substrate including a first device region on a first surface, providing a second substrate including a second device region on a second surface, such that a width of the first device region is greater than a width of the second device region, and bonding the first substrate and the second substrate, such that the first and second device regions are facing each other and are electrically connected to each other.

Abstract: A receiver of a wireless power transmission system may include a capacitor-and-inductor configured to receive power from a transmitter using a resonance, at least one capacitor configured to connect to an output node of the receiver, and a plurality of switches configured to control current flow within the receiver. The plurality of switches may be controlled so that the capacitor-and-inductor may be disconnected from the at least one capacitor and the output node at preset periods. Current resonating in the capacitor-and-inductor may increase during disconnection between the at least one capacitor and the output node. The plurality of switches may output the increased current to the battery by connecting the capacitor-and-inductor to the capacitor and the output node after the period, connect at least one capacitor and the output node in series after the period, and operate to reduce root mean square (RMS) current within the receiver.

Abstract: Provided is a method and/or apparatus for providing a wireless location service using a beacon signal. A wireless location service method may include collecting a plurality of beacon signals from each of a plurality of beacon transceivers positioned around a user, and determining a current location of the user based on at least one of a virtual point and the plurality of beacon signals, the virtual point positioned in a space in which the beacon transceivers are provided.

Abstract: A semiconductor device includes a first conductive pattern at an upper portion of a first insulating interlayer on a first substrate, a first plurality of conductive nanotubes (CNTs) extending vertically, a second conductive pattern at a lower portion of a second insulating interlayer beneath a second substrate, and a second plurality of CNTs extending vertically. A lower surface of the second insulating interlayer contacts an upper surface of the first insulating interlayer. At least a portion of a sidewall of each of the first plurality of CNTs is covered by the first conductive pattern, and at least a portion of a sidewall of each of the second plurality of CNTs is covered by the second conductive pattern. The first and second conductive patterns vertically face each other, and at least one of the first plurality of CNTs and at least one of the second plurality of CNTs contact each other.

Abstract: A method and a system for providing integrated indoor and outdoor positioning are disclosed. The method for providing integrated positioning may comprise the steps of: receiving, by a user terminal, GPS coordinate information of the user terminal moving in an outdoor area around a building and an outdoor area within the building; and determining, by the user terminal, information on an area in which the user terminal is located and a floor on which the user terminal is located in the building, on the basis of GPS coordinate information mapped to each of the outdoor area around the building and the outdoor area within the building and the received GPS coordinate information.

Abstract: There is provided a method for fabricating a substrate structure capable of enhancing process reproducibility and process stability by trimming a bevel region of a substrate using a wafer level process. The method includes providing a first substrate including first and second surfaces opposite each other and a first device region formed at the first surface, providing a second substrate including third and fourth surfaces opposite each other and a second device region at the third surface, bonding the first substrate and the second substrate to electrically connect the first device region and the second device region, and forming a trimmed substrate. The forming the trimmed substrate includes etching an edge region of the second substrate bonded to the first substrate.

Abstract: A semiconductor device includes a conductive component on a substrate, a passivation layer on the substrate and including an opening that exposes at least a portion of the conductive component, and a pad structure in the opening and located on the passivation layer, the pad structure being electrically connected to the conductive component. The pad structure includes a lower conductive layer conformally extending on an inner sidewall of the opening, the lower conductive layer including a conductive barrier layer, a first seed layer, an etch stop layer, and a second seed layer that are sequentially stacked, a first pad layer on the lower conductive layer and at least partially filling the opening, and a second pad layer on the first pad layer and being in contact with a peripheral portion of the lower conductive layer located on the top surface of the passivation layer.

Abstract: A semiconductor device includes a conductive component on a substrate, a passivation layer on the substrate and including an opening that exposes at least a portion of the conductive component, and a pad structure in the opening and located on the passivation layer, the pad structure being electrically connected to the conductive component.